SpecNo.JELF243A-0042L-01 P3/8
MURATA MFG.CO., LTD
Reference
Only
No. Item Specification Test Method
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change : within ± 5%
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change : within ±5%
Temperature: 85±2°C
Time: 1000± hours
Then measured after exposure in the
room condition for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000± hours
Then measured after exposure in the
room condition for 24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90 to 95%(RH)
Time: 1000± hours
Then measured after exposure in the
room condition for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
step 1 : -40±2°C / 30±3 min
step 2 : Ordinary temp. / 10 to 15 min
step 3 : +85±2°C / 30±3 min
step 4 : Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
(in mm)
Dimension of the Cavity is measured at the bottom side.
48
0
48
0
48
0
3.6
2.0±0.05
8.0±0.1
Direction of feed
2.7±0.2
4.0±0.1
4.9
12.0±0.3
1.75±0.1
5
.
5±0.05
1.5
-0
+0.1
0.3±0.05
※
Lead-in/out wire
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
(0.3)
