RT8271
15
DS8271-02 March 2011 www.richtek.com
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
Richtek Technology Corporation
Headquarter
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Richtek Technology Corporation
Taipei Office (Marketing)
5F, No. 95, Minchiuan Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com
L
A2
A
b
A1
D
E1
E
e
EXPOSED THERMAL PAD
(Bottom of Package)
U
V
10-Lead MSOP (Exposed Pad) Plastic Package
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 0.810 1.100 0.032 0.043
A1 0.000 0.100 0.000 0.004
A2 0.750 0.950 0.030 0.037
b 0.170 0.270 0.007 0.011
D 2.900 3.100 0.114 0.122
e 0.500 0.020
E 4.800 5.000 0.189 0.197
E1 2.900 3.100 0.114 0.122
L 0.400 0.800
0.016 0.031
U 1.300 1.700
0.051 0.067
V 1.500 1.900
0.059 0.075
