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SSESD11B5.0ST5G

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The following is taken from Application Note
AND8398/D − Board Level Application Note for 0201
DSN2 Package.
Printed Circuit Board Solder Pad Design
Based on results of board mount testing, ON
Semiconductor’s recommended mounting pads and solder
mask opening are shown in Figure 6. Maximum acceptable
PCB mounting pads and solder mask opening are shown in
Figure 7.
Figure 6. Recommended Mounting Pattern
Figure 7. Maximum Recommended Mounting
Solder Mask
Two types of PCB solder mask openings commonly used
for surface mount leadless style packages are:
1. Non Solder Masked Defined (NSMD)
2. Solder Masked Defined (SMD)
The solder mask is pulled away from the solderable
metallization for NSMD pads, while the solder mask
overlaps the edge of the metallization for SMD pads as
shown in Figure 8. For SMD pads, the solder mask restricts
the flow of solder paste on the top of the metallization and
prevents the solder from flowing down the side of the metal
pad. This is different from the NSMD configuration where
the solder flows both across the top and down the sides of the
PCB metallization.
NSMD
SMD
Figure 8. Comparison of NSMD vs. SMD Pads
Solder Mask Openings
Solder
Mask
Overlay
Solderable
PCB
Typically, NSMD pads are preferred over SMD pads. It is
easier to define and control the location and size of copper
pad verses the solder mask opening. This is because the
copper etch process capability has a tighter tolerance than
that of the solder mask process. NSMD pads also allow for
easier visual inspection of the solder fillet.
Many PCB designs include a solder mask web between
mounting pads to prevent solder bridging. For this package,
testing has shown that the solder mask web can cause
package tilting during the board mount process. Thus, a
solder mask web is not recommended.
PCB Solderable Metallization
There are currently three common solderable coatings
which are used for PCB surface mount devices- OSP,
ENiAu, and HASL.
The first coating consists of an Organic Solderability
Protectant (OSP) applied over the bare copper features. OSP
coating assists in reducing oxidation in order to preserve the
copper metallization for soldering. It allows for multiple
passes through reflow ovens without degradation of
solderability. The OSP coating is dissolved by the flux when
solder paste is applied to the metal features. Coating
thickness recommended by OSP manufacturers is between
0.25 and 0.35 microns.
The second coating is plated electroless nickel/immersion
gold over the copper pad. The thickness of the electroless
nickel layer is determined by the allowable internal material
stresses and the temperature excursions the board will be
subjected to throughout its lifetime. Even though the gold
metallization is typically a self-limiting process, the
thickness should be at least 0.05 mm thick, but not consist of
more than 5% of the overall solder volume. Excessive gold
in the solder joint can create gold embrittlement. This may
affect the reliability of the joint.
The third is a tin-lead coating, commonly called Hot Air
Solder Level (HASL). This type of PCB pad finish is not
recommended for this type packages. The major issue is the
inability to consistently control the amount of solder coating
applied to each pad. This results in dome-shaped pads of
various heights. As the industry moves to finer and finer
pitch, solder bridging between mounting pads becomes a
common problem when using this coating.
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It is imperative that the coating is conformal, uniform, and
free of impurities to insure a consistent mounting process.
Due to the package’s extremely small size, we only
recommend the use of the electroless nickel/ immersion gold
metallization over the copper pads.
PCB Circuit Trace Width
The width of the PCB circuit trace plays an important role
in the reduction of component tilting when the solder is
reflowed. A solderable circuit trace allows the solder to wick
or run down the trace, reducing the overall thickness of the
solder on the PCB and under the component. Due to the
small nature of the solder pad and component, the solder on
the PCB will tend to form a bump causing the component to
slide down the side of that solder bump resulting in a tilted
component on the PCB. Allowing the solder to wick or run
down the PCB circuit trace, will reduce the solder thickness
and in turn prevent the solder from forming a ball on the PCB
pad. This was observed during ON Semiconductor board
mounting evaluations. The best results to prevent tilting
used a PCB circuit trace equal to the width of the mounting
pad. The length of the solder wicking or run out is controlled
by the solder mask opening.
Solder Type
Solder pastes such as Cookson Electronics’ WS3060 with
a Type 4 or smaller sphere size are recommended. WS3060
has a water-soluble flux for cleaning. Cookson Electronics’
PNC0106A can be used if a no-clean flux is preferred.
Solder Stencil Screening
Stencil screening of the solder paste onto the PCB is
commonly used in the industry. The recommended stencil
thickness for this part is 0.1 mm (0.004 in). The sidewalls of
the stencil openings should be tapered approximately five
degrees along with an electro-polish finish to aid in the
release of the paste when the stencil is removed from the
PCB. See Figure 9 for the recommended stencil opening size
and pitch shown on the recommended PCB mounting pads
and solder mask opening from Figure 6.
Figure 9. Recommended Stencil Pattern.
A second stencil option is shown in Figure 10. This option
increases the amount of solder paste applied to the PCB
through the stencil. This second option increases the stencil
opening size and pitch. The PCB mounting pads and solder
mask opening on the board do not change from the
recommendations in Figure 6.
Figure 10. Maximum Stencil Pattern
Note: If the maximum stencil opening option from
Figure 10 is used, tilt may occur on some of the packages.
This was evident in the board mounting study we conducted.
The stencil with the largest openings may improve solder
release from the stencil along with slightly increasing the
package shear strength.
Package Placement
Due to the small package size and because the pads are on
the underside of the package, an automated pick and place
procedure with magnification is recommended. A dual
image optical system where the underside of the package can
be aligned to the PCB should be used. Pick and place
equipment with a standard tolerance of +/- 0.05 mm (0.002
in) or better is recommended. The package self aligns during
the reflow process due to the surface tension of the solder.
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PACKAGE DIMENSIONS
DSN2, 0.6x0.3, 0.4P, (0201)
CASE 152AA
ISSUE A
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.75
0.28
0.30
0.28
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
XXXX
YYY
JAN
XXXX
Y09
YEAR CODE
DEVICE CODE
FEB
MAR
SEP
DEC
JUN
OCTNOV
INDICATES AUG 2009
(EXAMPLE)
CATHODE BAND MONTH CODING
See Application Note AND8398/D for more mounting details
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
B
E
D
BOTTOM VIEW
b
e
2X
0.05 BAC
L2X
2X
0.06 C
TOP VIEW
2X
0.06 C
2X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
DIM MIN MAX
MILLIMETERS
A 0.24 0.30
A1 0.00 0.01
b 0.20 0.22
D 0.30 BSC
E 0.60 BSC
e 0.40 BSC
L 0.10 0.12
2
1
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
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SSESD11B5.0ST5G

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TVS Diodes - Transient Voltage Suppressors ESD11B WITH LAMINATE
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