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TCN75-3.3MUA
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P20
2001-2012 Microchip Technology Inc.
DS21490D-page 13
TCN75
Timi
ng Diagrams (Cont
inued)
1
1
Start
by
Master
Ack
by
TCN75
Address Byte
(d) T
ypical Pointer Set Followed by Immediate Read from Configuration Register
Ack
by
TCN75
Repeat
Start
by
Master
Pointer Byte
Ack
by
TCN75
Stop
Cond
by
Maste
r
No Ack
by
Master
Address Byte
00
000
0
0
D0
D7
D6
D5
D4
D3
D2
D1
D0
10
0
A2
1
A1
A0
1
A2
A1
A0
R/W
00
1
91
99
19
R/W
Data Byte
1
1
Start
by
Master
Ack
by
TCN75
Address Byte
(f) T
OS
and T
HYST
Write
Ack
by
TCN75
Pointer Byte
Ack
by
TCN75
Stop
Cond
by
Master
Ack
by
TCN75
Most Significant Data Byte
00
000
0
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D6
D5
D4
D2
D3
D1
D0
1
A2
A1
A0
R/W
00
1
91
99
19
D7
Least Significant Data Byte
1
1
Start
by
Master
Ack
by
TCN75T
Address Byte
(e) Configuration Register Write
Ack
by
TCN75
Pointer Byte
Ack
by
TCN75
Stop
Cond
by
Master
Configuration Byte
00
000
0
D1
D0
0
00
D4
D2
D3
D1
D0
1
A2
A1
A0
R/W
00
1
91
99
TCN75
DS21490D-page 14
2001-2012 Microchip Technology Inc.
6.0
P
ACKAGING IN
FORMATION
6.1
Packa
ge Marking Inf
ormation
Packa
ge ma
rkin
g data no
t avai
labl
e at th
is ti
me.
6.2
T
aping Form
Component T
aping Orientation for 8-Pin MSOP Devices
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
Carrier T
ape, Number of Components Per Reel and Reel Size
Pin 1
User Direction of Feed
Standard Reel Component Orientation
for 713 Suffix Device
W
P
Component T
aping Orientation for 8-Pin SOIC (Narrow) Devices
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
Carrier T
ape, Number of Components Per Reel and Reel Size
Standard Reel Component Orientation
for 713 Suffix Device
Pin1
User Direction of Feed
P
W
2001-2012 Microchip Technology Inc.
DS21490D-page 15
TCN75
6.3
Package Di
mensions
8-Pin MSOP
.122 (3.10)
.1
14 (2.90)
.122 (3.10)
.1
14 (2.90)
.043 (1.10)
Max.
.006
(0.15)
.002 (0.05)
.016 (0.40)
.010 (0.25)
.197 (5.00)
.189 (4.80)
.008 (0.20)
.005 (0.13)
.028 (0.70)
.016 (0.40)
6° Max.
.026 (0.65) T
yp.
Pin 1
Dimensions: inches (mm)
Note:
For
the mo
st curr
ent pac
kage dr
awing
s, ple
ase se
e the Mi
croc
hip Pa
ckagi
ng S
p
eci
ficat
ion loca
ted
at ht
tp:/
/www
.mic
roch
ip.co
m/packa
ging
.050 (1.27) T
yp.
8
°
Max.
Pin 1
.244 (6.20)
.228 (5.79)
.157 (3.99)
.150 (3.81)
.197 (5.00)
.189 (4.80)
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
.050 (1.27)
.016 (0.40)
8-Pin SOIC
Dimensions: inches (mm)
Note:
For
the mo
st curr
ent pac
kage dr
awing
s, ple
ase se
e the Mi
croc
hip Pa
ckagi
ng S
p
eci
ficat
ion loca
ted
at ht
tp:/
/www
.mic
roch
ip.co
m/packa
ging
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P20
TCN75-3.3MUA
Mfr. #:
Buy TCN75-3.3MUA
Manufacturer:
Description:
SENSOR DIGITAL -55C-125C 8MSOP
Lifecycle:
New from this manufacturer.
Delivery:
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