MF1PLUSX0Y1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532 4 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
6. Block diagram
MF1PLUS8001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, no
security level 1 or 2, L3 card
SOT500-2
MF1PLUS6001DUD/13 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
2 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
-
MF1PLUS6001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, no
security level 1or 2, L3 card
SOT500-2
Table 2. Ordering information
…continued
Type number Package
Commercial
name
Name Description Version
Fig 1. Block diagram
001aah38
9
RF
INTERFACE
UART
ISO/IEC
14443A
AES CRYPTO
CO-PROCESSOR
CPU/LOGIC UNIT CRC
EEPROMRAMROM
TRUE RANDOM
NUMBER
GENERATOR
CRYPTO1
SECURITY
SENSORS
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
MF1PLUSX0Y1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532 5 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
7. Pinning information
7.1 Smart card contactless module
Fig 2. Contact assignments for SOT500-2 (MOA4)
Table 3. Bonding pad assignments to smart card contactless module
Contactless interface module MF1PLUSx0y1DA4/03 and /13
Antenna contacts Symbol Description
LA LA antenna coil connection LA
LB LB antenna coil connection LB
001aaj82
0
LA LBtop view
MF1PLUSX0Y1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532 6 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
8. Functional description
8.1 Memory organization
The 4 kB EEPROM memory (MF1PLUS80x) is organized in 32 sectors of 4 blocks and in
8 sectors of 16 blocks. The 2 kB EEPROM memory (MF1PLUS60x) is organized in
32 sectors of 4 blocks.
One block consists of 16 bytes.
8.1.1 Manufacturer block
The first data block (block 0) of the first sector (sector 0) contains the PICC manufacturer
data. This block is programmed and write protected during the production test.
8.1.2 Data blocks
Sectors 0
D
to 31
D
contain 3 blocks each and sectors 32
D
to 39
D
contain 15 blocks for data
storage. The data blocks can be configured using the access bits as:
read/write blocks for storing binary data
value blocks (only available in security level 1)
(1) CRYPTO1 key A in security level 0, 1, 2; plain text access byte in security level 3
Fig 3. Memory organization
001aaj8
43
SECTOR BLOCK DESCRIPTION0
39
32
31
0
15 CRYPTO1 key A access bytes
BYTE NUMBERS WITHIN A BLOCK
CRYPTO1 key B or data
CRYPTO1 key A access bytes CRYPTO1 key B or data
CRYPTO1 key A access bytes CRYPTO1 key B or data
CRYPTO1 key A access bytes CRYPTO1 key B or data
14
13
...
...
2
1
0
15
14
13
...
...
2
1
0
...
3
...
...
...
...
...
2
1
0
3
2
1
sector trailer 39
data
data
...
...
data
data
data
sector trailer 32
data
data
...
...
data
data
data
...
sector trailer 31
...
...
...
...
...
data
data
data
sector trailer 0
data
data
manufacturer data0
1 2 3 4 5
(1)
6 7 8 9 10 11 12 13 14 15

MF1SPLUS6031DA4/03

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders CONTACTLESS SMART CARD IC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union