LTM8058
18
8058fa
For more information www.linear.com/LTM8058
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
H
G
F
E
D
C
B
A
1234567
PIN 1
BGA 38 1212 REV A
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
Øb (38 PLACES)
DETAIL B
SUBSTRATE
0.27 – 0.37
3.95 – 4.05
// bbb Z
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
NOM
4.92
0.60
4.32
0.75
0.63
11.25
9.0
1.27
8.89
7.62
MAX
5.12
0.70
4.42
0.90
0.66
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 38
A2
D
E
e
b
F
G
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
0.635
1.905
0.635
3.175
1.905
4.445
3.175
4.445
3.810
2.540
1.270
3.810
2.540
1.270
0.3175
0.3175
0.000
4.1275
4.7625
LTMXXXXXX
µModule
BGA Package
38-Lead (11.25mm × 9.00mm × 4.92mm)
(Reference LTC DWG # 05-08-1925 Rev A)
7
SEE NOTES
