BC639_BCP56_BCX56_8 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 08 — 22 June 2007 4 of 15
NXP Semiconductors
BC639; BCP56; BCX56
80 V, 1 A NPN medium power transistors
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 100 V
V
CEO
collector-emitter voltage open base - 80 V
V
EBO
emitter-base voltage open collector - 5 V
I
C
collector current - 1 A
I
CM
peak collector current single pulse;
t
p
1ms
- 1.5 A
I
BM
peak base current single pulse;
t
p
1ms
- 0.2 A
P
tot
total power dissipation T
amb
25 °C
BC639
[1]
- 0.83 W
BCP56
[1]
- 0.64 W
[2]
- 0.96 W
BCX56
[1]
- 0.5 W
[2]
- 0.85 W
[3]
- 1.25 W
T
j
junction temperature - 150 °C
T
amb
ambient temperature 65 +150 °C
T
stg
storage temperature 65 +150 °C
BC639_BCP56_BCX56_8 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 08 — 22 June 2007 5 of 15
NXP Semiconductors
BC639; BCP56; BCX56
80 V, 1 A NPN medium power transistors
FR4 PCB, standard footprint (1) FR4 PCB, mounting pad for collector 1 cm
2
(2) FR4 PCB, standard footprint
Fig 1. Power derating curve SOT54 Fig 2. Power derating curves SOT223
(1) FR4 PCB, mounting pad for collector 6 cm
2
(2) FR4 PCB, mounting pad for collector 1 cm
2
(3) FR4 PCB, standard footprint
Fig 3. Power derating curves SOT89
T
amb
(°C)
75 1751252507525
006aaa085
0.8
0.4
1.2
1.6
P
tot
(W)
0
T
amb
(°C)
75 1751252507525
006aaa086
0.8
0.4
1.2
1.6
P
tot
(W)
0
(1)
(2)
T
amb
(°C)
75 1751252507525
006aaa087
0.8
0.4
1.2
1.6
P
tot
(W)
0
(1)
(2)
(3)
BC639_BCP56_BCX56_8 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 08 — 22 June 2007 6 of 15
NXP Semiconductors
BC639; BCP56; BCX56
80 V, 1 A NPN medium power transistors
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
BC639
[1]
- - 150 K/W
BCP56
[1]
- - 195 K/W
[2]
- - 130 K/W
BCX56
[1]
- - 250 K/W
[2]
- - 145 K/W
[3]
- - 100 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
BC639 - - 40 K/W
BCP56 - - 17 K/W
BCX56 - - 30 K/W
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT54;
typical values
006aaa088
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
0
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01

BC639,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
TRANS NPN 80V 1A TO-92
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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