NTB0102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 4 — 23 January 2013 16 of 26
NXP Semiconductors
NTB0102
Dual supply translating transceiver; auto direction sensing; 3-state
13.2 Architecture
The architecture of the NTB0102 is shown in Figure 10. The device does not require an
extra input signal to control the direction of data flow from A to B or from B to A. In a static
state, the output drivers of the NTB0102 can maintain a defined output level, but the
output architecture is designed to be weak, so that they can be overdriven by an external
driver when data on the bus starts flowing in the opposite direction. The output of one-shot
circuits detect rising or falling edges on the A or B ports. During a rising edge, the
one-shot circuits turn on the PMOS transistors (T1, T3) for a short duration, accelerating
the LOW-to-HIGH transition. Similarly, during a falling edge, the one-shot circuits turn on
the NMOS transistors (T2, T4) for a short duration, accelerating the HIGH-to-LOW
transition. During output transitions the typical output impedance is 70 at V
CCO
= 1.2 V
to 1.8 V, 50 at V
CCO
= 1.8 V to 3.3 V and 40 at V
CCO
= 3.3 V to 5.0 V.
Fig 10. Architecture of NTB0102 I/O cell (one channel)
001aal921
ONE
SHOT
ONE
SHOT
ONE
SHOT
ONE
SHOT
B
A
V
CC(B)
V
CC(A)
4 kΩ
4 kΩ
T3
T4
T1
T2
NTB0102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 4 — 23 January 2013 17 of 26
NXP Semiconductors
NTB0102
Dual supply translating transceiver; auto direction sensing; 3-state
13.3 Input driver requirements
For correct operation, the device driving the data I/Os of the NTB0102 must have a
minimum drive capability of 2 mA See Figure 11
for a plot of typical input current versus
input voltage.
13.4 Power-up
During operation V
CC(A)
must never be higher than V
CC(B)
, however during power-up
V
CC(A)
V
CC(B)
does not damage the device, so either power supply can be ramped up
first. There is no special power-up sequencing required. The NTB0102 includes circuitry
that disables all output ports when either V
CC(A)
or V
CC(B)
is switched off.
13.5 Enable and disable
An output enable input (OE) is used to disable the device. Setting OE = LOW causes all
I/Os to assume the high-impedance OFF-state. The disable time (t
dis
with no external
load) indicates the delay between when OE goes LOW and when outputs actually
become disabled. The enable time (t
en
) indicates the amount of time the user must allow
for one one-shot circuitry to become operational after OE is taken HIGH. To ensure the
high-impedance OFF-state during power-up or power-down, pin OE should be tied to
GND through a pull-down resistor, the minimum value of the resistor is determined by the
current-sourcing capability of the driver.
13.6 Pull-up or pull-down resistors on I/O lines
As mentioned previously the NTB0102 is designed with low static drive strength to drive
capacitive loads of up to 70 pF. To avoid output contention issues, any pull-up or
pull-down resistors used must be above 50 k. For this reason the NTB0102 is not
recommended for use in open drain driver applications such as 1-Wire or I
2
C-bus. For
these applications, the NTS0102 level translator is recommended.
V
T
: input threshold voltage of the NTB0102 (typically V
CCI
/ 2).
V
D
: supply voltage of the external driver.
Fig 11. Typical input current versus input voltage graph
001aal922
V
T
/4 kΩ
(V
D
V
T
)/4 kΩ
I
I
V
I
NTB0102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 4 — 23 January 2013 18 of 26
NXP Semiconductors
NTB0102
Dual supply translating transceiver; auto direction sensing; 3-state
14. Package outline
Fig 12. Package outline SOT505-2 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(1)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.70
0.35
8°
0°
0.13 0.10.20.5
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.47
0.33
SOT505-2 - - -
02-01-16
w M
b
p
D
Z
e
0.25
14
8
5
θ
A
2
A
1
L
p
(A
3
)
detail X
A
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
1.1
pin 1 index

NTB0102GF,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Translation - Voltage Levels DUAL XCVR AUTO DRECT SENSING; 3-STATE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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