IRG8CH106K10F

IRG8CH106K10F
V
CES
= 1200V
I
C(Nominal)
= 110A
T
J(max)
= 175°C
V
CE(on)
typ
= 1.7V @ I
C
= 110A
Applications
Industrial Motor Drives
UPS
HEV Inverter
Welding
E
C
G
n-channel
Base part number Package Type
Standard Pack
Form Quantity
IRG8CH106K10F Die on Film Wafer 1 IRG8CH106K10F
Orderable part number
Mechanical Parameter
Die Size 7.5 x 14.1 mm
2
Minimum Street Width 95 µm
Emitter Pad Size See Die Drawing
mm
2
Gate Pad Size 1.2 x 1.2
Area Total / Active 106 / 75
Thickness 140 µm
Wafer Size 200 mm
Notch Position 0 Degrees
Maximum-Possible Chips per Wafer 245 pcs.
Passivation Front side Silicon Nitride, Polyimide
Front Metal Al, Si (5.6µm)
Backside Metal AI, Ti , Ni, Ag
Die Bond Electrically conductive epoxy or solder
Reject Ink Dot Size 0.25 mm diameter minimum
G C E
Gate Collector Emitter
INSULATED GATE BIPOLAR TRANSISTOR
Features Benefits
Low V
CE(on)
Trench IGBT Technology High Efficiency in a Wide Range of Applications
Low Switching Losses Suitable for a Wide Range of Switching Frequencies
Very Soft Turn-off Characteristics
Reduced EMI and Overvoltage in Motor Drive Applications
10µs Short Circuit SOA
Rugged Transient Performance for Increased Reliability
Square RBSOA
Tight Parameter Distribution
Excellent Current Sharing in Parallel Operation
Positive V
CE(on)
Temperature Coefficient
Tj(max) = 175°C
Increased Reliability
1
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IRG8CH106K10F
2
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Static Characteristics (Tested on wafers) @ T
J
=25°C
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
Collector-to-Emitter Breakdown Voltage 1200 ––– –––
V
V
GE
= 0V, I
C
= 250µA
V
CE(sat)
Collector-to-Emitter Saturated Voltage ––– ––– 2.0 V
GE
= 15V, I
C
= 110A, T
J
= 25°C
V
GE(th)
Gate-Emitter Threshold Voltage 5.0 ––– 6.5 I
C
= 4.0mA , V
GE
= V
CE
I
CES
Zero Gate Voltage Collector Current ––– 1.0 35 µA V
CE
= 1200V, V
GE
= 0V
I
GES
Gate Emitter Leakage Current ––– ––– ±600 nA V
CE
= 0V, V
GE
= ±30V
R
G INTERNAL
Internal Gate Resistance 1.6 2.0 2.4

Electrical Characteristics (Not subject to production test- Verified by design/characterization)
Parameter Min. Typ. Max. Units Conditions
V
CE(sat)
Collector-to-Emitter Saturated Voltage ––– 1.7 –––
V
V
GE
= 15V, I
C
= 110A , T
J
= 25°C 
––– 2.1 ––– V
GE
= 15V, I
C
= 110A , T
J
= 175°C
SCSOA Short Circuit Safe Operating Area 10 ––– –––
µs
V
GE
= 15V, V
CC
= 600V
V
P
1200V,T
J
= 150°C
RBSOA Reverse Bias Safe Operating Area
T
J
= 175°C, I
C
= 330A

V
CC
= 960V, Vp 1200V
V
GE
= +20V to 0V
C
iss
Input Capacitance ––– 11550 –––
pF
V
GE
= 0V
C
oss
Output Capacitance ––– 450 –––
V
CE
= 30V
C
rss
Reverse Transfer Capacitance ––– 340 –––
ƒ = 1.0MHz
Q
g
Total Gate Charge (turn-on) 700
nC
I
C
= 110A
Q
ge
Gate-to-Emitter Charge (turn-on) 40
V
GE
= 15V
Q
gc
Gate-to-Collector Charge (turn-on) 410
V
CC
= 600V
Switching Characteristics (Inductive Load-Not subject to production test-Verified by design/characterization)
Parameter Min. Typ. Max. Units Conditions 
t
d(on)
Turn-On delay time 80
ns
I
C
= 110A, V
CC
= 600V
t
r
Rise time 30
R
G
= 1.0, V
GE
= 15V
t
d(off)
Turn-Off delay time 380
T
J
= 25°C
t
f
Fall time 110
t
d(on)
Turn-On delay time 80 I
C
= 110A, V
CC
= 600V
t
r
Rise time 30
R
G
= 1.0, V
GE
= 15V
t
d(off)
Turn-Off delay time 470
T
J
= 150°C
t
f
Fall time 310
FULL SQUARE
Parameter Max. Units
V
CE
Collector-Emitter Voltage, T
J
=25°C 1200 V
I
C
DC Collector Current

A
I
LM
Clamped Inductive Load Current  330 A
V
GE
Gate Emitter Voltage ± 30 V
T
J
, T
STG
Operating Junction and Storage Temperature -40 to +175 °C
Maximum Ratings
Notes:
The current in the application is limited by T
JMax
and the thermal properties of the assembly.
V
CC
= 80% (V
CES
), V
GE
= 20V.
Refer to AN-1086 for guidelines for measuring V
(BR)CES
safely.
Actual test limits take into account additional losses in the measurement setup.
Pulse width 400µs; duty cycle 2%.
Values influenced by parasitic L and C in measurement.
IRG8CH106K10F
3
www.irf.com © 2015 International Rectifier
Submit Datasheet Feedback June 4, 2015
Die Drawing
4. DIE THICKNESS = 140 MICRO-METER
2. CONTROLLING DIMENSION: MICRO-METER
1. ALL DIMENSIONS ARE SHOWN IN MICRO-METER
NOTES:
3. DIE WIDTH AND LENGTH TOLERANCE: -50µm

IRG8CH106K10F

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
IGBT 1200V 110A DIE
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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