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MC74AC74NG

P1-P3P4-P6P7-P9P10-P10
MC74AC74, MC74ACT74
www.onsemi.com
7
AC OPERATING REQUIREMENTS
Symbol Parameter
V
CC
*
(V)
74ACT 74ACT
Unit
Fig.
No.
T
A
= +25°C
C
L
= 50 pF
T
A
= −40°C
to +85°C
C
L
= 50 pF
Typ Guaranteed Minimum
t
s
Set-up Time, HIGH or LOW
5.0 1.0 3.0 3.5 ns 3−9
D
n
to CP
n
t
h
Hold Time, HIGH or LOW
5.0 −0.5 1.0 1.0 ns 3−9
D
n
to CP
n
t
w
C
Pn
or C
Dn
or S
Dn
5.0 3.0 5.0 6.0 ns 3−6
Pulse Width
t
rec
Recovery TIme
5.0 −2.5 0 0 ns 3−9
C
Dn
or S
Dn
to CP
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter
Value
Typ
Unit Test Conditions
C
IN
Input Capacitance 4.5 pF V
CC
= 5.0 V
C
PD
Power Dissipation Capacitance 35 pF V
CC
= 5.0 V
ORDERING INFORMATION
Device Package Shipping
†
MC74AC74DG SOIC−14
(Pb−Free)
55 Units/Rail
MC74AC74DR2G SOIC−14
(Pb−Free)
2500/Tape & Reel
MC74AC74DTR2G TSSOP−14
(Pb−Free)
2500/Tape & Reel
MC74ACT74DG SOIC−14
(Pb−Free)
55 Units/Rail
MC74ACT74DR2G SOIC−14
(Pb−Free)
2500/Tape & Reel
MC74ACT74DTR2G TSSOP−14
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74AC74, MC74ACT74
www.onsemi.com
8
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14
8
71
M
0.25 B
M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B
S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
A 1.35 1.75 0.054 0.068
b 0.35 0.49 0.014 0.019
L 0.40 1.25 0.016 0.049
e 1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M 0 7 0 7
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC74, MC74ACT74
www.onsemi.com
9
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
−U−
SEATING
PLANE
0.10 (0.004)
−T−
SECTION N−N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P9P10-P10

MC74AC74NG

Mfr. #:
Buy MC74AC74NG
Manufacturer:
ON Semiconductor
Description:
IC FF D-TYPE DUAL 1BIT 14DIP
Lifecycle:
New from this manufacturer.
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