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AT29BV010A
0519DFLASH05/02
and valid data will be read. Examining the toggle bit may begin at any time during a pro-
gram cycle.
OPTIONAL CHIP ERASE MODES: The entire device may be erased by using a
6-byte software code. Please see Software Chip Erase application note for details.
BOOT BLOCK PROGRAMMING LOCKOUT: The AT29BV010A has two designated
memory blocks that have a programming lockout feature. This feature prevents pro-
gramming of data in the designated block once the feature has been enabled. Each of
these blocks consists of 8K bytes; the programming lockout feature can be set indepen-
dently for either block. While the lockout feature does not have to be activated, it can be
activated for either or both blocks.
These two 8K memory sections are referred to as
boot blocks
. Secure code which will
bring up a system can be contained in a boot block. The AT29BV010A blocks are
located in the first 8K bytes of memory and the last 8K bytes of memory. The boot block
programming lockout feature can therefore support systems that boot from the lower
addresses of memory or the higher addresses. Once the programming lockout feature
has been activated, the data in that block can no longer be erased or programmed; data
in other memory locations can still be changed through the regular programming meth-
ods. To activate the lockout feature, a series of seven program commands to specific
addresses with specific data must be performed. Please see Boot Block Lockout Fea-
ture Enable Algorithm.
If the boot block lockout feature has been activated on either block, the chip erase func-
tion will be disabled.
BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine
whether programming of either boot block section is locked out. See Software Product
Identification Entry and Exit sections. When the device is in the software product identifi-
cation mode, a read from location 00002H will show if programming the lower address
boot block is locked out while reading location 1FFF2H will do so for the upper boot
block. If the data is FE, the corresponding block can be programmed; if the data is FF,
the program lockout feature has been activated and the corresponding block cannot be
programmed. The software product identification exit mode should be used to return to
standard operation.
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°Cto+125°C
*NOTICE: Stresses beyond those listed under Absolute
Maximum Ratingsmay cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65°Cto+150°C
All Input Voltages (including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V
CC
+0.6V
Voltage on A9 (including NC Pins)
with Respect to Ground ...................................-0.6V to +13.5V
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AT29BV010A
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Note: 1. After power is applied and V
CC
is at the minimum specified data sheet value, the system should wait 20 ms before an oper-
ational mode is started.
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
3. VH = 12.0V ± 0.5V.
4. Manufacturer Code is 1F. The Device Code is 35.
5. See details under Software Product Identification Entry/Exit
.
DC and AC Operating Range
AT29BV010A-12 AT29BV010A-15 AT29BV010A-20 AT29BV010A-25 AT29BV010A-30
Operating
Temperature (Case)
Com. 0°C-70°C0°C-70°C
0°C-70°C 0°C-70°C 0°C-70°C
Ind. -40°C-85°C-40°C-85°C
-40°C-85°C -40°C-85°C
V
CC
Power Supply
(1)
2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V
2.
Not recommended for New Designs.
Operating Modes
Mode CE OE WE Ai I/O
Read V
IL
V
IL
V
IH
Ai D
OUT
Program
(2)
V
IL
V
IH
V
IL
Ai D
IN
Standby/Write Inhibit V
IH
X
(1)
XXHighZ
Program Inhibit X X V
IH
Program Inhibit X V
IL
X
Output Disable X V
IH
XHighZ
Product Identification
Hardware
V
IL
V
IL
V
IH
A1 - A16 = V
IL
,A9=V
H
(3)
,A0=V
IL
Manufacturer Code
(4)
A1 - A16 = V
IL
,A9=V
H
(3)
,A0=V
IH
Device Code
(4)
Software
(5)
A0 = V
IL,
A1 - A16 = V
IL
Manufacturer Code
(4)
A0 = V
IH,
A1 - A16 = V
IL
Device Code
(4)
DC Characteristics
Symbol Parameter Condition Min Max Units
I
LO
Output Leakage Current V
I/O
=0VtoV
CC
A
I
SB1
V
CC
Standby Current CMOS CE =V
CC
-0.3VtoV
CC
Com. 40 µA
Ind. 50 µA
I
SB2
V
CC
Standby Current TTL CE =2.0VtoV
CC
1mA
I
CC
V
CC
Active Current f = 5 MHz; I
OUT
=0mA;V
CC
=3.6V 15 mA
V
IL
Input Low Voltage 0.6 V
V
IH
Input High Voltage 2.0 V
V
OL
Output Low Voltage I
OL
=1.6mA;V
CC
=3.0V 0.45 V
V
OH
Output High Voltage I
OH
=-10A;V
CC
=3.0V 2.4 V
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AT29BV010A
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AC Read Waveforms
Notes: 1. CE may be delayed up to t
ACC
-t
CE
after the address transition without impact on t
ACC
.
2. OE
may be delayed up to t
CE
-t
OE
after the falling edge of CE without impact on t
CE
or by t
ACC
-t
OE
after an address change
without impact on t
ACC
.
3. t
DF
is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
AC Read Characteristics
Symbol Parameter
AT29BV010A-12 AT29BV010A-15
AT29BV010A-20 AT29BV010A-25 AT29BV010A-30
UnitsMin Max Min Max
Min Max Min Max Min Max
t
ACC
Address to Output Delay
120 150 200 250 300 ns
t
CE
(1)
CE to Output Delay
120 150 200 250 300 ns
t
OE
(2)
OE to Output Delay
05001000 100 0 120 0 150 ns
t
DF
(3)(4)
CE or OE to Output
Float
0300500 50 0 60 0 75 ns
t
OH
Output Hold from OE,
CE or Address,
whichever occurred first
000 0 0 ns
Note:
Not recommended for New Designs.

AT29BV010A-12JC

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
NOR Flash 1M (128K X 8) 2.7V- 120NS COM TEMP
Lifecycle:
New from this manufacturer.
Delivery:
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