LTC2471/LTC2473
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Figure 10. Start a New Conversion without Reading Old Conversion Result
Figure 8. Consecutive Reading
Figure 9. I
2
C State Diagram
SLEEP SLEEP
S PR ACK READ READ
DATA OUTPUT
CONVERSION CONVERSION
24713 F08
S R PACK
CONVERSIONDATA OUTPUT
7-BIT ADDRESS
(0010100 OR 1010100)
7-BIT ADDRESS
(0010100 OR 1010100)
24713 F09
7-BIT ADDRESS:
0010100 OR 1010100
WRITE INPUT
CONFIGURATION
(FIGURE 7)
FOR CYCLE N
I
2
C START
R/W
BIT LOW
WRITE INPUT
CONFIGURATION
(FIGURE 7)
I
2
C STOP CONVERT
CONVERSION
FINISHED
ACK
ACK
ACK
NAK
I
2
C (REPEAT) START
R/W
BIT LOW
7-BIT ADDRESS:
0010100 OR 1010100
I
2
C START
R/W
BIT HIGH
READ DATA FROM
CYCLE N-1
I
2
C STOP CONVERT
CONVERSION
FINISHED
7-BIT ADDRESS:
0010100 OR 1010100
SLEEP
S PR ACK READ (OPTIONAL)
DATA OUTPUT CONVERSIONCONVERSION
24713 F10
7-BIT ADDRESS
(0010100 OR 1010100)
OPERATION SEQUENCE
Continuous Read
Conversions from the LTC2471/LTC2473 can be continu
-
ously read, see Figure 8. The R/W is 1 for a read. At the
end of a read operation, a new conversion automatically
begins. At the conclusion of the conversion cycle, the next
result may be read using the method described above. If
the conversion cycle is not complete and a valid address
selects the device, the LTC2471/LTC2473 generate a NACK
signal indicating the conversion cycle is in progress. See
Figure 9 for an example state diagram.
Discarding a Conversion Result and Initiating a New
Conversion
It is possible to start a new conversion without reading
the old result, as shown in Figure 10. Following a valid
7-bit address, a read request (R/W) bit, and a valid ACK,
a STOP command will start a new conversion.
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PRESERVING THE CONVERTER ACCURACY
The LTC2471/LTC2473 are designed to minimize the conver
-
sion result’s sensitivity to device decoupling, PCB layout,
anti-aliasing circuits, line and frequency perturbations.
Nevertheless, in order to preserve the high accuracy capa-
bility of this part, some simple precautions are desirable.
Digital Signal Levels
Due to the nature of CMOS logic, it is advisable to keep input
digital signals near GND or V
CC
. Voltages in the range of
0.5V to V
CC
– 0.5V may result in additional current leakage
from the part. Undershoot and overshoot should also be
minimized, particularly while the chip is converting. It is
thus beneficial to keep edge rates of about 10ns and limit
overshoot and undershoot to less than 0.3V.
Driving V
CC
and GND
In relation to the V
CC
and GND pins, the LTC2471/LTC2473
combines internal high frequency decoupling with damping
elements, which reduce the ADC performance sensitivity
to PCB layout and external components. Nevertheless,
the very high accuracy of this converter is best pre
-
served by careful low and high frequency power supply
decoupling.
A 0.1µF, high quality, ceramic capacitor in parallel with
a 10µF low ESR ceramic capacitor should be connected
between the V
CC
and GND pins, as close as possible to the
package. The 0.1µF capacitor should be placed closest to
the ADC package. It is also desirable to avoid any via in the
circuit path, starting from the converter V
CC
pin, passing
through these two decoupling capacitors, and returning
to the converter GND pin. The area encompassed by this
circuit path, as well as the path length, should be minimized.
As shown in Figure 11, REF
is used as the negative
reference voltage input to the ADC. This pin can be tied
directly to ground or Kelvin sensed to sensor ground. In
the case where REF
is used as a sense input, it should
be bypassed to ground with a 0.1μF ceramic capacitor in
parallel with a 10μF low ESR ceramic capacitor.
Very low impedance ground and power planes, and star
connections at both V
CC
and GND pins, are preferable. The
V
CC
pin should have two distinct connections: the first to
the decoupling capacitors described above, and the second
to the ground return for the power supply voltage source.
REFOUT and COMP
The on chip 1.25V reference is internally tied to the con
-
verters reference input and is output to the REFOUT pin.
A 0.1μF capacitor should be placed on the REFOUT pin.
It is possible to reduce this capacitor, but the transition
noise increases (see Figure 4). A 0.1μF capacitor should
also be placed on the COMP pin. This pin is tied to an
internal point in the reference and is used for stability.
In order for the reference to remain stable, the capacitor
placed on the COMP pin must be greater than or equal
to the capacitor tied to the REFOUT pin. The REFOUT pin
cannot be overridden by an external voltage.
Depending on the size of the capacitors tied to the REFOUT
and COMP pins, the internal reference has a corresponding
start up time. This start up time is typically 12ms when
0.1μF capacitors are used. The first conversion following
power up can be discarded using the data abort com
-
Figure 11. LTC2471/LTC2473 Analog Input/Reference
Equivalent Circuit
R
SW
15k
(TYP)
I
LEAK
I
LEAK
V
CC
V
CC
V
CC
V
CC
C
EQ
0.35pF
(TYP)
IN
+
(LTC2473)
IN
(LTC2473)
IN
(LTC2471)
REF
REFOUT
INTERNAL
REFERENCE
24713 F11
R
SW
15k
(TYP)
I
LEAK
I
LEAK
R
SW
15k
(TYP)
I
LEAK
I
LEAK
R
SW
15k
(TYP)
I
LEAK
I
LEAK
LTC2471/LTC2473
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mand or simply read and ignored. Depending on the value
chosen for C
COMP
and C
REFOUT
, the reference startup can
take more than one conversion period, see Figure 3. If the
startup time is less than 1.2ms (833sps output rate) or
4.8ms (208sps output rate) then conversions following
the first period are accurate to the device specifications.
If the startup time exceeds 1.2ms or 4.8ms then the user
can wait the appropriate time or use the fixed conversion
period as a startup timer by ignoring results within the
unsettled period. Once the reference has settled all sub
-
sequent conversion results are valid. If the user places the
device into the sleep mode (SLP = 1, reference powered
down) the reference will require a startup time proportional
to the value of C
COMP
and C
REFOUT
, see Figure 3.
If the reference is put to sleep (program SLP = 1 and CS =
1) the reference is powered down after the next conversion.
This last conversion result is valid. On CS falling edge,
the reference is powered back up. In order to ensure the
reference output has settled before the next conversion,
the power up time can be extended by delaying the data
read after the falling edge of CS. Once all 16 bits are read
from the device or CS is brought HIGH, the next conver
-
sion automatically begins. In the default operation, the
reference remains powered up at the conclusion of the
conversion cycle.
Driving V
IN
+
and V
IN
The input drive requirements can best be analyzed using
the equivalent circuit of Figure 12. The input signal V
SIG
is
connected to the ADC input pins (IN
+
and IN
) through an
equivalent source resistance R
S
. This resistor includes both
the actual generator source resistance and any additional
optional resistors connected to the input pins. Optional
input capacitors C
IN
are also connected to the ADC input
pins. This capacitor is placed in parallel with the input
parasitic capacitance C
PAR
. This parasitic capacitance
includes elements from the printed circuit board (PCB)
and the associated input pin of the ADC. Depending on the
PCB layout, C
PAR
has typical values between 2pF and 15pF.
In addition, the equivalent circuit of Figure 12 includes the
converter equivalent internal resistor R
SW
and sampling
capacitor C
EQ
.
There are some immediate trade-offs in R
S
and C
IN
without
needing a full circuit analysis. Increasing R
S
and C
IN
can
give the following benefits:
1) Due to the LTC2471/LTC2473’s input sampling algo
-
rithm, the input current drawn by either IN
+
or IN
over
a conversion cycle is typically 50nA. A high R
S
• C
IN
attenuates the high frequency components of the input
current, and R
S
values up to 1k result in <1LSB error.
2) The bandwidth from V
SIG
is reduced at the input pins
(IN
+
, IN
or IN). This bandwidth reduction isolates the
ADC from high frequency signals, and as such provides
simple anti-aliasing and input noise reduction.
3) Switching transients generated by the ADC are attenu
-
ated before they go back to the signal source.
4) A large C
IN
gives a better AC ground at the input pins,
helping reduce reflections back to the signal source.
5) Increasing R
S
protects the ADC by limiting the current
during an outside-the-rails fault condition.
There is a limit to how large R
S
• C
IN
should be for a given
application. Increasing R
S
beyond a given point increases
Figure 12. LTC2471/LTC2473 Input Drive Equivalent Circuit
I
LEAK
I
LEAK
R
SW
15k
(TYP)
I
CONV
C
IN
IN
+
(LTC2473)
IN
(LTC2471)
V
CC
SIG
+
SIG
R
S
C
EQ
0.35pF
(TYP)
C
PAR
+
24713 F12
I
LEAK
I
LEAK
R
SW
15k
(TYP)
I
CONV
C
IN
IN
(LTC2473)
V
CC
R
S
C
EQ
0.35pF
(TYP)
C
PAR
+

LTC2471IMS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC Selectable 208Hz/833Hz, Single-Ended, 16-Bit delta sigma ADC with 10ppm/deg C Max Reference and I2C Interface
Lifecycle:
New from this manufacturer.
Delivery:
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