PMV48XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 21 December 2010 6 of 15
NXP Semiconductors
PMV48XP
20 V, 3.5 A P-channel Trench MOSFET
7. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source
breakdown voltage
I
D
=-25A; V
GS
=0V; T
j
=25°C -20--V
V
GSth
gate-source threshold
voltage
I
D
=-25A; V
DS
=V
GS
; T
j
= 25 °C -0.75 -1 -1.25 V
I
DSS
drain leakage current V
DS
=-20V; V
GS
=0V; T
amb
=25°C ---1µA
I
GSS
gate leakage current V
GS
=-12V; V
DS
=0V; T
j
= 25 °C - - -100 nA
R
DSon
drain-source on-state
resistance
V
GS
=-4.5V; I
D
= -2.4 A; pulsed;
t
p
300 µs; δ≤0.01 ; T
j
=2C
- 4855m
V
GS
=-4.5V; I
D
= -2.4 A; pulsed;
t
p
300 µs; δ≤0.01 ; T
j
= 150 °C
- 7080m
V
GS
=-2.5V; I
D
= -2 A; pulsed;
t
p
300 µs; δ≤0.01 ; T
j
=2C
- 7181m
g
fs
forward
transconductance
V
DS
=-12V; I
D
= -2 A; pulsed;
t
p
300 µs; δ≤0.01 ; T
j
=2C
-12-S
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=-1A; V
DS
=-10V; V
GS
=-4.5V;
T
j
=2C
-8.511nC
Q
GS
gate-source charge - 1.8 - nC
Q
GD
gate-drain charge - 1.8 - nC
C
iss
input capacitance V
GS
=0V; V
DS
= -10 V; f = 1 MHz;
T
j
=2C
- 1000 - pF
C
oss
output capacitance - 130 - pF
C
rss
reverse transfer
capacitance
-90-pF
t
d(on)
turn-on delay time V
DS
=-10V; V
GS
=-4.5V; R
G(ext)
=6;
T
j
=2C; I
D
=-1A
-11-ns
t
r
rise time - 13 - ns
t
d(off)
turn-off delay time - 61 - ns
t
f
fall time - 23 - ns
Source-drain diode
V
SD
source-drain voltage I
S
=-2.4A; V
GS
=0V; T
j
=2C;
t
p
300 µs; δ≤0.01
- -0.82 -1.2 V
PMV48XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 21 December 2010 7 of 15
NXP Semiconductors
PMV48XP
20 V, 3.5 A P-channel Trench MOSFET
T
j
= 25 °C T
j
= 25 °C; V
DS
= -3 V
(1) minimum values
(2) typical values
(3) maximum values
Fig 6. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 7. Sub-threshold drain current as a function of
gate-source voltage
T
j
= 25 °C
(1) V
GS
= -1.8 V
(2) V
GS
= -2.0 V
(3) V
GS
= -2.25 V
(4) V
GS
= -3.0 V
(5) V
GS
= -4.5 V
I
D
= -2.4 A
(1) T
j
= 125 °C
(2) T
j
= 25 °C
Fig 8. Drain-source on-state resistance as a function
of drain current; typical values
Fig 9. Drain-source on-state resistance as a function
of gate-source voltage; typical values
V
DS
(V)
0 542 31
017aaa128
14
I
D
(A)
10
6
2
0
4
8
12
3 V
V
GS
= 4.5 V
2.25 V
2 V
1.8 V
017aaa129
V
GS
(V)
0.0 1.51.00.5
10
4
10
5
10
3
I
D
(A)
10
6
(2)(1)
(3)
017aaa130
I
D
(A)
0.0 12.08.04.0
0.08
0.12
0.04
0.16
0.20
R
DSon
(Ω)
0.00
(2)
(1)
(3)
(5)
(4)
V
GS
(V)
0 542 31
017aaa131
0.10
0.15
0.05
0.20
0.25
R
DSon
(Ω)
0.00
(2)
(1)
PMV48XP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 21 December 2010 8 of 15
NXP Semiconductors
PMV48XP
20 V, 3.5 A P-channel Trench MOSFET
V
DS
> I
D
× R
DSon
(1) T
j
= 25 °C
(2) T
j
= 150 °C
Fig 10. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 11. Normalized drain-source on-state resistance as
a function of junction temperature; typical
values
I
D
= -0.25 mA; V
DS
= V
GS
(1) maximum values
(2) typical values
(3) minimum values
f = 1 MHz; V
GS
= 0 V
(1) C
iss
(2) C
oss
(3) C
rss
Fig 12. Gate-source threshold voltage as a function of
junction temperature
Fig 13. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
V
GS
(V)
0.0 3.02.01.0
017aaa132
14
I
D
(A)
0
2
4
6
8
10
12
(1) (2)
(1)
(2)
T
j
(°C)
60 180120060
017aaa133
1.0
0.5
1.5
2.0
a
0.0
T
j
(°C)
60 180120060
017aaa134
0.8
0.4
1.2
1.6
V
GS(th)
(V)
0.0
(1)
(2)
(3)
V
DS
(V)
10
1
10
2
101
017aaa135
10
3
10
2
10
4
C
(pF)
10
(2)
(1)
(3)

PMV48XP,215

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET P-CH -20 V -3.5 A
Lifecycle:
New from this manufacturer.
Delivery:
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