NXP Semiconductors
NCR100-8L
SCR
NCR100-8L All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 8 April 2015 6 / 13
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-sp)
thermal resistance
from junction to solder
point
Fig. 6 - - 23 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
Device mounted on an FR4 PCB,
single-sided copper, tin-plated,
mounting pad for anode 6 sq cm.
- 105 - K/W
aaa-017092
1
10
2
10
-1
10
Z
th(j-sp)
(K/W)
10
-2
t
p
(s)
10
-5
1 1010
-1
10
-2
10
-4
10
-3
t
p
t
p
T
P
t
T
d =
Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse duration
NXP Semiconductors
NCR100-8L
SCR
NCR100-8L All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 8 April 2015 7 / 13
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
I
GT
gate trigger current V
D
= 12 V; I
T
= 10 mA; T
j
= 25 °C;
Fig. 7
15 - 50 µA
I
L
latching current V
D
= 12 V; I
G
= 0.5 mA; R
GK
= 1 kΩ;
T
j
= 25 °C; Fig. 8
- - 6 mA
I
H
holding current V
D
= 12 V; R
GK
= 1 kΩ; T
j
= 25 °C;
Fig. 9
- - 3 mA
V
T
on-state voltage I
T
= 1.2 A; T
j
= 25 °C; Fig. 10 - 1.25 1.7 V
V
D
= 12 V; I
T
= 10 mA; T
j
= 25 °C;
Fig. 11
- 0.5 0.8 VV
GT
gate trigger voltage
V
D
= 400 V; I
T
= 10 mA; T
j
= 125 °C;
Fig. 11
0.3 0.5 - V
I
D
off-state current V
D
= 600 V; T
j
= 125 °C; R
GK
= 1 kΩ - 0.05 0.1 mA
I
R
reverse current V
R
= 600 V; T
j
= 125 °C; R
GK
= 1 kΩ - 0.05 0.1 mA
Dynamic characteristics
dV
D
/dt rate of rise of off-state
voltage
V
DM
= 402 V; T
j
= 125 °C; R
GK
= 1 kΩ;
exponential waveform; (V
DM
= 67% of
V
DRM
)
100 - - V/µs
t
gt
gate-controlled turn-on
time
I
TM
= 0.8 A; V
D
= 600 V; I
G
= 10 mA;
dI
G
/dt = 0.1 A/µs; T
j
= 25 °C
- 2 - µs
t
q
commutated turn-off
time
V
DM
= 402 V; T
j
= 125 °C; I
TM
= 0.8 A;
V
R
= 35 V; (dI
T
/dt)
M
= 30 A/µs; dV
D
/
dt = 2 V/µs; R
GK
= 1 kΩ
- 100 - µs
NXP Semiconductors
NCR100-8L
SCR
NCR100-8L All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 8 April 2015 8 / 13
T
j
(°C)
-50 1501000 50
aaa-017168
1
2
3
0
I
GT
I
GT(25°C)
Fig. 7. Normalized gate trigger current as a function of
junction temperature
Fig. 8. Normalized latching current as a function of
junction temperature
T
j
(°C)
-50 1501000 50
aaa-017170
1
2
3
0
I
H
I
H(25°C)
Fig. 9. Normalized holding current as a function of
junction temperature
V
o
= 1.173 V; R
s
= 0.216 Ω
(1) T
j
= 125 °C; typical values
(2) T
j
= 25 °C; maximum values
(3) T
j
= 125 °C; maximum values
Fig. 10. On-state current as a function of on-state
voltage

NCR100-8LR

Mfr. #:
Manufacturer:
WeEn Semiconductors
Description:
NCR100-8L/TO-236AB/REEL 7" Q3
Lifecycle:
New from this manufacturer.
Delivery:
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