Characteristics BAT30
4/14 Doc ID 12564 Rev 3
Figure 5. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 6. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-923)
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
SOT-666
(s)t
P
Z
th(j-a)
R
th(j-a)
Epoxy printed board FR4
Coppr thickness = 35 µm
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+0
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD-923
(s)t
P
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
SOD-523
Z
th(j-a)
R
th(j-a)
(s)t
P
Epoxy printed board FR4
Coppr thickness = 35 µm
0
100
200
300
400
500
600
700
800
900
.
.2
.4
.
.
1.
1.2 1.4 1.
1.
2.
Epoxy printed board FR4
Copper thichness = 35 µm
S
CU
(cm²)
R
th(j-a)
(°C/W)
Figure 9. Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
Figure 10. Leakage current versus reverse
applied voltage (typical values)
200
300
400
500
600
0 5 10 15 20 25 30 35 40 45 50
R
th(j-a)
(°C/W)
S
CU
(mm²)
Epoxy printed board FR4
Copper thichness = 35 µm
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 5 10 15 20 25 30
T
j
=150°C
T
j
=25°C
T
j
=85°C
T
j
=125°C
V
R
(V)
I
R
(µA)
