KLI−2104
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4
Figure 4. Active Pixel and Channel Alignment − KLI−2104
Luma
Channel
Blue
Channel
Red
Channel
Green
Channel
Last Active Pixel
First Active
Pixel
(Center)
(Edge)
6.25 Line Spacing (87.5 mm)
6 Line Spacing (84 mm)
6 Line Spacing (84 mm)
Imaging
During the integration period, an image is obtained by
gathering electrons generated by photons incident upon the
photodiodes. The charge collected in the photodiode array
is a linear function of the local exposure. The charge is stored
in the photodiode itself and is isolated from the CCD shift
registers during the integration period by the transfer gates
TG1 and TG2 for the chroma channels, which are held at
a barrier potential. (The luminance channel has only one
transfer gate, TG). At the end of the integration period,
the CCD register clocking is stopped with the f1 and f2
gates being held in a ‘high’ and ‘low’ state respectively.
Next, the TG gates are turned ‘on’ causing the charge to
drain from the photodiode into the TG1 storage region. As
TG1 is turned back ‘off’ charge is transferred through TG2
and into the f1 storage region. The TG2 gate is then turned
‘off’, isolating the shift registers from the accumulation
region once again. For the luminance channel, only one TG
transfer is required. Complementary clocking of the f1 and
f2 phases now resumes for readout of the current line of data
while the next line of data is integrated.
Charge Transport and Sensing
Readout of the signal charge is accomplished by
two-phase, complementary clocking of the f1 and f2 gates.
The register architecture has been designed for high speed
clocking with minimal transport and output signal
degradation, while still maintaining low (5 Vp-p min) clock
swings for reduced power dissipation, lower clock noise and
simpler driver design. The data in all registers is clocked
simultaneously toward the output structures. The signal is
then transferred to the output structures in a parallel format
at the falling edge of the f2 clock. Re-settable floating
diffusions are used for the charge-to-voltage conversion
while source followers provide buffering to external
connections. The potential change on the floating diffusion
is dependent on the amount of signal charge and is given by
DV
FD
= DQ/C
FD
, where DV
FD
is the change in potential on
the floating diffusion, DQ is the amount of charge, and C
FD
is the capacitance of the floating diffusion node. Prior to
each pixel output, the floating diffusion is returned to the RD
level by the reset clock, fR.
Pixel Summing (Chroma Channels Only)
Enabling the pixel − summing feature can vary the
effective resolution of the color channels of this sensor.
A separate pin is provided for the last shift register gate
labeled f2SC. This gate, when clocked appropriately, stores
the summation of signal from adjacent pixels. This
combined charge packet is then transferred onto the sense
node. As an example, the sensor can be operated in 2-pixel
summing mode (1,049 pixels), by supplying a clock to f2SC
which is a 75% duty cycle signal at 1/2 the frequency of the
f2C signal, and modifying the fRC clock as depicted in
Figure 25. Applications that require full resolution mode
(2,098 pixels), must tie the f2SC pin to the f2C pin. Refer
to Figure 24 for additional details.
The luma channel outputs are in an odd and even
configuration. The odd pixel value and the even pixel value
are available simultaneously during the f2 clock low phase.
In this manner, pixel summing is an option off-chip.
KLI−2104
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5
Physical Description
Pin Description and Device Orientation
Figure 5. Pinout Diagram
1 32SUB SUB
2 31IGC LS
3 30IDC IGL
4 29TG2C IDL
5 28TG1C TGL
6 27
f2C f2L
7 26
f1C f1L
8 25N/C N/C
9 24
f2SC
VIDO
10 23SUBG SUBL
11 22VIDG VIDE
12 21SUBR SUBB
13 20VIDR VIDB
14 19VDDC VDDL
15 18
fRC fRL
16 17RDC RDL
Table 3. PACKAGE PIN DESCRIPTION
Pin Name Description
1 SUB Substrate/Ground
2 IGC Test Input − Input Diode, Chroma
3 IDC Test Input − Input Diode, Chroma
4 TG2C Transfer Gate 2 Clock, Chroma
5 TG1C Transfer Gate 1 Clock, Chroma
6
f2C
Phase 2 CCD Clock, Chroma
7
f1C
Phase 1 CCD Clock, Chroma
8 N/C No Connection (Ground)
9 H2SC Phase 2 Summing Gate, Chroma
10 SUBx Ground Reference (R, G, B)
11 VIDx Output Video (R, G, B)
12 SUBx Ground Reference (R, G, B)
13 VIDx Output Video (R, G, B)
14 VDDC Amplifier Supply (Chroma)
15
fRC
Reset Clock, Chroma
16 RDC Reset Drain, Chroma
Pin Name Description
17 RDL Reset Drain, Luma
18
fRL
Reset Clock, Luma
19 VDDL Amplifier Supply (Luma)
20 VIDx Output Video (R, G, B)
21 SUBx Ground Reference (R, G, B)
22 VIDE Output Video (Luma Even Channel)
23 SUBL Ground Reference (Luma)
24 VIDO Output Video (Luma Odd Channel)
25 N/C No Connection (Ground)
26
f1L
Phase 1 CCD Clock, Luma
27
f2L
Phase 2 CCD Clock, Luma
28 TGL Transfer Gate Clock, Luma
29 IDL Test Input − Input Diode, Luma
30 IGL Test Input − Input Gate, Luma
31 LS Light Shield/Exposure Drain
32 SUB Substrate/Ground
KLI−2104
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6
IMAGING PERFORMANCE
Specifications given under nominally specified operating
conditions for the given mode of operation at 25°C,
f
CLK
= 1 MHz, 2.1 ms integration time, MAR cover glass,
color filters, and an active load as in the schematic shown in
Figure 23 of a typical output bias/buffer circuit, unless
otherwise specified. See notes on next page for further
descriptions.
Each limit identified as a maximum and/or a minimum is
tested and guaranteed for every device. Nominal values are
to be considered typical performance values that are design
and manufacturing targets. These values are not guaranteed.
Table 4. SPECIFICATIONS
Description
Symbol Min. Nom. Max. Units Notes
Verification
Plan
15
Saturation Output Voltage,
Chroma
V
SAT
, Chroma 2.0 2.5 Vp-p 1, 9 Die
Saturation Output Voltage,
Luminance
V
SAT
, Luma 1.2 1.75 Vp-p 1, 9 Die
Output Sensitivity
DV
OUT
/DN
e
12
mV/e
Design
Saturation Signal Charge,
Chroma
Ne,sat chroma 208,000 e
Design
Saturation Signal Charge,
Luminance
N
e,SAT
Luma 146,000 e
Design
Responsivity R, Chroma 2, 9, 10
Quantum Efficiency
Blue Channel @ 460 nm
Green Channel @ 540 nm
Red Channel @ 650 nm
Luma Channel @ 550 nm
QE, Chroma
QE, Luma
73
55
62
88
% 2, 9, 10
±10%
±10%
±10%
±10%
Design
Dynamic Range
Chroma
Luma
DR, Chroma
DR, Luma
80
75
dB 3 Design
Dark Noise, Chroma and Luma Noise, Dark 30 e
Design
Dark Signal Non-Uniformity,
Chroma
Luma
DSNU, Chroma
DSNU, Luma
2
2
16
16
mV p-p 14 Die
Dark Current
Chroma
Luma
I
DARK
, Chroma
I
DARK
, Luma
0.22
0.07
0.5
0.2
pA/Pixel 4 Die
Charge Transfer Efficiency
Chroma
Luma
CTE, Chroma
CTE, Luma
0.999995
0.999995
0.999998
0.999998
1
1
5 Die
Lag
Chroma
Luma
L, Chroma
L, Luma
0.05
0.1
1
1
% 1
st
Field Die
DC Output Offset V
ODC
5 6.6 8 V 9 Die
Photoresponse Non-Uniformity,
Low Frequency, Chroma
PRNUC, Low 6 20 % p-p 6 Die
Photoresponse Non-Uniformity,
Medium Frequency, Chroma
PRNUC, Med 6 20 % p-p 7 Die
Photoresponse Non-Uniformity,
High Frequency, Chroma
PRNUC, High 3 15 % 8 Die
Photoresponse Non-Uniformity,
Low Frequency, Luma
PRNUL, Low 6 20 % p-p 6 Die
Photoresponse Non-Uniformity,
Medium Frequency, Luma
PRNUL, Med 6 20 % p-p 7 Die
Photoresponse Non-Uniformity,
High Frequency, Luma
PRNUL, High 3 15 % 8 Die
Darkfield Defect, Brightpoint Dark Def 0 Allowed 12 Die

KLI-2104-DAA-EB-AA

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Image Sensors LINEAR CCD IMAGE SENSOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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