CY7C1339G
Document #: 38-05520 Rev. *F Page 7 of 18
Partial Truth Table for Read/Write
[2, 8]
Function GW BWE BW
D
BW
C
BW
B
BW
A
Read HHXXXX
Read HLHHHH
Write Byte A DQ
A
HLHHHL
Write Byte B – DQ
B
HLHHLH
Write Bytes B, A H L H H L L
Write Byte C– DQ
C
HLHLHH
Write Bytes C, A H L H L H L
Write Bytes C, B H L H L L H
Write Bytes C, B, A H L H L L L
Write Byte D– DQ
D
HLLHHH
Write Bytes D, A H L L H H L
Write Bytes D, B H L L H L H
Write Bytes D, B, A H L L H L L
Write Bytes D, C H L L L H H
Write Bytes D, C, A H L L L H L
Write Bytes D, C, B HLLLLH
Write All Bytes HLLLLL
Write All Bytes LXXXXX
Note:
8.Table only lists a partial listing of the byte write combinations. Any combination of BW
X
is valid. Appropriate write will be done based on which byte write is active.
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CY7C1339G
Document #: 38-05520 Rev. *F Page 8 of 18
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on V
DD
Relative to GND........–0.5V to +4.6V
Supply Voltage on V
DDQ
Relative to GND ......–0.5V to +V
DD
DC Voltage Applied to Outputs
in tri-state ............................................ –0.5V to V
DDQ
+ 0.5V
DC Input Voltage ...................................–0.5V to V
DD
+ 0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... > 200 mA
Operating Range
Range
Ambient
Temperature V
DD
V
DDQ
Commercial 0°C to +70°C 3.3V
–5%/+10%
2.5V –5%
to V
DD
Industrial –40°C to +85°C
Automotive –40°C to +125°C
Electrical Characteristics Over the Operating Range
[9, 10]
Parameter Description Test Conditions Min. Max. Unit
V
DD
Power Supply Voltage 3.135 3.6 V
V
DDQ
I/O Supply Voltage 2.375 V
DD
V
V
OH
Output HIGH Voltage for 3.3V I/O, I
OH
= –4.0 mA 2.4 V
for 2.5V I/O, I
OH
= –1.0 mA 2.0 V
V
OL
Output LOW Voltage for 3.3V I/O, I
OL
= 8.0 mA 0.4 V
for 2.5V I/O, I
OL
= 1.0 mA 0.4 V
V
IH
Input HIGH Voltage
[9]
for 3.3V I/O 2.0 V
DD
+ 0.3V V
for 2.5V I/O 1.7 V
DD
+ 0.3V V
V
IL
Input LOW Voltage
[9]
for 3.3V I/O –0.3 0.8 V
for 2.5V I/O –0.3 0.7 V
I
X
Input Leakage Current
except ZZ and MODE
GND V
I
V
DDQ
–5 5 µA
Input Current of MODE Input = V
SS
–30 µA
Input = V
DD
5 µA
Input Current of ZZ Input = V
SS
–5 µA
Input = V
DD
30 µA
I
OZ
Output Leakage Current GND V
I
V
DDQ,
Output Disabled –5 5 µA
I
DD
V
DD
Operating Supply
Current
V
DD
= Max., I
OUT
= 0 mA,
f = f
MAX
= 1/t
CYC
4-ns cycle, 250 MHz 325 mA
5-ns cycle, 200 MHz 265 mA
6-ns cycle, 166 MHz 240 mA
7.5-ns cycle, 133 MHz 225 mA
I
SB1
Automatic CE
Power-down
Current—TTL Inputs
V
DD
= Max, Device Deselected,
V
IN
V
IH
or V
IN
V
IL
f = f
MAX
= 1/t
CYC
4-ns cycle, 250 MHz 120 mA
5-ns cycle, 200 MHz 110 mA
6-ns cycle, 166 MHz 100 mA
Industrial/
Commercial
7.5-ns cycle, 133 MHz 90 mA
Automotive 7.5-ns cycle, 133 MHz 115 mA
I
SB2
Automatic CE
Power-down
Current—CMOS Inputs
V
DD
= Max, Device Deselected,
V
IN
0.3V or V
IN
> V
DDQ
– 0.3V,
f = 0
All speeds 40 mA
Notes:
9. Overshoot: V
IH
(AC) < V
DD
+1.5V (Pulse width less than t
CYC
/2), undershoot: V
IL
(AC) > –2V (Pulse width less than t
CYC
/2).
10.TPower-up: Assumes a linear ramp from 0V to V
DD
(min.) within 200 ms. During this time V
IH
< V
DD
and V
DDQ
< V
DD
.
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CY7C1339G
Document #: 38-05520 Rev. *F Page 9 of 18
I
SB3
Automatic CE
Power-down
Current—CMOS Inputs
V
DD
= Max, Device Deselected, or
V
IN
0.3V or V
IN
> V
DDQ
– 0.3V
f = f
MAX
= 1/t
CYC
4-ns cycle, 250 MHz 105 mA
5-ns cycle, 200 MHz 95 mA
6-ns cycle, 166 MHz 85 mA
7.5-ns cycle, 133 MHz 75 mA
I
SB4
Automatic CE
Power-down
Current—TTL Inputs
V
DD
= Max, Device Deselected,
V
IN
V
IH
or V
IN
V
IL
, f = 0
All Speeds 45 mA
Capacitance
[11]
Parameter Description Test Conditions
TQFP
Package
BGA
Package Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V.
V
DDQ
= 3.3V
55pF
C
CLK
Clock Input Capacitance 5 5 pF
C
I/O
Input/Output Capacitance 5 7 pF
Thermal Resistance
[11]
Parameter Description Test Conditions
TQFP
Package
BGA
Package Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51
30.32 34.1 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
6.85 14.0 °C/W
AC Test Loads and Waveforms
Note:
11. Tested initially and after any design or process change that may affect these parameters.
Electrical Characteristics Over the Operating Range
[9, 10]
(continued)
Parameter Description Test Conditions Min. Max. Unit
OUTPUT
R = 317
R = 351
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
1 ns
1 ns
(c)
OUTPUT
R = 1667
R = 1538
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
1 ns
1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
OUTPUT
R = 1667
R = 1538
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
1 ns
1 ns
(c)
2.5V I/O Test Load
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CY7C1339G-133AXE

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 4M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
Delivery:
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