CY7C1021CV33-15VC

64K x 16 Static RAM
CY7C1021CV33
Cypress Semiconductor Corporation 3901 North First Street San Jose CA 95134 408-943-2600
Document #: 38-05132 Rev. *C Revised October 30, 2002
Features
Pin- and function-compatible with CY7C1021BV33
High speed
—t
AA
= 8, 10, 12, and 15 ns
CMOS for optimum speed/power
Low active power
360 mW (max.)
Data retention at 2.0V
Automatic power-down when deselected
Independent control of upper and lower bits
Available in 44-pin TSOP II, 400-mil SOJ, 48-ball FBGA
Functional Description
The CY7C1021CV33 is a high-performance CMOS static
RAM organized as 65,536 words by 16 bits. This device has
an automatic power-down feature that significantly reduces
power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE
) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE
) is LOW, then data from I/O pins (I/O
1
through I/O
8
), is
written into the location specified on the address pins (A
0
through A
15
). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O
9
through I/O
16
) is written into the location
specified on the address pins (A
0
through A
15
).
Reading from the device is accomplished by taking Chip
Enable (CE
) and Output Enable (OE) LOW while forcing the
Write Enable (WE
) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O
1
to I/O
8
. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O
9
to I/O
16
. See
the truth table at the end of this data sheet for a complete
description of Read and Write modes.
The input/output pins (I/O
1
through I/O
16
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a Write operation
(CE
LOW, and WE LOW).
The CY7C1021CV33 is available in standard 44-pin TSOP
Type II 400-mil-wide SOJ packages, as well as a 48-ball
FBGA.
Selection Guide
CY7C1021CV33-8 CY7C1021CV33-10 CY7C1021CV33-12 CY7C1021CV33-15 Unit
Maximum Access Time
8 101215ns
Maximum Operating Current
95 90 85 80 mA
Maximum CMOS Standby Current
5555mA
WE
Logic Block Diagram
Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
Top View
SOJ / TSOP II
12
13
41
44
43
42
16
15
29
30
V
CC
A
15
A
14
A
13
A
12
NC
A
4
A
3
OE
V
SS
A
5
I/O
16
A
2
CE
I/O
3
I/O
1
I/O
2
BHE
NC
A
1
A
0
18
17
20
19
I/O
4
27
28
25
26
22
21
23
24
NC
V
SS
I/O
7
I/O
5
I/O
6
I/O
8
A
6
A
7
BLE
V
CC
I/O
15
I/O
14
I/O
13
I/O
12
I/O
11
I/O
10
I/O
9
A
8
A
9
A
10
A
11
64K x 16
RAM Array
I/O
1
I/O
8
ROW DECODER
A
7
A
6
A
5
A
4
A
3
A
0
COLUMN DECODER
A
9
A
10
A
11
A
12
A
13
A
14
A
15
512 X 2048
SENSE AMPS
DATA IN DRIVERS
OE
A
2
A
1
I/O
9
I/O
16
CE
WE
BLE
BHE
A
8
CY7C1021CV33
Document #: 38-05132 Rev. *C Page 2 of 12
Pin Configuration
48-ball FBGA
WE
V
CC
A
11
A
10
NC
A
6
A
0
A
3
CE
I/O
10
I/O
8
I/O
9
A
4
A
5
I/O
11
I/O
13
I/O
12
I/O
14
I/O
15
V
SS
A
9
A
8
OE
V
SS
A
7
I/O
0
BHE
NC
A
2
A
1
BLE
V
CC
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
A
15
A
14
A
13
A
12
NC
NC
NC
3
2
6
5
4
1
D
E
B
A
C
F
G
H
(Top View)
NC
NC
CY7C1021CV33
Document #: 38-05132 Rev. *C Page 3 of 12
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................65°C to +150°C
Ambient Temperature with
Power Applied.............................................55°C to +125°C
Supply Voltage on V
CC
to Relative GND
[1]
.... 0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State
[1]
......................................0.5V to V
CC
+0.5V
DC Input Voltage
[1]
...................................0.5V to V
CC
+0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Latch-up Current......................................................>200 mA
Operating Range
Range Ambient Temperature V
CC
Commercial 0°C to +70°C 3.3V ± 10%
Industrial 40°C to +85°C 3.3V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description
Test
Conditions
1021CV33-8 1021CV33-10
1021CV33-12 1021CV33-15
UnitMin. Max. Min. Max. Min. Max. Min. Max.
V
OH
Output HIGH
Voltage
V
CC
= Min.,
I
OH
= 4.0 mA
2.4 2.4
2.4 2.4 V
V
OL
Output LOW
Voltage
V
CC
= Min.,
I
OL
= 8.0 mA
0.4 0.4
0.4 0.4 V
V
IH
Input HIGH Voltage 2.0 V
CC
+ 0.3
2.0 V
CC
+ 0.3
2.0 V
CC
+ 0.3
2.0 V
CC
+ 0.3
V
V
IL
Input LOW
Voltage
[1]
0.3 0.8 0.3 0.8 0.3 0.8 0.3 0.8 V
I
IX
Input Load Current GND < V
I
< V
CC
1 +1 1+11 +1 1 +1 µA
I
OZ
Output Leakage
Current
GND < V
I
< V
CC
,
Output Disabled
1 +1 1+11 +1 1 +1 µA
I
OS
Output Short Circuit
Current
[2]
V
CC
= Max.,
V
OUT
= GND
-300 300 300 300 mA
I
CC
V
CC
Operating
Supply Current
V
CC
= Max.,
I
OUT
= 0 mA,
f = f
MAX
= 1/t
RC
95 90 85 80 mA
I
SB1
Automatic CE
Power-Down
Current TTL
Inputs
Max. V
CC
, CE > V
IH
V
IN
> V
IH
or
V
IN
< V
IL
,
f = f
MAX
15 15 15 15 mA
I
SB2
Automatic CE
Power-Down
Current CMOS
Inputs
Max. V
CC
,
CE
> V
CC
0.3V, V
IN
>
V
CC
0.3V,
or V
IN
< 0.3V, f = 0
55
5 5 mA
Capacitance
[3]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
CC
= 3.3V
8 pF
C
OUT
Output Capacitance 8 pF
Notes:
1. V
IL
(min.) = 2.0V for pulse durations of less than 20 ns.
2. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
3. Tested initially and after any design or process changes that may affect these parameters.

CY7C1021CV33-15VC

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 1M PARALLEL 44SOJ
Lifecycle:
New from this manufacturer.
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