IRG8CH106K10F

IRG8CH106K10F
4
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Submit Datasheet Feedback June 4, 2015
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Additional Testing and Screening
For Customers requiring product supplied as Known Good Die (KGD) or requiring specific die level testing, please
contact your local IR Sales
Shipping
Sawn Wafer on Film. Please contact your local IR sales office for non-standard shipping options
Handling
Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work
environments are as defined in MIL-HDBK-263.
Product must be handled only in a class 10,000 or better-designated clean room environment.
Singulated die are not to be handled with tweezers. A vacuum wand with a non-metallic ESD protected tip
should be used.
Wafer/Die Storage
Proper storage conditions are necessary to prevent product contamination and/or degradation after shipment.
Note: To reduce the risk of contamination or degradation, it is recommended that product not being used in the
assembly process be returned to their original containers and resealed with a vacuum seal process.
Sawn wafers on a film frame are intended for immediate use and have a limited shelf life.
Further Information
For further information please contact your local IR Sales office.
Revision History
Date Comments
06/04/2015
 Updated IFX logo on page 1 & 4.

IRG8CH106K10F

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
IGBT 1200V 110A DIE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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