OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

MF1SPLUS6031DA4/03

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
1. General description
Migrate classic contactless smart card systems to the next security level! MIFARE Plus
brings benchmark security to mainstream contactless smart card applications. It is the
only mainstream IC compatible with MIFARE Classic 1K (MF1ICS50) and MIFARE
Classic 4K (MF1ICS70) which offers an upgrade path for existing infrastructure and
services.
After the security upgrade, MIFARE Plus uses AES-128 (Advanced Encryption Standard)
for authentication, data integrity and encryption. MIFARE Plus is based on open global
standards for both air interface and cryptographic methods at the highest security level.
MIFARE Plus is available in two versions: MIFARE Plus X and MIFARE Plus S.
• The MIFARE Plus X (MF1PLUSx0y1, described in this data sheet) offers more
flexibility to optimize the command flow for speed and confidentiality. It offers a rich
feature set including proximity checks against relay attacks.
• The MIFARE Plus S (MF1SPLUSx0y1)is the standard version for straight forward
migration of MIFARE Classic systems. It is configured to offer high data integrity.
2. Features and benefits
2 kB or 4 kB EEPROM
Simple fixed memory structure compatible with MIFARE Classic 1K and
MIFARE Classic 4K
Memory structure identical to MIFARE Classic 4K (sectors, blocks)
Access conditions freely configurable
Supports ISO/IEC 14443-3
1
UIDs (4-byte UID, 4 Byte NUID, 7-byte UID),
optional support of random IDs
Multi-sector authentication, Multi-block read and write
AES-128 used for authenticity, confidentiality and integrity
Anti-tearing mechanism for writing AES keys
Keys can be stored as MIFARE CRYPTO1 keys (2 × 48-bit per sector) and as AES
keys (2 × 128-bit per sector)
Full support of virtual card concept
Proximity check
Communication speed up to 848 kbit/s
MF1PLUSx0y1
Mainstream contactless smart card IC for fast and easy
solution development
Rev. 3.2 — 21 February 2011
163532
Product short data sheet
PUBLIC
1. ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A.
MF1PLUSX0Y1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532 2 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
Number of single write operations: 200000 cycles (typical)
Common Criteria Certification: EAL4+
3. Applications
Public transportation
Access management such as employee, school or campus cards
Electronic toll collection
Closed loop micro payment
Car parking
Internet cafés
Loyalty programs
4. Quick reference data
[1] Measured with LCR meter.
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
C
i
input capacitance T
amb
= 22 °C; f
i
= 13.56
MHz; 2.8 V RMS
[1]
15.0 17.0 19.04 pF
f
i
input frequency - 13.56 - MHz
EEPROM characteristics
t
ret
retention time T
amb
= 22 °C10--year
N
endu(W)
write endurance T
amb
= 22 °C; excluding
anti-tearing for AES keys or
sector trailers in security
level 3
100000 200000 - cycle
MF1PLUSX0Y1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532 3 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
5. Ordering information
Table 2. Ordering information
Type number Package
Commercial
name
Name Description Version
MF1PLUS8001DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
4 kB EEPROM, 7-byte UID, L1 card
-
MF1PLUS8011DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
4 kB EEPROM, 4-byte UID, L1 card
-
MF1PLUS8031DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
4 kB EEPROM, 4-byte NUID, L1 card
-
MF1PLUS8001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
SOT500-2
MF1PLUS8011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
SOT500-2
MF1PLUS8031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte NUID, L1 card
SOT500-2
MF1PLUS6001DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
2 kB EEPROM, 7-byte UID, L1 card
-
MF1PLUS6011DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
2 kB EEPROM, 4-byte UID, L1 card
-
MF1PLUS6031DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
2 kB EEPROM, 4-byte NUID, L1 card
-
MF1PLUS6001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
SOT500-2
MF1PLUS6011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
SOT500-2
MF1PLUS6031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte NUID, L1 card
SOT500-2
MF1PLUS8001DUD/13 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
4 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
-
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

MF1SPLUS6031DA4/03

Mfr. #:
Buy MF1SPLUS6031DA4/03
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders CONTACTLESS SMART CARD IC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet