NMLU1210TWG

STATIC ELECTRICAL CHARACTERISTICS
DYNAMIC CHARACTERISTICS
MAXIMUM RATINGS All Ratings: T
C
= 25°C unless otherwise speci ed.
ULTRAFAST SOFT RECOVERY ANTI-PARALLEL DIODE
Z
θ
JC
, THERMAL IMPEDANCE (°C/W)
10
-5
10
-4
10
-3
10
-2
10
-1
1.0
RECTANGULAR PULSE DURATION (seconds)
FIGURE 24. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20`
0.10
0
0.5
SINGLE PULSE
0.1
0.3
0.7
0.05
Peak T
J
= P
DM
x Z
θJC
+
T
C
Duty Factor D =
t
1
/
t
2
t
2
t
1
P
DM
Note:
D = 0.9
Symbol Characteristic / Test Conditions APT50GS60B2RDQ2(G) Unit
I
F(AV)
Maximum Average Forward Current (T
C
= 103°C, Duty Cycle = 0.5)
30
Amps
I
F(RMS)
RMS Forward Current (Square wave, 50% duty) 43
I
FSM
Non-Repetitive Forward Surge Current (T
J
= 45°C, 8.3 ms)
210
Symbol Characteristic / Test Conditions Min Type Max Unit
V
F
Forward Voltage
I
F
= 30A
2.8 3.3
Volts
I
F
= 60A
3.4
I
F
= 30A, T
J
= 125°C
2.1
Symbol Characteristic Test Conditions Min Typ Max Unit
t
rr
Reverse Recovery Time
I
F
= 1A, di
F
/dt = -100A/μs ,
V
R
= 30V, T
J
= 25°C
-
26
-
ns
t
rr
Reverse Recovery Time
I
F
= 30A, di
F
/dt = -200A/μs
V
R
= 667V, T
C
= 25°C
-
320
-
Q
rr
Reverse Recovery Charge -
545
- nC
I
RRM
Maximum Reverse Recovery Current -
4
- Amps
t
rr
Reverse Recovery Time
I
F
= 30A, di
F
/dt = -200A/μs
V
R
= 667V, T
C
= 125°C
-
435
-ns
Q
rr
Reverse Recovery Charge -
2100
-
nC
I
RRM
Maximum Reverse Recovery Current -
9
-
Amps
t
rr
Reverse Recovery Time
I
F
= 30A, di
F
/dt = -1000A/μs
V
R
= 800V, T
C
= 125°C
-
180
-
ns
Q
rr
Reverse Recovery Charge -
2975
-nC
I
RRM
Maximum Reverse Recovery Current -
28
- Amps
052-6300 Rev B 3-2012
T
J
= 125°C
V
R
= 800V
15A
30A
60A
t
rr
Q
rr
Q
rr
t
rr
I
RRM
600
500
400
300
200
100
0
35
30
25
20
15
10
5
0
Duty cycle = 0.5
T
J
= 175°C
0 25 50 75 100 125 150 25 50 75 100 125 150 175
1 10 100 200
50
45
40
35
30
25
20
15
10
5
0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
200
180
160
140
120
100
80
60
40
20
0
C
J
, JUNCTION CAPACITANCE K
f
, DYNAMIC PARAMETERS
(pF) (Normalized to 1000A/μs)
I
F(AV)
(A)
T
J
, JUNCTION TEMPERATURE (°C) Case Temperature (°C)
Figure 29. Dynamic Parameters vs. Junction Temperature Figure 30. Maximum Average Forward Current vs. CaseTemperature
V
R
, REVERSE VOLTAGE (V)
Figure 31. Junction Capacitance vs. Reverse Voltage
200
180
160
140
120
100
80
60
40
20
0
5000
4000
3000
2000
1000
0
V
F
, ANODE-TO-CATHODE VOLTAGE (V) -di
F
/dt, CURRENT RATE OF CHANGE(A/μs)
Figure 25. Forward Current vs. Forward Voltage Figure 26. Reverse Recovery Time vs. Current Rate of Change
-di
F
/dt, CURRENT RATE OF CHANGE (A/μs) -di
F
/dt, CURRENT RATE OF CHANGE (A/μs)
Figure 27. Reverse Recovery Charge vs. Current Rate of Change Figure 28. Reverse Recovery Current vs. Current Rate of Change
0 1 2 3 4 5 0 200 400 600 800 1000 1200
0 200 400 600 800 1000 1200 0 200 400 600 800 1000 1200
Q
rr
, REVERSE RECOVERY CHARGE I
F
, FORWARD CURRENT
(nC) (A)
I
RRM
, REVERSE RECOVERY CURRENT t
rr
, REVERSE RECOVERY TIME
(A) (ns)
T
J
= 125°C
V
R
= 800V
60A
15A
30A
T
J
= 125°C
V
R
= 800V
60A
30A
15A
T
J
= 175°C
T
J
= -55°C
T
J
= 25°C
T
J
= 125°C
APT50GS60B_SRDQ2(G)
TYPICAL PERFORMANCE CURVES
052-6300 Rev B 3-2012
4
3
1
2
5
5
Zer o
1
2
3
4
di
F
/dt - Rate of Diode Current Change Through Zero Crossing.
I
F
- Forward Conduction Current
I
RRM
- Maximum Reverse Recovery Current .
t
rr
- Revers e
R ecovery Time, measured from zero crossing wher e diode
Q
rr
- Area Under the Curve Defined by I
RRM
and t
rr
.
current goes from positive to negative, to the point at which the straight
line through I
RRM
and 0.25 I
RRM
passes through zero .
0.25 I
RRM
PEARSON 2878
CURRENT
TRANSFORMER
di
F
/dt Adjus t
30μH
D.U.T.
+18V
0V
V
r
t
rr
/
Q
rr
Wavefor m
APT10078BLL
APT50GS60B_SRDQ2(G)
TYPICAL PERFORMANCE CURVES
e1 SAC: Tin, Silver, Copper
TO-247 Package Outline
D
3
Pak Package Outline
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
6.15 (.242) BSC
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
20.80 (.819)
21.46 (.845)
1.65 (.065)
2.13 (.084)
1.01 (.040)
1.40 (.055)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
2.21 (.087)
2.59 (.102)
0.40 (.016)
0.79 (.031)
Collector
(Cathode)
Collector (Cathode)
Emitter (Anode)
Gate
5.45 (.215) BSC
Dimensions in Millimeters and (Inches )
2-Plcs.
15.95 (.628)
16.05(.632)
1.22 (.048)
1.32 (.052)
5.45 (.215) BSC
{2 Plcs. }
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
2.67 (.105)
2.84 (.112)
0.46 (.018)
{3 Plcs}
0.56 (.022)
Dimensions in Millimeters (Inches)
Heat Sink (Collector)
and Leads (Cathode)
are Plated
3.81 (.150)
4.06 (.160)
(Base of Lead)
Drai n
(Heat Sink)
1.98 (.078)
2.08 (.082)
Gate
Collector (Cathode)
Emitter (Anode)
0.020 (.001)
0.178 (.007)
1.27 (.050)
1.40 (.055)
11.51 (.453)
11.61 (.457)
13.41 (.528)
13.51(.532)
Revised
8/29/97
1.04 (.041)
1.15(.045)
13.79 (.543)
13.99(.551)
Revised
4/18/95
Figure 32. Diode Test Circuit
Figure 33. Diode Reverse Recovery Waveform De nitions
e3 SAC: Tin, Silver, Copper
052-6300 Rev B 3-2012

NMLU1210TWG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET Dual N-Channel Full BridgeRectifierUDFN8
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet