UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 6.2 — 1 November 2010 7 of 17
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
8. Limiting values
[1] The maximum junction temperature must not be exceeded.
9. Thermal characteristics
[1] In accordance with IEC 60747-1
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
HV
voltage on pin HV normal operation
UBA2024P - 373 V
UBA2024AP - 373 V
UBA2024T - 373 V
UBA2024AT - 373 V
UBA2024BP - 187 V
UBA2024BT - 187 V
mains transients during 0.5 s
UBA2024P - 550 V
UBA2024AP - 550 V
UBA2024T - 550 V
UBA2024AT - 550 V
UBA2024BP - 300 V
UBA2024BT - 300 V
V
FS
voltage on pin FS V
HV
V
HV
+14 V
V
DD
supply voltage low voltage; DC supply 0 14 V
I
DD
supply current low voltage; peak value is internally
limited; T
amb
=25°C
05mA
V
PGND
voltage on pin PGND referenced to SGND −1+1V
V
RC
voltage on pin RC I
RC
< 1mA 0 V
DD
V
V
SW
voltage on pin SW I
SW
< 1mA 0 V
DD
V
SR slew rate pin OUT; repetitive −4+4V/ns
T
j
junction temperature
[1]
−40 +150 °C
T
amb
ambient temperature −40 +150 °C
T
stg
storage temperature −55 +150 °C
Table 4. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient in free air
[1]
SO14 package 95 K/W
DIP8 package 95 K/W
R
th(j-c)
thermal resistance from junction to case in free air
[1]
SO14 package 8 K/W
DIP8 package 16 K/W
