SIRA12BDP-T1-GE3 Datasheet SIRA12BDP-T1-GE3 | P1-P3

SiRA12BDP

www.vishay.com

Vishay Siliconix

S18-0316-Rev. A, 19-Mar-18

1

Document Number: 76390

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

N-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET

®

Gen IV power MOSFET

• 100 % R

g

and UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• High power density DC/DC

• Synchronous rectification

• VRMs and embedded DC/DC

Notes

a. Based on T

C

= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257

). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

g. Package limited

PRODUCT SUMMARY

V

DS

(V) 30

R

DS(on)

max. () at V

GS

= 10 V 0.0043

R

DS(on)

max. () at V

GS

= 4.5 V 0.0060

Q

g

typ. (nC) 10

I

D

(A) 60

a, g

Configuration Single

PowerPAK

®

SO-8 Single

Top View

1

6.15 mm

5.15 mm

Bottom View

4

G

3

S

2

S

1

S

D

8

D

6

D

7

D

5

N-Channel MOSFET

G

D

S

ORDERING INFORMATION

Package PowerPAK SO-8

Lead (Pb)-free and halogen-free SiRA12BDP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T

A

= 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT

Drain-source voltage V

DS

30

V

Gate-source voltage V

GS

+20, -16

Continuous drain current (T

J

= 150 °C)

T

C

= 25 °C

I

D

60

g

A

T

C

= 70 °C 59

g

T

A

= 25 °C 27

b, c

T

A

= 70 °C 22

b, c

Pulsed drain current (t = 100 μs) I

DM

150

Continuous source-drain diode current

T

C

= 25 °C

I

S

34

T

A

= 25 °C 4.6

b, c

Single pulse avalanche current

L = 0.1 mH

I

AS

16

Single pulse avalanche energy E

AS

13 mJ

Maximum power dissipation

T

C

= 25 °C

P

D

38

W

T

C

= 70 °C 24

T

A

= 25 °C 5

b, c

T

A

= 70 °C 3.2

b, c

Operating junction and storage temperature range T

J

, T

stg

-55 to +150

°C

Soldering recommendations (peak temperature)

d, e

260

THERMAL RESISTANCE RATINGS

PARAMETER SMYBOL TYPICAL MAXIMUM UNIT

Maximum junction-to-ambient

b, f

t  10 s R

thJA

20 25

°C/W

Maximum junction-to-case (drain) Steady state R

thJC

2.6 3.3

SiRA12BDP

www.vishay.com

Vishay Siliconix

S18-0316-Rev. A, 19-Mar-18

2

Document Number: 76390

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Notes

a. Pulse test: pulse width  300 μs, duty cycle  2 %

b. Guaranteed by design, not subject to production testing

c. Based on characterization, not subject to production testing



Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

SPECIFICATIONS (T

J

= 25 °C, unless otherwise noted)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT

Static

Drain-source breakdown voltage V

DS

V

GS

= 0 V, I

D

= 250 μA 30 - -

V

Drain-source breakdown voltage

(c)



(transient)

V

DSt

V

GS

= 0 V, I

D(aval)

= 70 A,

t

transcient

 50 ns

36 - -

V

DS

temperature coefficient V

DS

/T

J

I

D

= 250 μA

-20-

mV/°C

V

GS(th)

temperature coefficient V

GS(th)

/T

J

--5.1-

Gate-source threshold voltage V

GS(th)

V

DS

= V

GS

, I

D

= 250 μA 1.2 - 2.4 V

Gate-source leakage I

GSS

V

DS

= 0 V, V

GS

= +20, -16 V - - ± 100 nA

Zero gate voltage drain current I

DSS

V

DS

= 30 V, V

GS

= 0 V - - 1

μA

V

DS

= 30 V, V

GS

= 0 V, T

J

= 55 °C - - 10

On-state drain current

a

I

D(on)

V

DS

 5 V, V

GS

= 10 V 25 - - A

Drain-source on-state resistance

a

R

DS(on)

V

GS

= 10 V, I

D

= 10 A - 0.0027 0.0043



V

GS

= 4.5 V, I

D

= 7 A - 0.0048 0.0060

Forward transconductance

a

g

fs

V

DS

= 10 V, I

D

= 20 A - 67 - S

Dynamic

b

Input capacitance C

iss

V

DS

= 15 V, V

GS

= 0 V, f = 1 MHz

- 1470 -

pFOutput capacitance C

oss

- 545 -

Reverse transfer capacitance C

rss

-60-

C

rss

/C

iss

ratio - 0.040 0.080

Total gate charge Q

g

V

DS

= 15 V, V

GS

= 10 V, I

D

= 10 A - 21 32

nCV

DS

= 15 V, V

GS

= 4.5 V, I

D

= 10 A

-1015

Gate-source charge Q

gs

-4.2-

Gate-drain charge Q

gd

-2.6-

Output charge Q

oss

V

DS

= 15 V, V

GS

= 0 V - 15 -

Gate resistance R

g

f = 1 MHz 0.3 1.4 2.8 

Turn-on delay time t

d(on)

V

DD

= 15 V, R

L

= 1.5 

I

D

 10 A, V

GEN

= 10 V, R

g

= 1 

-1020

ns

Rise time t

r

-2040

Turn-off delay time t

d(off)

-1530

Fall time t

f

-1020

Turn-on delay time t

d(on)

V

DD

= 15 V, R

L

= 1.5 

I

D

 10 A, V

GEN

= 4.5 V, R

g

= 1 

-1635

Rise time t

r

-3160

Turn-off delay time t

d(off)

-1225

Fall time t

f

-1225

Drain-Source Body Diode Characteristics

Continuous source-drain diode current I

S

T

C

= 25 °C - - 34

A

Pulse diode forward current

a

I

SM

--150

Body diode voltage V

SD

I

S

= 10 A - 0.75 1.1 V

Body diode reverse recovery time t

rr

I

F

= 10 A, di/dt = 100 A/μs,

T

J

= 25 °C

-3770ns

Body diode reverse recovery charge Q

rr

-3760nC

Reverse recovery fall time t

a

-21-

ns

Reverse recovery rise time t

b

-16-

SiRA12BDP

www.vishay.com

Vishay Siliconix

S18-0316-Rev. A, 19-Mar-18

3

Document Number: 76390

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Output Characteristics

On-Resistance vs. Drain Current

Gate Charge

Transfer Characteristics

Capacitance

On-Resistance vs. Junction Temperature

10

100

1000

10000

0

20

40

60

80

100

0 0.5 1 1.5 2 2.5 3

Axis Title

1st line

2nd line

I

D

- Drain Current (A)

V

DS

- Drain-to-Source Voltage (V)

2nd line

V

GS

= 10 V thru 5 V

V

GS

= 3 V

V

GS

= 4 V

10

100

1000

10000

0

0.002

0.004

0.006

0.008

0.010

0 20406080100

Axis Title

1st line

2nd line

R

DS(on)

- On-Resistance (Ω)

I

D

- Drain Current (A)

2nd line

V

GS

= 10 V

V

GS

= 4.5 V

10

100

1000

10000

0

2

4

6

8

10

0 5 10 15 20

Axis Title

1st line

2nd line

V

GS

- Gate-to-Source Voltage (V)

Q

g

- Total Gate Charge (nC)

2nd line

V

DS

= 15 V

V

DS

= 24 V

V

DS

= 7.5 V

I

D

= 10 A

10

100

1000

10000

0

20

40

60

80

100

012345

Axis Title

1st line

2nd line

I

D

- Drain Current (A)

V

GS

- Gate-to-Source Voltage (V)

2nd line

T

C

= 25 °C

T

C

=-55 °C

T

C

= 125 °C

10

100

1000

10000

0

500

1000

1500

2000

0 5 10 15 20 25 30

Axis Title

1st line

2nd line

C - Capacitance (pF)

V

DS

- Drain-to-Source Voltage (V)

2nd line

C

rss

C

oss

C

iss

10

100

1000

10000

0.6

0.8

1.0

1.2

1.4

1.6

-50 -25 0 25 50 75 100 125 150

Axis Title

1st line

2nd line

R

DS(on)

- On-Resistance (Normalized)

T

J

- Junction Temperature (°C)

2nd line

I

D

= 10 A

V

GS

= 10 V

V

GS

= 4.5 V

SIRA12BDP-T1-GE3

SIRA12BDP-T1-GE3

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