CY7C1339G
Document #: 38-05520 Rev. *F Page 10 of 18
Switching Characteristics Over the Operating Range
[12, 13, 14, 15, 16, 17]
Parameter Description
–250 –200 –166 –133
UnitMin. Max. Min. Max. Min. Max. Min. Max.
t
POWER
V
DD
(Typical) to the first Access
[12]
1111ms
Clock
t
CYC
Clock Cycle Time 4.0 5.0 6.0 7.5 ns
t
CH
Clock HIGH 1.7 2.0 2.5 3.0 ns
t
CL
Clock LOW 1.7 2.0 2.5 3.0 ns
Output Times
t
CO
Data Output Valid After CLK Rise 2.6 2.8 3.5 4.0 ns
t
DOH
Data Output Hold After CLK Rise 1.0 1.0 1.5 1.5 ns
t
CLZ
Clock to Low-Z
[13, 14, 15]
0000ns
t
CHZ
Clock to High-Z
[13, 14, 15]
2.6 2.8 3.5 4.0 ns
t
OEV
OE LOW to Output Valid 2.6 2.8 3.5 4.0 ns
t
OELZ
OE LOW to Output Low-Z
[13, 14, 15]
0000ns
t
OEHZ
OE HIGH to Output High-Z
[13, 14, 15]
2.6 2.8 3.5 4.0 ns
Set-up Times
t
AS
Address Set-up Before CLK Rise 1.2 1.2 1.5 1.5 ns
t
ADS
ADSC, ADSP Set-up Before CLK Rise 1.2 1.2 1.5 1.5 ns
t
ADVS
ADV Set-up Before CLK Rise 1.2 1.2 1.5 1.5 ns
t
WES
GW, BWE, BW
X
Set-up Before CLK Rise 1.2 1.2 1.5 1.5 ns
t
DS
Data Input Set-up Before CLK Rise 1.2 1.2 1.5 1.5 ns
t
CES
Chip Enable Set-Up Before CLK Rise 1.2 1.2 1.5 1.5 ns
Hold Times
t
AH
Address Hold After CLK Rise 0.3 0.5 0.5 0.5 ns
t
ADH
ADSP, ADSC Hold After CLK Rise 0.3 0.5 0.5 0.5 ns
t
ADVH
ADV Hold After CLK Rise 0.3 0.5 0.5 0.5 ns
t
WEH
GW, BWE, BW
X
Hold After CLK Rise 0.3 0.5 0.5 0.5 ns
t
DH
Data Input Hold After CLK Rise 0.3 0.5 0.5 0.5 ns
t
CEH
Chip Enable Hold After CLK Rise 0.3 0.5 0.5 0.5 ns
Notes:
12.This part has a voltage regulator internally; t
POWER
is the time that the power needs to be supplied above V
DD
(minimum) initially before a read or write operation
can be initiated.
13. t
CHZ
, t
CLZ
,t
OELZ
, and t
OEHZ
are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.
14.At any given voltage and temperature, t
OEHZ
is less than t
OELZ
and t
CHZ
is less than t
CLZ
to eliminate bus contention between SRAMs when sharing the same
data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed
to achieve High-Z prior to Low-Z under the same system conditions.
15.This parameter is sampled and not 100% tested.
16.Timing reference level is 1.5V when V
DDQ
= 3.3V and is 1.25V when V
DDQ
= 2.5V.
17.Test conditions shown in (a) of AC Test Loads unless otherwise noted.
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CY7C1339G
Document #: 38-05520 Rev. *F Page 11 of 18
Switching Waveforms
Read Cycle Timing
[18]
Note:
18.On this diagram, when CE
is LOW, CE
1
is LOW, CE
2
is HIGH and CE
3
is LOW. When CE is HIGH, CE
1
is HIGH or CE
2
is LOW or CE
3
is HIGH.
t
CYC
t
CL
CLK
ADSP
t
ADH
t
ADS
ADDRESS
t
CH
OE
ADSC
CE
t
AH
t
AS
A1
t
CEH
t
CES
GW, BWE,
BW[A:D]
D
ata Out (Q)
High-Z
t
CLZ
t
DOH
t
CO
ADV
t
OEHZ
t
CO
Single READ BURST READ
t
OEV
t
OELZ
t
CHZ
ADV
suspends
burst.
Burst wraps around
to its initial state
t
ADVH
t
ADVS
t
WEH
t
WES
t
ADH
t
ADS
Q(A2)
Q(A2 + 1)
Q(A2 + 2)
Q(A1)
Q(A2)
Q(A2 + 1)
Q(A2 + 3)
A2 A3
Deselect
cycle
Burst continued with
new base address
DON’T CARE
UNDEFINED
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CY7C1339G
Document #: 38-05520 Rev. *F Page 12 of 18
Write Cycle Timing
[18, 19]
Note:
19.
Full width write can be initiated by either GW
LOW; or by GW HIGH, BWE LOW and BW
[A:D]
LOW.
Switching Waveforms (continued)
t
CYC
t
CL
CLK
ADSP
t
ADH
t
ADS
ADDRESS
t
CH
OE
ADSC
CE
t
AH
t
AS
A1
t
CEH
t
CES
BWE,
BW[A :D]
D
ata Out (Q)
High-Z
ADV
BURST READ BURST WRITE
D(A2)
D(A2 + 1) D(A2 + 1)
D(A1)
D(A3)
D(A3 + 1)
D(A3 + 2)
D(A2 + 3)
A2 A3
Data In (D)
Extended BURST WRITE
D(A2 + 2)
Single WRITE
t
ADH
t
ADS
t
ADH
t
ADS
t
OEHZ
t
ADVH
t
ADVS
t
WEH
t
WES
t
DH
t
DS
GW
t
WEH
t
WES
Byte write signals are
ignored for first cycle when
ADSP initiates burst
ADSC extends burst
ADV suspends burst
DON’T CARE
UNDEFINED
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CY7C1339G-133AXE

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 4M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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