–6–
ADG728/ADG729
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25°C unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog, Digital Inputs
2
. . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, Each S . . . . . . . . . . . . . . . . . . . . . 30 mA
Continuous Current D, ADG729 . . . . . . . . . . . . . . . . . 80 mA
Continuous Current D, ADG728 . . . . . . . . . . . . . . . . 120 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG728/ADG729 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
TSSOP Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4°C/W
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 27.6°C/W
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
TERMINOLOGY
C
D
, C
S
(ON) “ON” Switch Capacitance. Measured with refer-
ence to ground.
C
IN
Digital Input Capacitance.
t
ON
Delay time between the 50% and 90% points
of the STOP condition and the switch “ON”
condition.
t
OFF
Delay time between the 50% and 90% points
of the STOP condition and the switch “OFF”
condition.
t
D
“OFF” time measured between the 80% points of
both switches when switching from one switch to
another.
Charge A measure of the glitch impulse transferred from
Injection the digital input to the analog output during
switching.
Off Isolation A measure of unwanted signal coupling through
an “OFF” switch.
Crosstalk A measure of unwanted signal which is coupled
through from one channel to another as a result
of parasitic capacitance.
Bandwidth The frequency at which the output is attenuated
by 3 dBs.
On Response The frequency response of the “ON” switch.
Insertion The loss due to the ON resistance of the switch.
Loss
WARNING!
ESD SENSITIVE DEVICE
V
DD
Most Positive Power Supply Potential.
I
DD
Positive Supply Current.
GND Ground (0 V) Reference.
S Source Terminal. May be an input or output.
D Drain Terminal. May be an input or output.
V
D
(V
S
) Analog Voltage on Terminals D, S.
R
ON
Ohmic Resistance between D and S.
∆R
ON
On Resistance Match Between any Two Chan-
nels, i.e., R
ON
max – R
ON
min.
R
FLAT(ON)
Flatness is defined as the difference between the
maximum and minimum value of on resistance
as measured over the specified analog signal range.
I
S
(OFF) Source Leakage Current with the Switch “OFF.”
I
D
(OFF) Drain Leakage Current with the Switch “OFF.”
I
D
, I
S
(ON) Channel Leakage Current with the Switch “ON.”
V
INL
Maximum Input Voltage for Logic “0.”
V
INH
Minimum Input Voltage for Logic “1.”
I
INL
(I
INH
) Input Current of the Digital Input.
C
S
(OFF) “OFF” Switch Source Capacitance. Measured
with reference to ground.
C
D
(OFF) “OFF” Switch Drain Capacitance. Measured
with reference to ground.
Lead Temperature, Soldering . . . . .