IRFB18N50KPBF

Document Number: 91100 www.vishay.com
S09-0015-Rev. A, 19-Jan-09 1
Power MOSFET
IRFB18N50K, SiHFB18N50K
Vishay Siliconix
FEATURES
Low Gate Charge Q
g
Results in Simple Drive
Requirement
Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
Fully Characterized Capacitance and Avalanche Voltage
and Current
•Low R
DS(on)
Lead (Pb)-free Available
APPLICATIONS
Switch Mode Power Supply (SMPS)
Uninterruptible Power Supply
High Speed Power Switching
Hard Switched and High Frequency Circuits
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
b. Starting T
J
= 25 °C, L = 2.5 mH, R
G
= 25 Ω, I
AS
= 17 A.
c. I
SD
17 A, dI/dt 376 A/µs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
PRODUCT SUMMARY
V
DS
(V) 500
R
DS(on)
(Ω)V
GS
= 10 V 0.26
Q
g
(Max.) (nC) 120
Q
gs
(nC) 34
Q
gd
(nC) 54
Configuration Single
N-Channel MOSFET
G
D
S
TO-220
G
D
S
Available
RoHS*
COMPLIANT
ORDERING INFORMATION
Package TO-220
Lead (Pb)-free
IRFB18N50KPbF
SiHFB18N50K-E3
SnPb
IRFB18N50K
SiHFB18N50K
ABSOLUTE MAXIMUM RATINGS T
C
= 25 °C, unless otherwise noted
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
500
V
Gate-Source Voltage V
GS
± 30
Continuous Drain Current V
GS
at 10 V
T
C
= 25 °C
I
D
17
AT
C
= 100 °C 11
Pulsed Drain Current
a
I
DM
68
Linear Derating Factor 1.8 W/°C
Single Pulse Avalanche Energy
b
E
AS
370 mJ
Repetitive Avalanche Current
a
I
AR
17 A
Repetitive Avalanche Energy
a
E
AR
22 mJ
Maximum Power Dissipation T
C
= 25 °C P
D
220 W
Peak Diode Recovery dV/dt
c
dV/dt 7.8 V/ns
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature) for 10 s 300
d
Mounting Torque 6-32 or M3 screw 10 N
* Pb containing terminations are not RoHS compliant, exemptions may apply
www.vishay.com Document Number: 91100
2 S09-0015-Rev. A, 19-Jan-09
IRFB18N50K, SiHFB18N50K
Vishay Siliconix
Note
a. R
th
is measured at T
J
approximately 90 °C.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 µs; duty cycle 2 %.
c. C
oss
eff. is a fixed capacitance that givs the same charging time as C
oss
while V
DS
is rising from 0 to 80 % V
DS
.
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient
a
R
thJA
-58
°C/WCase-to-Sink, Flat, Greased Surface R
thCS
0.50 -
Maximum Junction-to-Case (Drain)
a
R
thJC
-0.56
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA 500 - - V
V
DS
Temperature Coefficient ΔV
DS
/T
J
Reference to 25 °C, I
D
= 1 mA - 0.59 - V/°C
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 3.0 - 5.0 V
Gate-Source Leakage I
GSS
V
GS
= ± 30 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 500 V, V
GS
= 0 V - - 50
µA
V
DS
= 400 V, V
GS
= 0 V, T
J
= 125 °C - - 250
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 10 A
b
- 0.26 0.29 Ω
Forward Transconductance g
fs
V
DS
= 50 V, I
D
= 10 A 6.4 - - S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
- 2830 -
pF
Output Capacitance C
oss
- 330 -
Reverse Transfer Capacitance C
rss
-38-
Output Capacitance C
oss
V
GS
= 0 V
V
DS
= 1.0 V, f = 1.0 MHz - 3310 -
V
DS
= 400 V, f = 1.0 MHz - 93 -
Effective Output Capacitance C
oss
eff. V
DS
= 0 V to 400 V
c
- 155 -
Total Gate Charge Q
g
V
GS
= 10 V
I
D
= 17 A, V
DS
= 400 V,
see fig. 6 and 13
b
- - 120
nC Gate-Source Charge Q
gs
--34
Gate-Drain Charge Q
gd
--54
Turn-On Delay Time t
d(on)
V
DD
= 250 V, I
D
= 17 A,
R
G
= 7.5 Ω, see fig. 10
b
-22-
ns
Rise Time t
r
-60-
Turn-Off Delay Time t
d(off)
-45-
Fall Time t
f
-30-
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--17
A
Pulsed Diode Forward Current
a
I
SM
--68
Body Diode Voltage V
SD
T
J
= 25 °C, I
S
= 17 A, V
GS
= 0 V
b
--1.5V
Body Diode Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= 17 A, dI/dt = 100 A/µs
b
- 520 780 ns
Body Diode Reverse Recovery Charge Q
rr
-5.38.0µC
Forward Turn-On Time t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
S
D
G
Document Number: 91100 www.vishay.com
S09-0015-Rev. A, 19-Jan-09 3
IRFB18N50K, SiHFB18N50K
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Fig. 1 - Typical Output Characteristics
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
10
100
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
5.0V
20µs PULSE WIDTH
Tj = 25°C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.01
0.1
1
10
100
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
5.0V
20µs PULSE WIDTH
Tj = 150°C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
5.0 6.0 7.0 8.0 9.0 10.0
V
GS
, Gate-to-Source Voltage (V)
0.01
0.10
1.00
10.00
100.00
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t (A)
T
J
= 25°C
T
J
= 150°C
V
DS
= 100V
20µs PULSE WIDTH
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
17A

IRFB18N50KPBF

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 781-SIHP18N50C-E3
Lifecycle:
New from this manufacturer.
Delivery:
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