MC74LCX138DTR2

MC74LCX138
http://onsemi.com
4
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V
CC
Supply Voltage Operating Data Retention Only 2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
V
I
Input Voltage 0 5.5 V
V
O
Output Voltage (HIGH or LOW State) (3−State) 0 V
CC
V
I
OH
HIGH Level Output Current V
CC
= 3.0 V − 3.6 V
V
CC
= 2.7 V − 3.0 V
V
CC
= 2.3 V − 2.7 V
−24
−12
−8
mA
I
OL
LOW Level Output Voltage V
CC
= 3.0 V − 3.6 V
V
CC
= 2.7 V − 3.0 V
V
CC
= 2.3 V − 2.7 V
+24
+12
+8
mA
T
A
Operating Free−Air Temperature −40 +85 °C
t/V Input Transition Rise or Fall Rate, V
IN
from 0.8 V to 2.0 V, V
CC
= 3.0 V 0 10 ns/V
DC ELECTRICAL CHARACTERISTICS
T
A
= −40°C to +85°C
Symbol Characteristic Condition Min Max Unit
V
IH
HIGH Level Input Voltage (Note 2) 2.3 V V
CC
2.7 V 1.7 V
2.7 V V
CC
3.6 V 2.0
V
IL
LOW Level Input Voltage (Note 2) 2.3 V V
CC
2.7 V 0.7 V
2.7 V V
CC
3.6 V 0.8
V
OH
HIGH Level Output Voltage 2.3 V V
CC
3.6 V; I
OH
= −100 A V
CC
0.2 V
V
CC
= 2.3 V; I
OH
= −8 mA 1.8
V
CC
= 2.7 V; I
OH
= −12 mA 2.2
V
CC
= 3.0 V; I
OH
= −18 mA 2.4
V
CC
= 3.0 V; I
OH
= −24 mA 2.2
V
OL
LOW Level Output Voltage 2.3 V V
CC
3.6 V; I
OL
= 100 A 0.2 V
V
CC
= 2.3 V; I
OL
= 8 mA 0.6
V
CC
= 2.7 V; I
OL
= 12 mA 0.4
V
CC
= 3.0 V; I
OL
= 16 mA 0.4
V
CC
= 3.0 V; I
OL
= 24 mA 0.55
I
I
Input Leakage Current 2.3 V V
CC
3.6 V; 0 V V
I
5.5 V ±5 A
I
CC
Quiescent Supply Current 2.3 V
CC
3.6 V; V
I
= GND or V
CC
10 A
2.3 V
CC
3.6 V; 3.6 V
I
or V
O
5.5 V ±10
I
CC
Increase in I
CC
per Input 2.3 V
CC
3.6 V; V
IH
= V
CC
− 0.6 V 500 A
2. These values of V
I
are used to test DC electrical characteristics only.
AC CHARACTERISTICS t
R
= t
F
= 2.5 ns; R
L
= 500
Limits
T
A
= −40°C to +85°C
V
CC
= 3.3 V ± 0.3 V V
CC
= 2.7 V V
CC
= 2.5 V ± 0.2 V
C
L
= 50 pF C
L
= 50 pF C
L
= 30 pF
Symbol Parameter Waveform Min Max Min Max Min Max Unit
t
PLH
t
PHL
Propagation Delay
An to On
1, 2 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
t
PLH
t
PHL
Propagation Delay
E1, E2 to On
2 1.5
1.5
6.5
6.5
1.5
1.5
7.5
7.5
1.5
1.5
8.4
8.4
ns
t
PLH
t
PHL
Propagation Delay
E3 to On
1 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
t
OSHL
t
OSLH
Output−to−Output Skew
(Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
MC74LCX138
http://onsemi.com
5
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
IN
Input Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
7 pF
C
OUT
Output Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
25 pF
V
CC
0 V
V
OH
V
OL
An, E3
O
n
t
PLH
t
PHL
Vmi
Vmo
Vmo
Vmi
WAVEFORM 2: PROPAGATION DELAYS FOR NON−INVERTING OUTPUTS
2.7 V
0 V
V
OH
V
OL
An, E1, E2
On
t
PLH
t
PHL
WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING OUTPUTS
Vmi
Vmo
Vmo
Vmi
Vcc
Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V
Vmi 1.5 V 1.5 V Vcc/2
Vmo 1.5 V 1.5 V Vcc/2
Figure 4. AC Waveforms
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
C
L
Figure 5. Test Circuit
C
L
= 50 pF at V
CC
= 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)
C
L
= 30 pF at V
CC
= 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)
R
L
= R
1
= 500 or equivalent
R
T
= Z
OUT
of pulse generator (typically 50 )
MC74LCX138
http://onsemi.com
6
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.

SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N

MC74LCX138DTR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC DECODER/DEMUX 3-8 16-TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
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