FCPF600N65S3R0L

FCPF600N65S3R0L
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4
0.1
1
10
20
55
o
C
150
o
C
*Notes:
1. V
DS
= 20V
2. 250
ms Pulse Test
25
o
C
I
D
, Drain Current[A]
V
GS
, GateSource Voltage[V]
0.2 1 10
0.01
0.1
1
10
30
*Notes:
1. 250
ms Pulse Test
2. T
C
= 25
o
C
I
D
, Drain Current[A]
V
DS
, DrainSource Voltage[V]
V
GS
= 10.0V
8.0V
7.0V
6.5V
6.0V
5.5V
0.0 0.5 1.0 1.5
0.001
0.01
0.1
1
10
100
*Notes:
1. V
GS
= 0V
2. 250
ms Pulse Test
150
o
C
I
S
, Reverse Drain Current [A]
V
SD
, Body Diode Forward Voltage [V]
25
o
C
55
o
C
036912
0.0
0.4
0.8
1.2
*Note: T
C
= 25
o
C
V
GS
= 20V
V
GS
= 10V
R
DS(ON)
,
DrainSource OnResistance [
W]
I
D
, Drain Current [A]
0.1 1 10 100 1000
0.1
1
10
100
1000
10000
C
oss
C
iss
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
*Note:
1. V
GS
= 0V
2. f = 1MHz
C
rss
Capacitances [pF]
V
DS
, DrainSource Voltage [V]
036912
0
2
4
6
8
10
V
DS
= 400V
V
DS
= 130V
*Note: I
D
= 3A
V
GS
, GateSource Voltage [V]
Q
g
, Total Gate Charge [nC]
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
Figure 3. OnResistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current and
Temperature
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
TYPICAL PERFORMANCE CHARACTERISTICS
345 67 89
FCPF600N65S3R0L
www.onsemi.com
5
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
0.8
0.9
1.0
1.1
1.2
*Notes:
1. V
GS
= 0V
2. I
D
= 10mA
BV
DSS
, [Normalized]
DrainSource Breakdown Voltage
T
J
, Junction Temperature [
o
C]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
*Notes:
1. V
GS
= 10V
2. I
D
= 3A
R
DS(on)
, [Normalized]
DrainSource OnResistance
T
J
, Junction Temperature [
o
C]
C
2. T C
3. Single Pulse
25 50 75 100 125 150
0
2
4
6
8
I
D
, Drain Current [A]
T
C
, Case Temperature [
o
C]
0
0.5
1.0
1.5
2.0
2.5
3.0
E
OSS
[mJ]
V
DS
, Drain to Source Voltage [V]
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. OnResistance Variation vs.
Temperature
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs.
Case Temperature
Figure 11. Eoss vs. Drain to Source
Voltage
50
1
0
0 50 100 150 50 0 50 100 150
0.01
0.1
1
10
30
30ms
100ms
1ms
10ms
I
D
, Drain Current [A]
V
DS
, DrainSource Voltage [V]
Operation in This Area
is Limited by R
DS(on)
*Notes:
1. T
C
= 25
o
J
= 150
o
DC
C
2. T
C
3. Single Pulse
10 100 1000
130 260 390 520 650
FCPF600N65S3R0L
www.onsemi.com
6
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Figure 12. Transient Thermal Response Curve
10
5
10
4
10
3
10
2
10
1
10
0
10
1
10
2
0.001
0.01
0.1
1
2
SINGLE PULSE
DUTY CYCLEDESCENDING ORDER
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
t, RECTANGULAR PULSE DURATION (sec)
D = 0.5
0.2
0.1
0.05
0.02
0.01
NOTES:
Z
qJC
(t) = r(t) x R
qJC
R
qJC
= 5.29
o
C/W
Duty Cycle, D = t
1
/ t
2
Peak T
J
= P
DM
x Z
qJC
(t) + T
C
P
DM
t
1
t
2

FCPF600N65S3R0L

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET SUPERFET3 650V 6A 600 mOhm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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