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HMC434SRJZ-EP-PT

P1-P3P4-P6P7-P7
HMC434-EP Enhanced Product
Rev. A | Page 4 of 7
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage (V
CC
) −0.3 V to +3.5 V
RF Input Power (V
CC
= 3 V)
13 dBm
Temperature
Operating −55°C to +105°C
Storage −65°C to +125°C
Junction, T
J
135°C
Nominal (T
A
= 105°C) 119°C
Reflow 260°C
ESD Sensitivity
Human Body Model (HBM) Class 0
Stresse
s at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θ
JC
is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
1
θ
JC
2
Unit
RJ-6 359 70 °C/W
1
Simulated values per JEDEC JESD51-12 standards.
2
Junction to GND package pin.
ESD CAUTION
Enhanced Product HMC434-EP
Rev. A | Page 5 of 7
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 4 NIC Not Internally Connected. These pins can be connected to RF and dc ground without affecting performance.
The NIC pins are typically tied to GND for enhanced thermal performance (but not required).
2 GND Ground. This pin must be connected to both RF and dc ground.
3 IN RF Input. This pin must be dc blocked.
5
VCC
6
OUT
INTERFACE SCHEMATICS
Figure 3. GND Interface Schematic
Figure 4. IN Interface Schematic
Figure 5. OUT Interface Schematic
Figure 6. VCC Interface Schematic
NIC
1
GND
2
IN
3
OUT
6
VCC
5
NIC
4
HMC434-EP
TOP VIEW
(Not to Scale)
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS CAN
BE CONNECTED TO RF AND DC GROUND WITHOUT
AFFECTING PERFORMANCE. THE NIC PINS ARE
TYPICALLY TIED TO GND FOR ENHANCED
THERMAL PERFORMANCE (BUT NOT REQUIRED).
15647-002
GND
15647-003
50Ω
VCC
IN
15647-004
50Ω
OUT
VCC
15647-005
8pF
VCC
15647-006
HMC434-EP Enhanced Product
Rev. A | Page 6 of 7
TYPICAL PERFORMANCE CHARACTERISTICS
In Figure 9, P
FEEDTHROUGH
is the power of the output spectrum at the input frequency.
Figure 7. Input Sensitivity Window
Figure 8. Output Power vs. Frequency at Various Temperatures
Figure 9. Output Harmonic Content (P
IN
= 0 dBm)
Figure 10. Input Sensitivity Window at Various Temperatures
Figure 11. SSB Phase Noise (P
IN
= 0 dBm)
Figure 12. Reverse Leakage (P
IN
= 0 dBm)
20
–20
–15
–10
–5
0
5
10
15
0 1 2 3 4 5 6 7 8 9 10
INPUT POWER (dBm)
INPUT FREQUENCY (GHz)
MIN P
IN
MAX P
IN
RECOMMENDED
OPERATING WINDOW
15647-007
0
–5
–4
–3
–2
–1
0 1 2 3 4 5 6 7 8 9
OUTPUT POWER (dBm)
INPUT FREQUENCY (GHz)
T
A
= –40°C
T
A
= –55°C
T
A
= 0°C
T
A
= +25°C
T
A
= +85°C
T
A
= +105°C
15647-008
0
–60
–55
–50
–45
–40
–35
–30
–25
–20
–15
–10
–5
0 1 2 3 4 5 6 7 8 9 10
OUTPUT POWER (dBc)
INPUT FREQUENCY (GHz)
THIRD HARMONIC
SECOND HARMONIC
P
FEEDTHROUGH
15647-009
20
–20
–15
–10
–5
0
5
10
15
0 1 2 3 4 5 6 7 8 9
INPUT POWER (dBm)
INPUT FREQUENCY (GHz)
15647-010
MAX P
IN
, T
A
= –40°C
MAX P
IN
, T
A
= –55°C
MAX P
IN
, T
A
= 0°C
MAX P
IN
, T
A
= +25°C
MAX P
IN
, T
A
= +85°C
MAX P
IN
, T
A
= +105°C
MIN P
IN
, T
A
= –40°C
MIN P
IN
, T
A
= –55°C
MIN P
IN
, T
A
= 0°C
MIN P
IN
, T
A
= +25°C
MIN P
IN
, T
A
= +85°C
MIN P
IN
, T
A
= +105°C
0
–170
–160
–150
–140
–130
–120
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
100 1M 10M 100M 1G 10G
SSB PHASE NOISE (dBc/Hz)
OFFSET FREQUENCY (Hz)
15647-011
0
–50
–45
–30
–35
–30
–25
–20
–15
–10
–5
0 1 2 3 4 5 6 7 8 9 10
POWER LEVEL (dBm)
INPUT FREQUENCY (GHz)
15647-012
P1-P3P4-P6P7-P7

HMC434SRJZ-EP-PT

Mfr. #:
Buy HMC434SRJZ-EP-PT
Manufacturer:
Analog Devices / Hittite
Description:
Prescaler EP InGaP HBT Divide-by-8
Lifecycle:
New from this manufacturer.
Delivery:
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