Data Sheet DAC8412/DAC8413
Rev. G | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= +25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
SS
to V
DD
−0.3 V, +33.0 V
V
SS
to V
LOGIC
−0.3 V, +33.0 V
V
LOGIC
to DGND −0.3 V, +7.0 V
V
SS
to V
REFL
−0.3 V, +V
SS
− 2.0 V
V
REFH
to V
DD
+2.0 V, +33.0 V
V
REFH
to V
REFL
+2.0 V, V
SS
− V
DD
SS
Digital Input Voltage to DGND −0.3 V, V
LOGIC
+ 0.3 V
Digital Output Voltage to DGND −0.3 V, +7.0 V
Operating Temperature Range
EP, FP, FPC −40°C to +85°C
AT, BT, BTC −55°C to +125°C
Junction Temperature 150°C
Storage Temperature Range −65°C to +150°C
Power Dissipation Package 1000 mW
Lead Temperature JEDEC Industry Standard
Soldering J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case mounting conditions, that is, a
device in socket.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
28-Lead Plastic DIP (PDIP) 48 22 °C/W
28-Terminal Ceramic Leadless Chip Carrier (LLC)
28-Lead Plastic Leaded Chip Carrier (PLLC)
28-Lead Ceramic Dual In-Line Package (CERDIP) 51 9 °C/W
ESD CAUTION
