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MC74LVX257MELG

P1-P3P4-P6P7-P8
MC74LVX257
http://onsemi.com
4
DC CHARACTERISTICS (Voltages Referenced to GND)
V
CC
T
A
= 25°C −40°C ≤ T
A
≤ 85°C
Symbol Parameter Condition (V) Min Typ Max Min Max Unit
V
IH
Minimum High−Level
Input Voltage
2.0
3.0
3.6
0.75 V
CC
0.7 V
CC
0.7 V
CC
0.75 V
CC
0.7 V
CC
0.7 V
CC
V
V
IL
Maximum Low−Level
Input Voltage
2.0
3.0
3.6
0.25 V
CC
0.3 V
CC
0.3 V
CC
0.25 V
CC
0.3 V
CC
0.3 V
CC
V
V
OH
High−Level Output
Voltage
I
OH
= −50 A
I
OH
= −50 A
I
OH
= −4 mA
2.0
3.0
3.0
1.9
2.9
2.58
2.0
3.0
1.9
2.9
2.48
V
V
OL
Low−Level Output
Voltage
I
OL
= 50 A
I
OL
= 50 A
I
OL
= 4 mA
2.0
3.0
3.0
0.0
0.0
0.1
0.1
0.36
0.1
0.1
0.44
V
I
OZ
Maximum 3−State
Leakage Current
V
IN
= V
IH
or V
IL
V
OUT
= V
CC
or GND
3.6 ±0.1 ±1.0 A
I
IN
Input Leakage Current V
IN
= 5.5 V or GND 0 to 3.6 ±0.1 ±1.0 A
I
CC
Maximum Quiescent
Supply Current
(per package)
V
IN
= V
CC
or GND 3.6 1.0 1.0 2.0 40 A
AC ELECTRICAL CHARACTERISTICS Input t
r
= t
f
= 3.0 ns
T
A
= 25°C −40°C ≤ T
A
≤ 85°C
Symbol Parameter Test Conditions
Min Typ Max Min Max
Unit
t
PLH
,
t
PHL
Maximum Propagation
Delay, A or B to Y
V
CC
= 2.7 V C
L
= 15pF
C
L
= 50pF
6.5
9.5
10.0
14.0
1.0
1.0
15.0
18.5
ns
V
CC
= 3.3 V ± 0.3 V C
L
= 15pF
C
L
= 50pF
4.5
7.5
8.0
12.0
1.0
1.0
10.0
13.5
t
PLH
,
t
PHL
Maximum Propagation
Delay, S to Y
V
CC
= 2.7 V C
L
= 15pF
C
L
= 50pF
8.0
10.5
12.0
15.5
1.0
1.0
17.0
20.0
ns
V
CC
= 3.3 V ± 0.3 V C
L
= 15pF
C
L
= 50pF
6.0
8.5
10.0
13.5
1.0
1.0
12.0
15.5
t
PZL
,
t
PZH
Maximum Output
Enable, Time, OE
to Y
V
CC
= 2.7 V C
L
= 15pF
R
L
= 1 k C
L
= 50pF
7.5
10.5
11.5
15.0
1.0
1.0
16.5
18.0
ns
V
CC
= 3.3 V ± 0.3 V C
L
= 15pF
R
L
= 1 k C
L
= 50pF
5.5
8.5
9.5
13.0
1.0
1.0
11.5
15.0
t
PLZ
,
t
PHZ
Maximum Output
Disable, Time, OE
to Y
V
CC
= 2.7 C
L
= 50pF
R
L
= 1 k
13.0 17.0 1.0 18.0
ns
V
CC
= 3.3 V ± 0.3 V C
L
= 50pF
R
L
= 1 k
12 17.0 1.0 18.0
C
IN
Maximum Input
Capacitance
4 10 10 pF
Typical @ 25°C, V
CC
= 3.3 V
C
PD
Power Dissipation Capacitance (Note 5)
20
pF
5. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC
.
MC74LVX257
http://onsemi.com
5
NOISE CHARACTERISTICS Input t
r
= t
f
= 3.0 ns, C
L
= 50 pF, V
CC
= 3.3 V
T
A
= 25°C
Symbol Characteristic
Typ Max
Unit
V
OLP
Quiet Output Maximum Dynamic V
OL
0.3 0.5 V
V
OLV
Quiet Output Minimum Dynamic V
OL
−0.3 −0.5 V
V
IHD
Minimum High Level Dynamic Input Voltage 2.0 V
V
ILD
Maximum Low Level Dynamic Input Voltage 0.8 V
A, B or S
Figure 4. Switching Waveform Figure 5. Switching Waveform
Figure 6. Test Circuit
V
CC
GND
Y
t
PHL
t
PLH
50%
50% V
CC
Figure 7. Test Circuit
INPUT
*Includes all probe and jig capacitance
OUTPUT
TEST POINT
C
L
*
1 k
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH.
DEVICE
UNDER
TEST
Figure 8. Input Equivalent Circuit
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
50%
50% V
CC
50% V
CC
V
CC
GND
HIGH
IMPEDANCE
V
OL
+ 0.3V
V
OH
− 0.3V
Y
Y
OE
t
PZL
t
PLZ
t
PZH
t
PHZ
HIGH
IMPEDANCE
MC74LVX257
http://onsemi.com
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

SOIC−16
D SUFFIX
CASE 751B−05
ISSUE J
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.

SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
P1-P3P4-P6P7-P8

MC74LVX257MELG

Mfr. #:
Buy MC74LVX257MELG
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers 2-3.6V Quad 3-State 2-Channel
Lifecycle:
New from this manufacturer.
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