SI1922EDH-T1-GE3

Vishay Siliconix
Si1922EDH
Document Number: 67192
S11-2307-Rev. B, 21-Nov-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Dual N-Channel 20 V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
100 % R
g
Tested
Typical ESD Protection 2100 V HBM
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Load Switch for Portable Applications
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 220 °C/W.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
a
Q
g
(Typ.)
20
0.198 at V
GS
= 4.5 V 1.3
a
0.9 nC0.225 at V
GS
= 2.5 V 1.3
a
0.263 at V
GS
= 1.8 V 1.3
a
Marking Code
CG XX
Lot Traceability
and Date Code
Part # Code
Y
Y
SOT-363
SC-70 (6-LEADS)
6
4
1
2
3
5
Top View
S
1
G
1
D
2
D
1
G
2
S
2
Ordering Information:
Si1922EDH-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
1
S
1
G
1
1 k
D
2
S
2
G
2
1 k
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage V
DS
20
V
Gate-Source Voltage V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
1.3
a
A
T
C
= 70 °C 1.3
a
T
A
= 25 °C 1.3
a, b, c
T
A
= 70 °C 1.2
b, c
Pulsed Drain Current I
DM
4
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
1
T
A
= 25 °C 0.61
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
1.25
W
T
C
= 70 °C 0.8
T
A
= 25 °C 0.74
b, c
T
A
= 70 °C 0.47
b, c
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 5 s R
thJA
130 170
°C/W
Maximum Junction-to-Foot (Drain)
Steady State R
thJF
80 100
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Document Number: 67192
S11-2307-Rev. B, 21-Nov-11
Vishay Siliconix
Si1922EDH
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA 20 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
20
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 2.3
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 0.4 1 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 8 V ± 25
µA
V
DS
= 0 V, V
GS
= ± 4.5 V 1
Zero Gate Voltage Drain Current I
DSS
V
DS
= 20 V, V
GS
= 0 V 1
µA
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C 10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 4.5 V 4 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 4.5 V, I
D
= 1 A 0.165 0.198
ΩV
GS
= 2.5 V, I
D
= 1 A 0.187 0.225
V
GS
= 1.8 V, I
D
= 0.2 A 0.210 0.263
Forward Transconductance
a
g
fs
V
DS
= 4 V, I
D
= 1.5 A 4 S
Dynamic
b
Total Gate Charge Q
g
V
DS
= 10 V, V
GS
= 8 V, I
D
= 1.5 A 1.6 2.5
nC
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 1.5 A
0.9 1.8
Gate-Source Charge Q
gs
0.1
Gate-Drain Charge Q
gd
0.2
Gate Resistance R
g
f = 1 MHz 0.4 1.9 3.8 kΩ
Tur n - On D e lay T i me t
d(on)
V
DD
= 10 V, R
L
= 8.3 Ω
I
D
1.2 A, V
GEN
= 4.5 V, R
g
= 1 Ω
43 65
ns
Rise Time t
r
80 120
Turn-Off Delay Time t
d(off)
480 720
Fall Time t
f
220 330
Turn-on Delay Time t
d(on)
V
DD
= 10 V, R
L
= 8.3 Ω
I
D
1.2 A, V
GEN
= 8 V, R
g
= 1 Ω
22 33
Rise Time tr 46 70
Turn-Off Delay Time t
d(off)
645 968
Fall Time tr 215 323
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
T
C
= 25 °C 1
A
Pulse Diode Forward Current I
SM
4
Body Diode Voltage V
SD
I
S
= 1.2 A, V
GS
= 0 V 0.8 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= 1.2 A, dI/dt = 100 A/µs, T
J
= 25 °C
918ns
Body Diode Reverse Recovery Charge Q
rr
24nC
Reverse Recovery Fall Time t
a
5
ns
Reverse Recovery Rise Time t
b
4
Document Number: 67192
S11-2307-Rev. B, 21-Nov-11
www.vishay.com
3
Vishay Siliconix
Si1922EDH
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Gate Current vs. Gate-to-Source Voltage
Output Characteristics
On-Resistance vs. Drain Current
V
GS
- Gate-to-Source Voltage (V)
I
G
- Gate Current (mA)
0
0.1
0.2
0.3
0.4
0.5
03691215
T
J
= 25 °C
0
1
2
3
4
0.0 0.5 1.0 1.5 2.0
V
GS
=5Vthru2V
V
GS
=1.5V
V
GS
=1V
V
DS
- Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
0.13
0.16
0.19
0.22
0.25
01234
V
GS
=1.8V
V
GS
=2.5V
V
GS
=4.5V
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
Gate Current vs. Gate-to-Source Voltage
Transfer Characteristics
Gate Charge
10
-10
10
-9
10
-8
10
-7
10
-6
10
-5
10
-4
10
-3
03691215
V
GS
- Gate-to-Source Voltage (V)
I
G
- Gate Current (A)
T
J
= 150 °C
T
J
= 25 °C
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.3 0.6 0.9 1.2 1.5
T
C
= 125 °C
T
C
= 25 °C
T
C
= - 55 °C
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
0
2
4
6
8
0.0 0.5 1.0 1.5 2.0
I
D
=1.5A
V
DS
=10V
V
DS
=16V
V
DS
=5V
Q
g
- Total Gate Charge (nC)
V
GS
- Gate-to-Source Voltage (V)

SI1922EDH-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 20V Vds 8V Vgs SC70-6
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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