MAX5874
14-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
_______________________________________________________________________________________ 7
Typical Operating Characteristics (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, external reference, V
REFIO
= 1.25V, R
L
= 50 double-terminated,
I
OUTFS
= 20mA, T
A
= +25°C, unless otherwise noted.)
POWER DISSIPATION vs. SUPPLY VOLTAGE
(f
CLK
= 100MHz, f
OUT
= 10MHz)
MAX5874 toc13
SUPPLY VOLTAGE (V)
POWER DISSIPATION (mW)
3.4353.3353.235
200
210
220
230
240
190
3.135
A
OUT
= 0dBFS
EXTERNAL REFERENCE
INTERNAL REFERENCE
FOUR-TONE POWER RATIO PLOT
(f
CLK
= 150MHz, f
CENTER
= 31.6040MHz )
MAX5874 toc14
f
OUT
(MHz)
OUTPUT POWER (dBFS)
3634323028
-80
-60
-40
-20
0
-100
26 38
BW = 12MHz
f
OUT1
f
OUT2
f
OUT4
f
OUT3
f
OUT1
= 29.9997MHz
f
OUT2
= 31.0251MHz
f
OUT3
= 31.0640MHz
f
OUT4
= 32.9829MHz
ACLR FOR WCDMA MODULATION,
TWO CARRIERS
MAX5874 toc15
3.05MHz/div
ANALOG OUTPUT POWER (dBm)
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-120
f
CLK
= 184.32MHz
f
CENTER
= 30.72MHz
ACLR = 76dB
ACLR FOR WCDMA MODULATION,
SINGLE CARRIER
MAX5874 toc16
9.2MHz/div
ANALOG OUTPUT POWER (dBm)
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
DC 92.16MHz
f
CENTER
= 61.44MHz
f
CLK
= 184.32MHz
ACLR = 75dB
-20
WCDMA BASEBAND ACLR
MAX5874 toc17
NUMBER OF CARRIERS
ACLR (dB)
4321
76
77
82
84
85
75
ALTERNATE
ADJACENT
83
81
80
79
78
79.5
84.5
78.6
79.4
79.0
81.4
78.6
79.7
MAX5874
14-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
8 _______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1–7
A6, A5, A4,
A3, A2, A1, A0
Data Bits A6–A0. In dual-port mode, data is directed to the Q-DAC. In single-port mode, data bits
are not used. Connect bits A6–A0 to GND in single-port mode.
8, 9, 59, 60 N.C. No Connection. Leave floating or connect to GND.
10, 12, 13, 15,
20, 23, 26, 27,
30, 33, 36, 43
GND Converter Ground
11 DV
DD3.3
Digital Supply Voltage. Accepts a 3.135V to 3.465V supply voltage range. Bypass with a 0.1µF
capacitor to GND.
14, 21, 22, 31,
32
AV
DD3.3
Analog Supply Voltage. Accepts a 3.135V to 3.465V supply voltage range. Bypass each pin with
a 0.1µF capacitor to GND.
16 REFIO
Reference I/O. Output of the internal 1.2V precision bandgap reference. Bypass with a 1µF
capacitor to GND. REFIO can be driven with an external reference source. See Table1.
17 FSADJ
Full-Scale Adjust Input. This input sets the full-scale output current of the DAC. For a 20mA full-
scale output current, connect a 2k resistor between FSADJ and DACREF. See Table1.
18 DACREF
Current-Set Resistor Return Path. For a 20mA full-scale output current, connect a 2k resistor
between FSADJ and DACREF. Internally connected to GND. Do not use as an external ground
connection.
19, 34 AV
DD1.8
Analog Supply Voltage. Accepts a 1.71V to 1.89V supply voltage range. Bypass each pin with a
0.1µF capacitor to GND.
24 OUTQN Complementary Q-DAC Output. Negative terminal for current output.
25 OUTQP Q-DAC Output. Positive terminal for current output.
28 OUTIN Complementary I-DAC Output. Negative terminal for current output.
29 OUTIP I-DAC Output. Positive terminal for current output.
35 AV
CLK
Clock Supply Voltage. Accepts a 3.135V to 3.465V supply voltage range. Bypass with a 0.1µF
capacitor to GND.
37 CLKN
Complementary Converter Clock Input. Negative input terminal for differential converter clock.
Internally biased to AV
CLK
/ 2.
38 CLKP
Converter Clock Input. Positive input terminal for differential converter clock. Internally biased to
AV
CLK
/ 2.
39 TORB
Two’s-Complement/Binary Select Input. Set TORB to a CMOS-logic-high level to indicate a two’s-
complement input format. Set TORB to a CMOS-logic-low level to indicate a binary input format.
TORB has an internal pulldown resistor.
40 PD
Power-Down Input. Set PD to a CMOS-logic-high level to force the DAC into power-down mode.
Set PD to a CMOS-logic-low level for normal operation. PD has an internal pulldown resistor.
41 DORI
Dual (Parallel)/Single (Interleaved) Port Select Input. Set DORI high to configure as a dual-port
DAC. Set DORI low to configure as a single-port interleaved DAC. DORI has an internal pulldown
resistor.
MAX5874
14-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
_______________________________________________________________________________________ 9
Detailed Description
Architecture
The MAX5874 high-performance, 14-bit, dual current-
steering DAC (Figure 1) operates with DAC update rates
up to 200Msps. The converter consists of input registers
and a demultiplexer for single-port (interleaved) mode,
followed by a current-steering array. During operation in
interleaved mode, the input data registers demultiplex
the single-port data bus. The current-steering array gen-
erates differential full-scale currents in the 2mA to 20mA
range. An internal current-switching network, in combina-
tion with external 50 termination resistors, converts the
differential output currents into dual differential output
voltages with a 0.1V to 1V peak-to-peak output voltage
range. An integrated 1.2V bandgap reference, control
amplifier, and user-selectable external resistor determine
the data converter’s full-scale output range.
Reference Architecture and Operation
The MAX5874 supports operation with the internal 1.2V
bandgap reference or an external reference voltage
source. REFIO serves as the input for an external, low-
impedance reference source. REFIO also serves as a
reference output when the DAC operates in internal ref-
erence mode. For stable operation with the internal ref-
erence, decouple REFIO to GND with a 1µF capacitor.
Due to its limited output-drive capability, buffer REFIO
with an external amplifier when driving large
external loads.
The MAX5874’s reference circuit (Figure 2) employs a
control amplifier to regulate the full-scale current
I
OUTFS
for the differential current outputs of the DAC.
Calculate the full-scale output current as follows:
where I
OUTFS
is the full-scale output current of the
DAC. R
SET
(located between FSADJ and DACREF)
determines the amplifier’s full-scale output current for
the DAC. See Table 1 for a matrix of different I
OUTFS
and R
SET
selections.
I
V
R
OUTFS
REFIO
SET
×
32 1
1
2
14
Pin Description (continued)
PIN NAME FUNCTION
42 XOR
DAC Exclusive-OR Select Input. Set XOR low to allow the data stream to pass unchanged to the
DAC input. Set XOR high to invert the input data into the DAC. If unused, connect XOR to GND.
44 SELIQ
DAC Select Input. Set SELIQ low to direct data into the Q-DAC inputs. Set SELIQ high to direct
data into the I-DAC inputs. If unused, connect SELIQ to GND. SELIQ’s logic state is only valid in
single-port (interleaved) mode.
45–58
B13, B12, B11,
B10, B9, B8,
B7, B6, B5, B4,
B3, B2, B1, B0
Data Bits B13–B0. In dual-port mode, data is directed to the I-DAC. In single-port mode, the state
of SELIQ determines where the data bits are directed.
61 DV
DD1.8
Digital Supply Voltage. Accepts a 1.71V to 1.89V supply voltage range. Bypass with a 0.1µF
capacitor to GND.
62–68
A13, A12, A11,
A10, A9, A8, A7
Data Bits A13–A7. In dual-port mode, data is directed to the Q-DAC. In single-port mode, data
bits are not used. Connect bits A13–A7 to GND in single-port mode.
EP Exposed Pad. Must be connected to GND through a low-impedance path.
Table 1. I
OUTFS
and R
SET
Selection
Matrix Based on a Typical 1.200V
Reference Voltage
R
SET
()
FULL-SCALE
CURRENT I
OUTFS
(mA)
CALCULATED 1% EIA STD
2 19.2k 19.1k
5 7.68k 7.5k
10 3.84k 3.83k
15 2.56k 2.55k
20 1.92k 1.91k

MAX5874EGK+TD

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Digital to Analog Converters - DAC 14-Bit 2Ch 200Msps DAC
Lifecycle:
New from this manufacturer.
Delivery:
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