LTC4300A-3IMS8#PBF

LTC4300A-3
7
4300a3fa
operaTion
Start-Up
When the LTC4300A-3 first receives power on its V
CC
pin,
either during power-up or during live insertion, it starts
in an undervoltage lockout (UVLO) state, ignoring any
activity on the SDA and SCL pins until V
CC
rises above
2.5V. The part also waits for V
CC2
to rise above 2V. This
ensures that the part does not try to function until it has
enough voltage to do so.
During this time, the 1V precharge circuitry is also ac-
tive and forces 1V through 100k nominal resistors to the
SDA and SCL pins. Because the I/O card is being plugged
into a live backplane, the voltage on the backplane SDA
and SCL busses may be anywhere between 0V and V
CC
.
Precharging the SCL and SDA pins to 1V minimizes the
worst-case voltage differential these pins will see at the
moment of connection, therefore minimizing the amount
of disturbance caused by the I/O card.
Once the LTC4300A-3 comes out of UVLO, it assumes that
SDAIN and SCLIN have been inserted into a live system
and that SDAOUT and SCLOUT are being powered up at the
same time as itself. Therefore, it looks
for either a stop bit
or bus idle condition on the backplane side to indicate the
completion of a data transaction. When either one occurs,
the part also verifies that both the SDAOUT and SCLOUT
voltages are high. When all of these conditions are met,
the input-to-output connection circuitry is activated, joining
the SDA and SCL busses on the I/O card with those on
the backplane, and the rise time accelerators are enabled.
Connection Circuitry
Once the connection circuitry is activated, the functionality
of the SDAIN and SDAOUT pins is identical. A low forced on
either pin at any time results in both pin voltages being low.
For proper operation, logic low input voltages should be
no higher than 0.4V with respect to the ground pin voltage
of the LTC4300A-3. SDAIN and SDAOUT enter a logic high
state only when all devices on both SDAIN and SDAOUT
release high. The same is true for SCLIN and SCLOUT.
This important feature ensures that clock stretching, clock
synchronization, arbitration and the acknowledge protocol
always work, regardless of how the devices in the system
are tied to the LTC4300A-3.
Another key feature of the connection circuitry is that
it
provides
bidirectional buffering, keeping the backplane
and card capacitances isolated. Because of this isolation,
the waveforms on the backplane busses look slightly
different than the corresponding card bus waveforms, as
described here.
Input to Output Offset Voltage
When a logic low voltage, V
LOW1
, is driven on any of
the LTC4300A-3’s data or clock pins, the LTC4300A-3
regulates the voltage on the other side of the part (call
it V
LOW2
) to a slightly higher voltage, as directed by the
following equation (typical):
V
LOW2
= V
LOW1
+ 75mV + (V
CC
/R) • 70 [Ω]
where R is the bus pull-up resistance in ohms. For ex-
ample, if a device is forcing SDAOUT to 10mV where
V
CC
= 3.3V and the pull-up resistor R on SDAIN is 10k,
then the voltage on SDAIN = 10mV + 75mV + (3.3/10000)
70 = 108mV (typical). See the Typical Performance Char-
acteristics section for curves showing the offset voltage
as a function of V
CC
and R.
Propagation Delays
During a rising edge, the rise time on each side is determined
by the combined pull-up current of the LTC4300A-3 boost
current and the bus resistor and the equivalent capacitance
on the line. If the pull-up
currents are the same, a differ-
ence
in rise time occurs which is directly proportional to
the difference in capacitance between the two sides. This
effect is displayed in Figure 1 for V
CC
= V
CC2
= 3.3V and
a 10k pull-up resistor on each side (50pF on one side
and 150pF on the other). Since the output side has less
capacitance than the input, it rises faster and the effective
propagation delay is negative.
There is a finite propagation delay through the connection
circuitry for falling waveforms. Figure 2 shows the falling
edge waveforms for the same V
CC
, pull-up resistors and
equivalent capacitance conditions as used in Figure 1.
An external NMOS device pulls down the voltage on
the side with 150pF capacitance; the LTC4300A-3 pulls
down the voltage on the opposite side, with a delay of
55ns. This delay is always positive and is a function of
LTC4300A-3
8
4300a3fa
supply voltage, temperature and the pull-up resistors and
equivalent bus capacitances on both sides of the bus. The
Typical Performance Characteristics section shows t
PHL
as a function of temperature and voltage for 10k pull-up
resistors and 100pF equivalent capacitance on both sides
of the part. By comparison with Figure 2, the V
CC
= V
CC2
= 3.3V curve shows that increasing the capacitance from
50pF to 100pF results in a propagation delay increase
from 55ns to 75ns. Larger output capacitances translate
to longer delays (up to 150ns). Users must quantify the
difference in propagation times for a rising edge versus
a falling edge in their systems and adjust setup and hold
times accordingly.
Rise Time Accelerators
Once connection has been established, rise time accelerator
circuits on all four SDA and SCL pins are activated. These
allow the user to choose weaker DC pull-up currents on
the bus, reducing power consumption while still meet-
ing system rise time requirements. During positive bus
transitions, the LTC4300A-3 switches in 2mA (typical) of
current to quickly slew the SDA and SCL lines once their
DC voltages exceed 0.6V. Using a general rule of 20pF of
capacitance for every device on the
bus (10pF f
or the device
and 10pF for interconnect), choose a pull-up current so that
the bus will rise on its own at a rate of at least 1.25V/µs
to guarantee activation of the accelerators.
For example, assume an SMBus system with V
CC
= 3V,
a 10k pull-up resistor and equivalent bus capacitance of
200pF. The rise time of an SMBus system is calculated
from (V
IL(MAX)
– 0.15V) to (V
IH(MIN)
+ 0.15V), or 0.65V
to 2.25V. It takes an RC circuit 0.92 time constants to
traverse this voltage for a 3V supply; in this case, 0.92
(10k 200pF) = 1.84µs. Thus, the system exceeds the
maximum allowed rise time ofs by 84%. However,
using the rise time accelerators, which are activated at a
DC threshold of below 0.65V, the worst-case rise time is:
(2.25V – 0.65V) • 200pF/1mA = 320ns, which meets the
1µs rise time requirement.
ENABLE Low Current Disable
Grounding the ENABLE pin disconnects the backplane side
from the card side, disables the rise time accelerators,
disables the bus precharge circuitry and puts the part in a
near-zero current state. When the pin voltage is driven all
the way to V
CC
, the part waits for data transactions on both
the backplane and card sides to be complete (as described
in the Start-Up section) before reconnecting the two sides.
Figure 1. Input–Output Connection Low to High Transition Figure 2. Input–Output Connection High to Low Transition
200ns/DIV
OUTPUT
SIDE
50pF
0.5V/DIV
4300a3 F01
INPUT
SIDE
150pF
200ns/DIV
INPUT
SIDE
150pF
0.5V/DIV
4300a3 F02
OUTPUT
SIDE
50pF
LTC4300A-3
9
4300a3fa
Resistor Pull-Up Value Selection
The system pull-up resistors must be strong enough to
provide a positive slew rate of 1.25V/µs on the SDA and
SCL pins, in order to activate the boost pull-up currents
during rising edges. Choose maximum resistor value R
using the formula:
R ≤ (V
CC(MIN)
– 0.6)(800,000)/C
where R is the pull-up resistor value in ohms, V
CC(MIN)
is the minimum V
CC
voltage and C is the equivalent bus
capacitance in picofarads (pF).
In addition, regardless of the bus capacitance, always
choose R ≤ 16k for V
CC
= 5.5V maximum, R ≤ 24k for
V
CC
= 3.6V maximum. The start-up circuitry requires
logic high voltages on SDAOUT and SCLOUT to connect
the backplane to the card, and these pull-up values are
needed to overcome the precharge voltage.
applicaTions inForMaTion
Figure 3. The LTC4300A-3 in a PCI Application Where All the Pins Have the Same Length.
ENABLE Should Be Held Low Until All Transients Associated with the Live Insertion Have Settled
Live Insertion and Capacitance Buffering Application
Figures 3 and 4 illustrate the usage of the LTC4300A-3
in applications that take advantage of both its Hot Swap
controlling and capacitance buffering features. In all of
these
applications, note that if the I/O cards were plugged
directly into the backplane, all of the backplane and card
capacitances would add directly together, making rise-
and fall time requirements difficult to meet. Placing a
LTC4300A-3 on the edge of each card, however, isolates
the card capacitance from the backplane. For a given I/O
card, the LTC4300A-3 drives the capacitance of every-
thing on the card and the backplane must drive only the
capacitance of the LTC4300A-3, which is less than 10pF.
V
CC
SDAIN
SCLIN
V
CC2
GND
SDAOUT
SCLOUT
ENABLE
4300a3 F03
R2
10k
R3
10k
R1
10k
R4
10k
R5
10k
R6
10k
I/O PERIPHERAL CARD 1
LTC4300A-3
C2 0.01µF
CARD_SCL
CARD_SDA
R7
10k
R8
10k
V
CC2
BACKPLANE
BACKPLANE
CONNECTOR
SDA
SCL
ENA2
ENA1
V
CC
C1
0.01µF
V
CC
SDAIN
SCLIN
V
CC2
GND
SDAOUT
SCLOUT
ENABLE
I/O PERIPHERAL CARD 2
LTC4300A-3
C4 0.01µF
CARD2_SCL
CARD2_SDA
C3
0.01µF

LTC4300A-3IMS8#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Interface - Signal Buffers, Repeaters 2-Wire Bus Buffer
Lifecycle:
New from this manufacturer.
Delivery:
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