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74AUP2G240GD,125
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P26
74AUP2G240
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights rese
rved.
Product data sheet
Rev
. 8 — 24 Janu
ary 2013
18 of 25
NXP Semiconductors
74AUP2G240
Low-power dual inverting buf
fer/line driver; 3-st
ate
Fig 13.
Package
outline SOT996-2 (XSON8
)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT996-2
sot996-2_po
07-12-21
12-11-20
Unit
(1)
mm
max
nom
min
0.5
0.05
0.00
2.1
1.9
3.1
2.9
0.5
0.3
0.15
0.05
0.6
0.4
0.5
1.5
0.05
A
Dimensions (mm are the original dimensions)
XSON8: plastic extremely thin small outline package; no leads;
8 terminals; body 3 x 2 x 0.5 mm
SOT996-2
A
1
b
0.35
0.15
DE
e
e
1
LL
1
L
2
v
0.1
wy
0.05
y
1
0.1
0
1
2 mm
scale
C
y
C
y
1
X
terminal 1
index area
B
A
D
E
detail X
A
A
1
b
14
85
e
1
e
A
C
B
v
C
w
L
2
L
1
L
74AUP2G240
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights rese
rved.
Product data sheet
Rev
. 8 — 24 Janu
ary 2013
19 of 25
NXP Semiconductors
74AUP2G240
Low-power dual inverting buf
fer/line driver; 3-st
ate
Fig 14.
Package
outline SOT902-2 (XQF
N8)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEIT
A
SOT902-2
- - -
MO-255
- - -
sot902-2_po
10-1
1-02
1
1-03-31
Unit
(1)
mm
max
nom
min
0.5
0.05
0.00
1.65
1.60
1.55
1.65
1.60
1.55
0.55
0.5
0.15
0.10
0.05
0.1
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-2
A
1
b
0.25
0.20
0.15
DE
e
e
1
L
0.35
0.30
0.25
L
1
vw
0.05
yy
1
0.05
0
1
2 mm
scale
terminal 1
index area
B
A
D
E
X
C
y
C
y
1
terminal 1
index area
3
L
L
1
b
e
1
e
A
C
B
v
C
w
2
1
5
6
7
metal area
not for soldering
8
4
A
1
A
detail X
74AUP2G240
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights rese
rved.
Product data sheet
Rev
. 8 — 24 Janu
ary 2013
20 of 25
NXP Semiconductors
74AUP2G240
Low-power dual inverting buf
fer/line driver; 3-st
ate
Fig 15.
Package
outline SOT1
1
16 (XSON8)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1116
sot1116_po
10-04-02
10-04-07
Unit
mm
max
nom
min
0.35
0.04
1.25
1.20
1.15
1.05
1.00
0.95
0.55
0.3
0.40
0.35
0.32
A
(1)
Dimensions
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.0 x 0.35 mm
SOT1116
A
1
b
0.20
0.15
0.12
DE
e
e
1
L
0.35
0.30
0.27
L
1
0
0.5
1 mm
scale
terminal 1
index area
E
D
(4
×
)
(2)
(8
×
)
(2)
A
1
A
e
1
e
1
e
1
e
L
L
1
b
4
3
2
1
5
6
7
8
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P26
74AUP2G240GD,125
Mfr. #:
Buy 74AUP2G240GD,125
Manufacturer:
Nexperia
Description:
Buffers & Line Drivers LOW-PWR DUAL INV BUFF/LINE DRVR 3-S
Lifecycle:
New from this manufacturer.
Delivery:
DHL
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Ups
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EMS
Payment:
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