OP183
Rev. D | Page 16 of 16
OUTLINE DIMENSIONS
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
× 45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
41
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2440)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012-AA
Figure 41. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
S-Suffix
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model Temperature Range Package Description Package Option
OP183GS −40°C to +85°C 8-Lead SOIC_N S-Suffix (R-8)
OP183GS-REEL −40°C to +85°C 8-Lead SOIC_N S-Suffix (R-8)
OP183GS-REEL7 −40°C to +85°C 8-Lead SOIC_N S-Suffix (R-8)
OP183GSZ
1
−40°C to +85°C 8-Lead SOIC_N S-Suffix (R-8)
OP183GSZ-REEL
1
−40°C to +85°C 8-Lead SOIC_N S-Suffix (R-8)
OP183GSZ-REEL7
1
−40°C to +85°C 8-Lead SOIC_N S-Suffix (R-8)
1
Z = Pb free part.
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C00292-0-5/05(D)
