LQH43CN100K03L

SpecNo.JELF243A-0042L-01 P4/8
MURATA MFG.CO., LTD
Reference
Only
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
500 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.>
□□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
165 to 180 degree
F
Cover tape
Plastic tape
190 min
2.0±0.5
13.0±0.2
21.0±0.8
210 min
60±
1
0
17.0±1.4
180±
0
3
13.
1
0
(in mm)
Trailer : 160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
SpecNo.JELF243A-0042L-01 P5/8
MURATA MFG.CO., LTD
Reference
Only
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 4
Above Outer Case size is typical. It depends on a quantity of an order
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (7) Traffic signal equipment
(2) Aerospace equipment (8) Disaster prevention / crime prevention equipment
(3)Undersea equipment (9) Data-processing equipment
(4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Flow Soldering Reflow Soldering *
(in mm)
* Applicable to flow soldering.
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solde
r
Standard thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
Chip Coil
Solder Resist
Land
7.5
1.5
1.5
7.5
1.5
3.0
1.5 1.5 1.5
W
D
Label
H
SpecNo.JELF243A-0042L-01 P6/8
MURATA MFG.CO., LTD
Reference
Only
11.3 Flow soldering conditions / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resultingin the
deterioration of product quality.
soldering profile
(1)Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、4s6s 265±3℃、5s
Cycle of flow 2 times 1 time
(2)Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 1 time
Limit Profile
Standard Profile
90s±30s
230
260
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
265±3
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
250

LQH43CN100K03L

Mfr. #:
Manufacturer:
Description:
Fixed Inductors 10uH 10%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union