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DLM11SN900HZ2L

P1-P3P4-P6P7-P9P10-P10
Spec No. JEFL243C-9116D-01 P7/10
MURATA MFG.CO.,LTD
Reference Only
15.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
15.3 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
15.4 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
Products shall be location the sideways
Direction (Length : a<b) to the machanical
Stress.
(2) Components location on P.C.B. separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection
that occurs during the tightening of the screw. Mount the component in a position as far away
from the screw holes as possible.
〈
Poor example
〉
〈
Good example
〉
b
a
D
Perforation
Slit
A
B
C
Screw Hole
Recommended
Spec No. JEFL243C-9116D-01 P8/10
MURATA MFG.CO.,LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
15.5 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
15.6 Attention Regarding P.C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 1005 size or the equivalents.
15.7 Standard Land Dimensions
○
×
×
○
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
○
×
0.55
0.85
0.30
0.55
1.95
*(1)(2)(3)(4)Indicates terminal number
Resist
Copper foil pattern
No pattern
(in : mm)
(1) (2)
(4) (3)
Spec No. JEFL243C-9116D-01 P9/10
MURATA MFG.CO.,LTD
Reference Only
15.8 Soldering(Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C、10s
Cycle of reflow 2 times 2 times
(1) Standard printing pattern of solder paste
• Standard thickness of the solder paste should be 100 to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
• Use Sn-3.0Ag-0.5Cu solder.
(2) Reworking with Soldering iron
• The following conditions shall be strictly followed when using a soldering iron after
being mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 380°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
• Do not touch the products directly with the tip of the soldering iron.
(3) Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
Standard Profile
Limit Profile
Temp.
Time
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
(s)
(℃)
）
1/3 T ≦ ｔ ≦ T （T : Chi
p
thickness）
t
Upper Limit
Upper Limit
Recommendable
Recommendable
(in：mm)
0.55
0.30
0.70
0.55
0.70
P1-P3P4-P6P7-P9P10-P10

DLM11SN900HZ2L

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Common Mode Chokes Dual 90Ohm 100MHz 100mA 1.38Ohm DCR SMD Automotive T/R
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