LTC4300A-3IMS8#PBF

LTC4300A-3
10
4300a3fa
5V to 3.3V Level Translator and Power Supply
Redundancy
Systems requiring different supply voltages for the back-
plane side and the card side can use the LTC4300A-3, as
shown in Figure 5. The pull-up resistors on the card side
connect from SDAOUT to SCLOUT to V
CC2
, and those on
the backplane side connect from SDAIN and SCLIN to V
CC
.
The LTC4300A-3 functions for voltages ranging from 2.7V
to 5.5V on both V
CC
and V
CC2
. There is no constraint on
the voltage magnitudes of V
CC
and V
CC2
with respect to
each other.
This application also provides power supply redundancy.
If the V
CC2
voltage falls below its UVLO threshold, the
LTC4300A-3 disconnects the backplane from the card,
so that the backplane can continue to function. If the
V
CC
voltage falls below its UVLO threshold and the V
CC2
voltage remains active, hold ENABLE at ground to ensure
proper operation.
applicaTions inForMaTion
Figure 4. The LTC4300A-3 in a Custom Application. Making ENABLE the Shortest Pin Ensures that
V
CC
and V
CC2
Connect Before ENABLE Is Allowed to Go High, Connecting the Card to the Backplane
V
CC
SDAIN
SCLIN
V
CC2
GND
SDAOUT
SCLOUT
ENABLE
4300A-3 F04
I/O PERIPHERAL CARD 1
LTC4300A-3
C2
0.01µF
CARD_SCL
CARD_SDA
R7
10k
R8
10k
V
CC2
BACKPLANE
BACKPLANE
CONNECTOR
SDA
SCL
ENA2
ENA1
V
CC
C1
0.01µF
V
CC
SDAIN
SCLIN
V
CC2
GND
SDAOUT
SCLOUT
ENABLE
I/O PERIPHERAL CARD 2
LTC4300A-3
C4
0.01µF
CARD2_SCL
CARD2_SDA
C3
0.01µF
STAGGERED CONNECTORSTAGGERED CONNECTOR
R1
10k
R2
10k
R3
10k
R4
10k
R5
10k
R6
10k
LTC4300A-3
11
4300a3fa
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 ±0.05
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ±0.05
(2 SIDES)2.10 ±0.05
0.50
BSC
0.70 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
LTC4300A-3
12
4300a3fa
MSOP (MS8) 0307 REV F
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 ±0.0508
(.004 ±.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
1 2
3
4
4.90 ±0.152
(.193 ±.006)
8
7
6
5
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ±.0015)
TYP
0.65
(.0256)
BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

LTC4300A-3IMS8#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Interface - Signal Buffers, Repeaters 2-Wire Bus Buffer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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