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NX5DV330DS,118
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
NX5D
V330_3
© NXP B.V
. 2009. All rights reserved.
Product data sheet
Rev
. 03 — 5 August 2009
10 of 15
NXP Semiconductors
NX5D
V330
Quad 1-of-2 video multiple
xer/demultiple
xer
Fig 12.
Pac
kage outline SO
T519-1 (SSOP16)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
5.0
4.8
4.0
3.8
0.635
1
6.2
5.8
0.89
0.41
0.18
0.05
8
0
o
o
0.18
0.2
0.09
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
SOT519-1
99-05-04
03-02-18
(1)
w
M
b
p
D
H
E
E
Z
e
c
v
M
A
X
A
y
1
8
16
9
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
0
2.5
5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
A
max.
1.73
NX5D
V330_3
© NXP B.V
. 2009. All rights reserved.
Product data sheet
Rev
. 03 — 5 August 2009
11 of 15
NXP Semiconductors
NX5D
V330
Quad 1-of-2 video multiple
xer/demultiple
xer
Fig 13.
Pac
kage outline SO
T403-1 (TSSOP16)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
18
16
9
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.1
pin 1 index
NX5D
V330_3
© NXP B.V
. 2009. All rights reserved.
Product data sheet
Rev
. 03 — 5 August 2009
12 of 15
NXP Semiconductors
NX5D
V330
Quad 1-of-2 video multiple
xer/demultiple
xer
Fig 14.
Pac
kage outline SO
T763-1 (DHVQFN16)
terminal 1
index area
0.5
1
A
1
E
h
b
UNIT
y
e
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
3.6
3.4
D
h
2.15
1.85
y
1
2.6
2.4
1.15
0.85
e
1
2.5
0.30
0.18
0.05
0.00
0.05
0.1
DIMENSIONS (mm are the original dimensions)
SOT763-1
MO-241
- - -
- - -
0.5
0.3
L
0.1
v
0.05
w
0
2.5
5 mm
scale
SOT763-1
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
27
15
10
9
8
1
16
X
D
E
C
B
A
terminal 1
index area
A
C
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
NX5DV330DS,118
Mfr. #:
Buy NX5DV330DS,118
Manufacturer:
NXP Semiconductors
Description:
Video Switch ICs Analog MUX Quad 1:2 5.5V 16Pin 3.9mm
Lifecycle:
New from this manufacturer.
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