UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 6.2 — 1 November 2010 10 of 17
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
11. Electrostatic discharge
I
FS
current on pin FS V
HV
=310V; V
FS
=12.2V
UBA2024P, UBA2024T 10 14 18 μA
UBA2024AP, UBA2024AT 10 14 18 μA
V
HV
=160V; V
FS
=12.2V
UBA2024BP, UBA2024BT 10 14 18 μA
Internal oscillator
f
osc
oscillator frequency V
SW
= 0 V - 150 - kHz
V
SW
=V
DD
- - 60 kHz
operating; nominal; R
OSC
=100kΩ;
C
OSC
= 220 pF; V
SW
=V
DD
40.05 41.32 42.68 kHz
Δf
osc
/f
osc
relative oscillator frequency
variation
R
OSC
= 100 kΩ; C
OSC
= 220 pF;
−20 °C ≤ T
j
≤ +150 °C
-2-%
k
H
high-level trip point factor 0.382 0.395 0.408
V
trip(osc)high
high oscillator trip voltage V
trip(osc)high
=k
H
× V
DD
4.58 4.94 5.29 V
k
L
low-level trip point factor 0.030 0.033 0.038
V
trip(osc)low
low oscillator trip voltage V
trip(osc)low
=k
L
× V
DD
0.367 0.413 0.483 V
K
osc
oscillator constant R
OSC
= 100 kΩ; C
OSC
= 220 pF 1.065 1.1 1.35 V
Sweep function
I
ch(sweep)
sweep charge current V
SW
= 0 V 215 280 345 nA
t
sweep
sweep time C
SW
=33nF; V
DD
= 12.2 V 0.28 0.35 0.45 s
Table 5. Characteristics …continued
T
j
= 25
°
C; all voltages are measured with respect to SGND; positive currents flow into the IC.
Symbol Parameter Conditions Min Typ Max Unit
Table 6. ElectroStatic Discharge (ESD) overview
Model Class JEDEC classification criteria
ESDH (human body model) 1C pass at ESD pulse 1000 V
fail at ESD pulse 2000 V
ESDC (charged device model) C2 pass at ESD pulse 200 V
fail at ESD pulse 500 V
ESDM (machine model) B pass at 200 V ≥ ESD pulse < 400 V
