TSM4NC50CP ROG

TSM4NC50CP
Taiwan Semiconductor
4 Version: A1609
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Capacitance vs. Drain-Source Voltage
BV
DSS
vs. Junction Temperature
Maximum Safe Operating Area, Junction-to-Case
Source-Drain Diode Forward Current vs. Voltage
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance, Z
ӨJC
t, Square Wave Pulse Duration (sec)
C, Capacitance (pF)
V
DS
, Drain to Source Voltage (V)
BV
DSS
(Normalized)
Drain-Source Breakdown Voltage
T
J
, Junction Temperature (°C)
I
S
, Reverse Drain Current (A)
V
SD
, Body Diode Forward Voltage (V)
V
DS
, Drain to Source Voltage (V)
I
D
, Drain Current (A)
0
100
200
300
400
500
600
700
800
0.1 1 10 100 1000
CISS
COSS
CRSS
0.8
0.9
1
1.1
1.2
-75 -50 -25 0 25 50 75 100 125 150
I
D
=1mA
0.1
1
10
100
0.2 0.4 0.6 0.8 1 1.2
25
150
-55
0.1
1
10
1 10 100 1000
R
DS(ON)
SINGLE PULSE
R
ӨJC
=1.5°C/W
T
C
=25°C
20
0.01
0.1
1
10
0.0001 0.001 0.01 0.1
SINGLE PULSE
R
ӨJC
=1.5°C/W
Duty=0.5
Duty=0.2
Duty=0.1
Duty=0.05
Duty=0.02
Duty=0.01
Single
Notes:
Duty = t
1
/ t
2
T
J
= T
C
+ P
DM
x Z
ӨJC
x R
ӨJC
TSM4NC50CP
Taiwan Semiconductor
5 Version: A1609
PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters)
TO-252
SUGGESTED PAD LAYOUT (Unit: Millimeters)
MARKING DIAGRAM
Y
= Year Code
M
= Month Code
O
=Jan
P
=Feb
Q
=Mar
R
=Apr
S
=May
T
=Jun
U
=Jul
V
=Aug
W
=Sep
X
=Oct
Y
=Nov
Z
=Dec
L
= Lot Code (1~9, A~Z)
4NC50
YML
TSM4NC50CP
Taiwan Semiconductor
6 Version: A1609
Notice
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TSM4NC50CP ROG

Mfr. #:
Manufacturer:
Taiwan Semiconductor
Description:
MOSFET 500V, 4Amp, 2,7ohm N channel Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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