HMC606LC5TR Datasheet HMC606LC5TR, HMC606LC5, HMC606LC5TR-R5 | P4-P6

Data Sheet HMC606LC5

Rev. F | Page 3 of 9

SPECIFICATIONS

ELECTRICAL SPECIFICATIONS

T

A

= 25°C, V

CC

1 = V

CC

2 = 5 V, unless otherwise noted.

Table 1.

Parameter Min Typ Max Unit

FREQUENCY RANGE 2 12 GHz

GAIN 10.5 13.5 dB

Flatness ±1.0 dB

Variation Over Temperature 0.021 dB/°C

NOISE FIGURE 5 dB

INPUT RETURN LOSS 20 dB

OUTPUT

Return Loss 15 dB

Power for 1 dB Compression (P1dB)

12

15

dBm

Saturated Power (P

SAT

) 17 dBm

Third-Order Intercept (IP3) 27 dBm

PHASE NOISE

At 100 Hz −140 dBc/Hz

At 1 kHz −150 dBc/Hz

At 10 kHz −160 dBc/Hz

At 1 MHz −170 dBc/Hz

SUPPLY CURRENT 64 95 mA

Table 2.

Parameter Min Typ Max Unit

FREQUENCY RANGE 2 18 GHz

GAIN 9.5 12.5 dB

Flatness ±1.0 dB

Variation Over Temperature 0.024 dB/°C

NOISE FIGURE 7 dB

INPUT RETURN LOSS 18 dB

OUTPUT

Return Loss 15 dB

Power for 1 dB Compression (P1dB) 10 13 dBm

Saturated Power (P

SAT

) 15 dBm

Third-Order Intercept (IP3) 22 dBm

PHASE NOISE

At 100 Hz −140 dBc/Hz

At 1 kHz −150 dBc/Hz

At 10 kHz −160 dBc/Hz

At 1 MHz −170 dBc/Hz

SUPPLY CURRENT 64 95 mA

Table 3. V

CC

1, V

CC

2 vs. Typical Supply Current

V

CC

1, V

CC

2 (V) I

CC

1 + I

CC

2 (mA)

4.5 53

5.0 64

5.5 71

HMC606LC5 Data Sheet

Rev. F | Page 4 of 9

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter Rating

V

CC

1 = V

CC

2 7 V

RF Input Power (RFIN)

15 dBm

Channel Temperature 175°C

Continuous Power Dissipation, P

DISS

(T

A

=

85°C, Derate 6 mW/°C Above 85°C)

0.55 W

Maximum Peak Reflow Temperature (MSL3)

1

260°C

Thermal Resistance (Channel to Ground

Paddle)

92°C/W

Storage Temperature Range −65°C to +150°C

Operating Temperature Range −40°C to +85°C

ESD Sensitivity (Human Body Model, HBM) Class 0, Pass 100 V

1

See the Ordering Guide section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

ESD CAUTION

Data Sheet HMC606LC5

Rev. F | Page 5 of 9

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

17

1

3

4

2

9

NC

V

CC

1

NC

GND

5

6

RFIN

GND

7

NC

8

NC

18

NC

19

NC

20

GND

21

RFOUT

22

GND

23

NC

24

NC

12

NC

11

NC

10

NC

13

NC

14

NC

15

NC

16

V

CC

2

25

NC

26

NC

27

NC

28

NC

29

NC

30

NC

31

NC

32

NC

HMC606LC5

TOP VIEW

(Not to Scale)

GND

PACKAGE

BASE

14968-020

NOTES

1. NC = NO CONNECT. THESE PINS MAY BE CONNECTED TO RF

GROUND. PERFORMANCE WILL NOT BE AFFECTED.

2. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND.

Figure 2. Pin Configuration

Table 5. Pin Function Descriptions

Pin No. Mnemonic Description

1, 3, 7 to 15, 17 to 19, 23 to 32 NC No Connect. These pins may be connected to RF ground. Performance will not be affected.

2, 16 V

CC

1, V

CC

2 Power Supply Voltages for the Amplifier. See Figure 3 for the interface schematic.

4, 6, 20, 22 GND

Ground. These pins must be connected to RF/dc ground. See Figure 4 for the interface

schematic.

5 RFIN

RF Input. This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface

schematic.

21 RFOUT

RF Output. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface

schematic.

EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.

INTERFACE SCHEMATICS

V

CC

1, V

CC

2

14968-002

Figure 3. V

CC

1, V

CC

2 Interface Schematic

GND

14968-003

Figure 4. GND Interface Schematic

RFIN

14968-004

Figure 5. RFIN Interface Schematic

RFOUT

14968-005

Figure 6. RFOUT Interface Schematic

HMC606LC5TR

HMC606LC5TR

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