RT8271
10
DS8271-02 March 2011www.richtek.com
Ferrite core material saturates hard, which means that
inductance collapses abruptly when the peak design
current is exceeded. The previous situation results in an
abrupt increase in inductor ripple current and consequent
output voltage ripple.
Do not allow the core to saturate!
Different core materials and shapes will change the size/
current and price/current relationship of an inductor.
Toroid or shielded pot cores in ferrite or permalloy materials
are small and do not radiate energy. However, they are
usually more expensive than the similar powdered iron
inductors. The rule for inductor choice mainly depends
on the price vs. size requirement and any radiated field/
EMI requirements.
Diode Selection
When the power switch turns off, the path for the current
is through the diode connected between the switch output
and ground. This forward biased diode must have a
minimum voltage drop and recovery times. Schottky diode
is recommended and it should be able to handle those
current. The reverse voltage rating of the diode should be
greater than the maximum input voltage, and current rating
should be greater than the maximum load current. For
more detail please refer to Table 4.
C
IN
and C
OUT
Selection
The input capacitance, C
IN,
is needed to filter the
trapezoidal current at the source of the high side MOSFET.
To prevent large ripple current, a low ESR input capacitor
sized for the maximum RMS current should be used. The
RMS current is given by :
This formula has a maximum at V
IN
= 2V
OUT
, where
I
RMS
= I
OUT
/2. This simple worst-case condition is
commonly used for design because even significant
deviations do not offer much relief.
Choose a capacitor rated at a higher temperature than
required. Several capacitors may also be paralleled to
meet size or height requirements in the design.
For the input capacitor, a 10μF low ESR ceramic capacitor
is recommended. For the recommended capacitor, please
refer to table 3 for more detail.
The selection of C
OUT
is determined by the required ESR
to minimize voltage ripple.
Moreover, the amount of bulk capacitance is also a key
for C
OUT
selection to ensure that the control loop is stable.
Loop stability can be checked by viewing the load transient
response as described in a later section.
The output ripple, ΔV
OUT
, is determined by :
The output ripple will be highest at the maximum input
voltage since ΔI
L
increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet the
ESR and RMS current handling requirement. Dry tantalum,
special polymer, aluminum electrolytic and ceramic
capacitors are all available in surface mount packages.
Special polymer capacitors offer very low ESR value.
However, it provides lower capacitance density than other
types. Although Tantalum capacitors have the highest
capacitance density, it is important to only use types that
pass the surge test for use in switching power supplies.
Aluminum electrolytic capacitors have significantly higher
ESR. However, it can be used in cost-sensitive applications
for ripple current rating and long term reliability
considerations. Ceramic capacitors have excellent low
ESR characteristics but can have a high voltage coefficient
and audible piezoelectric effects. The high Q of ceramic
capacitors with trace inductance can also lead to significant
ringing.
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. However, care must
be taken when these capacitors are used at input and
output. When a ceramic capacitor is used at the input
and the power is supplied by a wall adapter through long
wires, a load step at the output can induce ringing at the
input, V
IN
. At best, this ringing can couple to the output
and be mistaken as loop instability. At worst, a sudden
inrush of current through the long wires can potentially
cause a voltage spike at V
IN
large enough to damage the
part.
OUT
IN
RMS OUT(MAX)
IN OUT
V
V
I = I 1
VV
OUT L
OUT
1
VIESR
8fC
⎡⎤
Δ≤Δ +
⎢⎥
⎣⎦
RT8271
11
DS8271-02 March 2011 www.richtek.com
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, V
OUT
immediately shifts by an amount
equal to ΔI
LOAD
(ESR) also begins to charge or discharge
C
OUT
generating a feedback error signal for the regulator
to return V
OUT
to its steady-state value. During this recovery
time, V
OUT
can be monitored for overshoot or ringing that
would indicate a stability problem.
Thermal Considerations
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
P
D(MAX)
= ( T
J(MAX)
- T
A
) / θ
JA
Where T
J(MAX)
is the maximum operation junction
temperature, T
A
is the ambient temperature and the θ
JA
is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT8271, the maximum junction temperature is 125°C. The
junction to ambient thermal resistance θ
JA
for MSOP-10
(Exposed Pad) package is 86°C/W and for SOP-8 is
120°C/W on the standard JEDEC 51-7 four-layers thermal
test board. The maximum power dissipation at T
A
= 25°C
can be calculated by following formula :
P
D(MAX)
= (125°C 25°C) / (86°C/W) = 1.163W for
MSOP-10 (Exposed Pad)
P
D(MAX)
= (125°C 25°C) / (120°C/W) = 0.833W for
SOP-8
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal
resistance θ
JA
. For RT8271 packages, the Figure 3 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
dissipation allowed.
Layout Consideration
Follow the PCB layout guidelines for optimal performance
of the RT8271.
` Keep the traces of the main current paths as short and
wide as possible.
` Put the input capacitor as close as possible to the device
pins (VIN and GND).
` LX node is with high frequency voltage swing and should
be kept at small area. Keep sensitive components away
from the LX node to prevent stray capacitive noise pick-
up.
` Place the feedback components to the FB pin as close
as possible.
` The GND and Exposed Pad should be connected to a
strong ground plane for heat sinking and noise protection.
Figure 3. Derating Curves for RT8271 Packages
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0255075100125
Ambient Temperature (°C)
Power Dissipation (W)
Four Layer PCB
MSOP-10 (Exposed Pad)SOP-8
RT8271
12
DS8271-02 March 2011www.richtek.com
Figure 4. PCB Layout Guide for MSOP-10 (Exposed Pad)
V
IN
V
OUT
GND
C
IN
CB
SS
BOOT
VIN
GND
SW
FB
EN
COMP
GND
C
S
C
P
C
C
R
C
SW
D1
V
OUT
C
OUT
L1
Input capacitor must
be placed as close
to the IC as possible.
The output capacitor
must be placed near
the RT8271.
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
The resistor divider must be connected
as close to the device as possible.
The parallel distance between
COMP and FB traces must be
as short as possible.
2
3
4
5
6
7
8
Figure 5. PCB Layout Guide for SOP-8
SS
FB
NC
VIN
NC
EN
COMP
SW
GND
BOOT
5
6
7
8
4
3
2
10
9
GND
11
C
SS
V
OUT
R1
R2
R
C
C
C
C
P
SW
C
BOOT
C
IN
D1
C
OUT
L1
V
OUT
GND
Input capacitor must
be placed as close
to the IC as possible.
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
The feedback components
must be connected as close
to the device as possible.
V
IN

RT8271GFP

Mfr. #:
Manufacturer:
Description:
IC REG BUCK ADJ 2A 10MSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet