FCPF600N65S3R0L

© Semiconductor Components Industries, LLC, 2017
May, 2018 Rev. 3
1 Publication Order Number:
FCPF600N65S3R0L/D
FCPF600N65S3R0L
Power MOSFET, N-Channel,
SUPERFET
)
III, Easy Drive,
650 V, 6 A, 600 mW
Description
SUPERFET III MOSFET is ON Semiconductors brandnew high
voltage superjunction (SJ) MOSFET family that is utilizing charge
balance technology for outstanding low onresistance and lower gate
charge performance. This advanced technology is tailored to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate. Consequently, SUPERFET III MOSFET
Easy drive series helps manage EMI issues and allows for easier
design implementation.
Features
700 V @ T
J
= 150°C
Typ. R
DS(on)
= 474 mW
Ultra Low Gate Charge (Typ. Q
g
= 11 nC)
Low Effective Output Capacitance (Typ. C
oss(eff.)
= 127 pF)
100% Avalanche Tested
These Devices are PbFree and are RoHS Compliant
Applications
Computing / Display Power Supplies
Telecom / Server Power Supply
Industrial Power Supplies
Lighting / Charger / Adapter
TO220F
CASE 340BF
See detailed ordering and shipping information on page 2 of
this data sheet.
ORDERING INFORMATION
www.onsemi.com
D
S
G
V
DSS
R
DS(ON)
MAX I
D
MAX
650 V
600 mW @ 10 V
6 A
N-Channel MOSFET
$Y = ON Semiconductor Logo
&Z = Assembly Plant Code
&3 = Numeric Date Code
&K = Lot Code
FCPF600N65S3R0 = Specific Device Code
$Y&Z&3&K
FCPF600
N65S3R0
MARKING DIAGRAM
G
D
S
FCPF600N65S3R0L
www.onsemi.com
2
ABSOLUTE MAXIMUM RATINGS (T
C
= 25°C, Unless otherwise specified)
Symbol
Parameter Value Unit
V
DSS
Drain to Source Voltage 650 V
V
GSS
Gate to Source Voltage
DC ±30 V
AC (f > 1 Hz) ±30 V
I
D
Drain Current
Continuous (T
C
= 25°C) 6*
A
Continuous (T
C
= 100°C) 3.8*
I
DM
Drain Current Pulsed (Note 1) 15* A
E
AS
Single Pulsed Avalanche Energy (Note 2) 24 mJ
I
AS
Avalanche Current (Note 2) 1.6 A
E
AR
Repetitive Avalanche Energy (Note 1) 0.24 mJ
dv/dt
MOSFET dv/dt 100
V/ns
Peak Diode Recovery dv/dt (Note 3) 20
P
D
Power Dissipation
(T
C
= 25°C) 24 W
Derate Above 25°C 0.19 W/°C
T
J
, T
STG
Operating and Storage Temperature Range 55 to +150 °C
T
L
Maximum Lead Temperature for Soldering, 1/8 from Case for 5 s 300 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
*Drain current limited by maximum junction temperature
.
1. Repetitive rating: pulse-width limited by maximum junction temperature.
2. I
AS
= 1.6 A, R
G
= 25 W, starting T
J
= 25°C.
3. I
SD
3 A, di/dt 200 A/ms, V
DD
400 V, starting T
J
= 25°C.
THERMAL CHARACTERISTICS
Symbol Parameter FCPF600N65S3R0L Unit
R
q
JC
Thermal Resistance, Junction to Case, Max. 5.29
_C/W
R
q
JA
Thermal Resistance, Junction to Ambient, Max. 62.5
PACKAGE MARKING AND ORDERING INFORMATION
Part Number Top Marking Package Packing Method Reel Size Tape Width Quantity
FCPF600N65S3R0L FCPF600N65S3R0 TO220F Tube N/A N/A 50 Units
FCPF600N65S3R0L
www.onsemi.com
3
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted)
Symbol
Parameter Test Conditions Min Typ Max Unit
OFF CHARACTERISTICS
BV
DSS
Drain to Source Breakdown Voltage
V
GS
=0V, I
D
= 1 mA, T
J
=25_C
650 V
V
GS
=0V, I
D
= 1 mA, T
J
= 150_C
700 V
DBV
DSS
/DT
J
Breakdown Voltage Temperature
Coefficient
I
D
= 1 mA, Referenced to 25_C
0.66
V/_C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 650 V, V
GS
=0V 1 mA
V
DS
= 520 V, T
C
= 125_C
0.3
I
GSS
Gate to Body Leakage Current V
GS
= ±30 V, V
DS
=0V ±100 nA
ON CHARACTERISTICS
V
GS(th)
Gate Threshold Voltage V
GS
=V
DS
, I
D
= 0.6 mA 2.5 4.5 V
R
DS(on)
Static Drain to Source On Resistance V
GS
=10V, I
D
=3A 474 600
mW
g
FS
Forward Transconductance V
DS
=20V, I
D
=3A 3.6 S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
V
DS
= 400 V, V
GS
= 0 V, f = 1 MHz
465 pF
C
oss
Output Capacitance 10 pF
C
oss(eff.)
Effective Output Capacitance V
DS
= 0 V to 400 V, V
GS
=0V 127 pF
C
oss(er.)
Energy Related Output Capacitance V
DS
= 0 V to 400 V, V
GS
=0V 17 pF
Q
g(tot)
Total Gate Charge at 10V
V
DS
= 400 V, I
D
= 3 A, V
GS
=10V
(Note 4)
11 nC
Q
gs
Gate to Source Gate Charge 3 nC
Q
gd
Gate to Drain “Miller” Charge 4.9 nC
ESR Equivalent Series Resistance f = 1 MHz 0.9
W
SWITCHING CHARACTERISTICS
t
d(on)
Turn-On Delay Time
V
DD
= 400 V, I
D
=3A,
V
GS
=10V, R
g
= 4.7 W
(Note 4)
11 ns
t
r
Turn-On Rise Time 9 ns
t
d(off)
Turn-Off Delay Time 29 ns
t
f
Turn-Off Fall Time 14 ns
SOURCE-DRAIN DIODE CHARACTERISTICS
I
S
Maximum Continuous Source to Drain Diode Forward Current 6 A
I
SM
Maximum Pulsed Source to Drain Diode Forward Current 15 A
V
SD
Source to Drain Diode Forward
Voltage
V
GS
=0V, I
SD
=3A 1.2 V
t
rr
Reverse Recovery Time
V
GS
=0V, I
SD
= 3 A,
dI
F
/dt = 100 A/ms
198 ns
Q
rr
Reverse Recovery Charge 1.6
mC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Essentially independent of operating temperature typical characteristics.

FCPF600N65S3R0L

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET SUPERFET3 650V 6A 600 mOhm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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