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AT25HP512-10PI-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
13
AT25HP256/512
1113L–SEEPR–3/06
Figure 9. WRITE Timing (AT25HP256)
Figure 10. PAGE WRITE Timing (AT25HP512)
Figure 11. HOLD Timing
SCK
SI
SO
CS
0 1 234
5
67891011202122
23
24 25 26
INSTRUCTION
HIGH IMPEDANCE
BYTE ADDRESS
15
14
13
3
2
10
7
65
4
32
1
0
1ST BYTE DATA IN
27 28 29 30 31
...
1043 1044 1045 1046 1047
SCK
SI
SO
CS
0 1 234
5
67891011202122
23
24 25 26
INSTRUCTION
HIGH IMPEDANCE
BYTE ADDRESS
15
14
13
3
2
10
7
65
4
32
1
0
128
th
BYTE DATA IN
12
1
st
BYTE DATA IN
SO
SCK
HO LD
CS
t
CD
t
HD
t
HZ
t
HD
t
CD
t
LZ
14
AT25HP256/512
1113L–SEEPR–3/06
Notes: 1. This device is not recommended for new design. Please refer to AT25256A datasheet. For 2.7 devices used in 4.5V to 5.5V
range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package & RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM marketing.
AT25HP256 Ordering Information
(1)
Ordering Code Package Operation Range
AT25HP256-10PU-2.7
(2)
AT25HP256-10PU-1.8
(2)
AT25HP256W-10SU-2.7
(2)
AT25HP256W-10SU-1.8
(2)
AT25HP256C1-10CU-2.7
(2)
AT25HP256C1-10CU-1.8
(2)
AT25HP256Y4-10YU-1.8
(2)
8P3
8P3
8S2
8S2
8CN1
8CN1
8Y4
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT25HP256-W2.7-11
(3)
AT25HP256-W1.8-11
(3)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Package Type
8CN1 8-lead, 0.300” Wide, Leadless Array Package (LAP)
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S2 8-lead, 0.200" Wide, Plastic Small Outline Package (EIAJ)
8Y4 8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
Options
–2.7 Low Voltage (2.7V to 5.5V)
–1.8 Low Voltage (1.8V to 5.5V)
15
AT25HP256/512
1113L–SEEPR–3/06
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green Package & RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Contact Serial
EEPROM marketing.
AT25HP512 Ordering Information
(1)
Ordering Code Package Operation Range
AT25HP512C1-10CI-2.7
AT25HP512-10PI-2.7
AT25HP512W2-10SI-2.7
8CN1
8P3
16S2
Industrial Temperature
(–40°C to 85°C)
AT25HP512C1-10CI-1.8
AT25HP512-10PI-1.8
AT25HP512W2-10SI-1.8
8CN1
8P3
16S2
Industrial Temperature
(–40°C to 85°C)
AT25HP512C1-10CU-2.7
(2)
AT25HP512C1-10CU-1.8
(2)
AT25HP512-10PU-2.7
(2)
AT25HP512-10PU-1.8
(2)
AT25HP512W2-10SU-2.7
(2)
AT25HP512W2-10SU-1.8
(2)
8CN1
8CN1
8P3
8P3
16S2
16S2
Lead-free/ Halogen-free
Industrial Temperature
(–40°C to 85°C)
AT25HP512-W2.7-11
(3)
AT25HP512-W1.8-11
(3)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Package Type
8CN1 8-lead, 0.300" Wide, Leadless Array Package (LAP)
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
16S2 16-lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
Options
–2.7 Low Voltage (2.7V to 5.5V)
–1.8 Low Voltage (1.8V to 5.5V)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

AT25HP512-10PI-1.8

Mfr. #:
Buy AT25HP512-10PI-1.8
Manufacturer:
Description:
IC EEPROM 512K SPI 10MHZ 8DIP
Lifecycle:
New from this manufacturer.
Delivery:
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