NCP5109A, NCP5109B
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4
MAXIMUM RATINGS
Rating Symbol Value Unit
V
CC
Main power supply voltage −0.3 to 20 V
V
CC_transient
Main transient power supply voltage:
IV
CC_max
= 5 mA during 10 ms
23 V
V
BRIDGE
VHV: High Voltage BRIDGE pin −1 to 200 V
V
BRIDGE
Allowable Negative Bridge Pin Voltage for IN_LO Signal Propagation to DRV_LO
(see characterization curves for detailed results)
−10 V
V
BOOT−
V
BRIDGE
VHV: Floating supply voltage −0.3 to 20 V
V
DRV_HI
VHV: High side output voltage V
BRIDGE
− 0.3 to
V
BOOT
+ 0.3
V
V
DRV_LO
Low side output voltage −0.3 to V
CC
+ 0.3 V
dV
BRIDGE
/dt Allowable output slew rate 50 V/ns
V
IN_XX
Inputs IN_HI, IN_LO −1.0 to V
CC
+ 0.3 V
ESD Capability:
− HBM model (all pins except pins 6−7−8 in 8 pins
package or 11−12−13 in 14 pins package)
− Machine model (all pins except pins 6−7−8 in 8 pins
package or 11−12−13 in 14 pins package)
2
200
kV
V
Latch up capability per JEDEC JESD78
R
q
JA
Power dissipation and Thermal characteristics
SO−8: Thermal Resistance, Junction−to−Air
DFN10 3x3: Thermal Resistance, Junction−to−Ambient 1 Oz Cu
DFN10 3x3: 50 mm
2
Printed Circuit Copper Clad
178
172
°C/W
T
ST
Storage Temperature Range −55 to +150 °C
T
J_max
Maximum Operating Junction Temperature +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
NCP5109A, NCP5109B
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5
ELECTRICAL CHARACTERISTIC (V
CC
= V
boot
= 15 V, V
GND
= V
bridge
, −40°C < T
J
< 125°C, Outputs loaded with 1 nF)
Rating Symbol
T
J
−40°C to 125°C
Unit
s
Min Typ Max
OUTPUT SECTION
Output high short circuit pulsed current V
DRV
= 0 V, PW v 10 ms (Note 1) I
DRVsource
250 mA
Output low short circuit pulsed current V
DRV
= V
CC
, PW v 10 ms (Note 1) I
DRVsink
500 mA
Output resistor (Typical value @ 25°C) Source R
OH
30 60 W
Output resistor (Typical value @ 25°C) Sink R
OL
10 20 W
High level output voltage, V
BIAS
−V
DRV_XX
@ I
DRV_XX
= 20 mA V
DRV_H
0.7 1.6 V
Low level output voltage V
DRV_XX
@ I
DRV_XX
= 20 mA V
DRV_L
0.2 0.6 V
DYNAMIC OUTPUT SECTION
Turn−on propagation delay (Vbridge = 0 V) t
ON
100 170 ns
Turn−off propagation delay (Vbridge = 0 V or 50 V) (Note 2) t
OFF
100 170 ns
Output voltage rise time (from 10% to 90% @ V
CC
= 15 V) with 1 nF load tr 85 160 ns
Output voltage fall time (from 90% to 10% @V
CC
= 15 V) with 1 nF load tf 35 75 ns
Propagation delay matching between the High side and the Low side @ 25°C (Note 3) Dt 20 35 ns
Internal fixed dead time (only valid for B version) (Note 4) DT 65 100 190 ns
Minimum input width that changes the output t
PW1
50 ns
Maximum input width that does not change the output SOIC−8
DFN10
t
PW2
20
15
ns
INPUT SECTION
Low level input voltage threshold V
IN
0.8 V
Input pull−down resistor (V
IN
< 0.5 V) R
IN
200 kW
High level input voltage threshold V
IN
2.3 V
Logic “1” input bias current @ V
IN_XX
= 5 V @ 25°C I
IN+
5 25 mA
Logic “0” input bias current @ V
IN_XX
= 0 V @ 25°C I
IN−
2.0 mA
SUPPLY SECTION
V
CC
UV Start−up voltage threshold V
CC
_stup 8.0 8.9 9.9 V
V
CC
UV Shut−down voltage threshold V
CC
_shtdwn 7.3 8.2 9.1 V
Hysteresis on V
CC
V
CC
_hyst 0.3 0.7 V
Vboot Start−up voltage threshold reference to bridge pin
(Vboot_stup = Vboot − Vbridge)
Vboot_stup 8.0 8.9 9.9 V
Vboot UV Shut−down voltage threshold Vboot_shtdwn 7.3 8.2 9.1 V
Hysteresis on Vboot Vboot_hyst 0.3 0.7 V
Leakage current on high voltage pins to GND
(V
BOOT
= V
BRIDGE
= DRV_HI = 200 V)
I
HV_LEAK
5 40 mA
Consumption in active mode (V
CC
= Vboot, fsw = 100 kHz and 1 nF load on both driver
outputs)
ICC1 4 5 mA
Consumption in inhibition mode (V
CC
= Vboot) ICC2 250 400 mA
V
CC
current consumption in inhibition mode ICC3 200 mA
Vboot current consumption in inhibition mode ICC4 50 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Parameter guaranteed by design.
2. Turn−off propagation delay @ Vbridge = 200 V is guaranteed by design.
3. See characterization curve for Dt parameters variation on the full range temperature.
4. Version B integrates a dead time in order to prevent any cross conduction between DRV_HI and DRV_LO. See timing diagram of Figure 10.
5. Timing diagram definition see: Figure 7, Figure 8 and Figure 9.
NCP5109A, NCP5109B
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6
Figure 5. Input/Output Timing Diagram (A Version)
IN_HI
IN_LO
DRV_HI
DRV_LO
IN_HI
IN_LO
DRV_HI
DRV_LO
Figure 6. Input/Output Timing Diagram (B Version)
Figure 7. Propagation Delay and Rise / Fall Time Definition
IN_HI
50%
90% 90%
10% 10%
(IN_LO)
DRV_HI
(DRV_LO)
50%
t
off
t
on
t
r
t
f

NCP5109BMNTWG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Gate Drivers HIGH VOLT MOSFET DRIVER O
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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