BGA3012 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 26 September 2013 8 of 15
NXP Semiconductors
BGA3012
1 GHz 12 dB gain wideband amplifier MMIC
8.1.2 Forward application circuit board layout
PCB (Printed-Circuit Board) material = FR4; thickness = 1.5 mm; size = 40 mm 40 mm;
r
= 4.6; thickness of copper
layer = 35 m;
Components are listed in Table 11
.
Fig 2. BGA3012 application circuit board layout
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Table 11. List of components
See Figure 1
and Figure 2.
Component Description Value Size Remarks
C1, C2, C3, C4 capacitor 10 nF SMD 0402 Murata GRM155R71E103KA01D or capacitor of same quality
C5 capacitor 100 pF SMD 0402 Murata GRM1555C1H101JZ01D or capacitor of same quality
J1, J2 F-connector 75 - Bomar 861V509ER6 or F-connector of same quality
J3 header 3-way - - Molex 90121-0763 or header of the same quality
L1, L3 inductor 3.9 nH SMD 0402 Murata LQG15HS3N9S02D or inductor of same quality
L2 choke - SMD 0603 Murata BLM18HD182SN1D or choke of same quality
L4 inductor 880 nH SMD 1206 Murata LQH31HNR88K03L or inductor of same quality
R1 resistor 100 SMD 0402 Yageo RC0402FR-07100RL or resistor of same quality
R2 resistor 300 SMD 0402 Yageo RC0402FR-07300RL or resistor of same quality
U1 BGA3012 - - NXP
