CY7C1339G
Document #: 38-05520 Rev. *F Page 16 of 18
Package Diagrams
NOTE:
1. JEDEC STD REF MS-026
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE
3. DIMENSIONS IN MILLIMETERS
BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
0.30±0.08
0.65
20.00±0.10
22.00±0.20
1.40±0.05
12°±1°
1.60 MAX.
0.05 MIN.
0.60±0.15
MIN.
0.25
-7°
(8X)
STAND-OFF
R 0.08 MIN.
TYP.
0.20 MAX.
0.15 MAX.
0.20 MAX.
R 0.08 MIN.
0.20 MAX.
14.00±0.10
16.00±0.20
0.10
SEE DETAIL
A
DETAIL
A
1
100
30
31 50
51
80
81
GAUGE PLANE
1.00 REF.
0.20 MIN.
SEATING PLANE
100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)
51-85050-*B
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CY7C1339G
Document #: 38-05520 Rev. *F Page 17 of 18
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Diagrams (continued)
1.27
20.32
2165437
L
E
A
B
D
C
H
G
F
K
J
U
P
N
M
T
R
12.00
19.50
30° TYP.
2.40 MAX.
A1 CORNER
0.70 REF.
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
A
B
2143657
Ø1.00(3X) REF.
7.62
22.00±0.20
14.00±0.20
1.27
0.60±0.10
C
0.15 C
B
A
0.15(4X)
Ø0.05 M C
Ø0.75±0.15(119X)
Ø0.25MCAB
SEATING PLANE
0.90±0.05
3.81
10.16
0.25 C
0.56
51-85115-*B
119-Ball BGA (14 x 22 x 2.4 mm) (51-85115)
All products and company names mentioned in this document may be the trademarks of their respective holders.
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CY7C1339G
Document #: 38-05520 Rev. *F Page 18 of 18
Document History Page
Document Title: CY7C1339G 4-Mbit (128K x 32) Pipelined Sync SRAM
Document Number: 38-05520
REV. ECN NO. Issue Date
Orig. of
Change Description of Change
** 224368 See ECN RKF New data sheet
*A 288909 See ECN VBL In Ordering Info section, Changed TQFP to PB-free TQFP
Added PB-free BG package
*B 332895 See ECN SYT Modified Address Expansion balls in the pinouts for 100 TQFP and 119 BGA
Package as per JEDEC standards and updated the Pin Definitions accordingly
Modified V
OL,
V
OH
test conditions
Replaced TBDs for Θ
JA
and Θ
JC
to their respective values on the Thermal Resis-
tance table
Updated the Ordering Information by shading and unshading MPNs as per
availability
*C 351194 See ECN PCI Updated Ordering Information Table
*D 366728 See ECN PCI Added V
DD
/V
DDQ
test conditions in DC Table
Modified test condition in note# 10 from V
IH
< V
DD
to
V
IH
<
V
DD
*E 420883 See ECN RXU Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901
North First Street” to “198 Champion Court”
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table
Replaced Package Name column with Package Diagram in the Ordering Infor-
mation table
Replaced Package Diagram of 51-85050 from *A to *B
Added Automotive Range in Operating Range Table
Updated the Ordering Information
*F 480368 See ECN VKN Added the Maximum Rating for Supply Voltage on V
DDQ
Relative to GND.
Updated the Ordering Information table.
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CY7C1339G-133AXIT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 4M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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