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ADP3333ARMZ-2.77R7

P1-P3P4-P6P7-P9P10-P12P13-P13
ADP3333
Rev. B | Page 3 of 12
SPECIFICATIONS
V
IN
= 6.0 V, C
IN
= C
OUT
= 1.0 µF, T
J
= −40°C to +125°C, unless otherwise noted.
Table 1.
Parameter
1
Symbol Condition Min Typ Max Unit
OUTPUT
Voltage Accuracy
2
V
OUT
V
IN
= V
OUTNOM
+ 0.3 V to 12 V, I
L
= 0.1 mA to 300 mA, T
J
= 25°C −0.8 +0.8 %
V
IN
= V
OUTNOM
+ 0.3 V to 12 V, I
L
= 0.1 mA to 300 mA −1.8 +1.8 %
Line Regulation
2
ΔV
IN
/ΔV
OUT
V
IN
= V
OUTNOM
+ 0.3 V to 12 V, T
J
= 25°C 0.04 mV/V
Load Regulation ΔV
OUT
/ΔI
OUT
I
L
= 0.1 mA to 300 mA, T
J
= 25°C 0.04 mV/mA
Dropout Voltage V
DROPOUT
V
OUT
= 98% of V
OUTNOM
I
L
= 300 mA 140 230 mV
I
L
= 200 mA 105 185 mV
I
L
= 0.1 mA 30 mV
Peak Load Current I
LDPK
V
IN
= V
OUTNOM
+ 1 V 600 mA
Output Noise V
NOISE
f = 10 Hz to 100 kHz, C
L
= 10 μF, I
L
= 300 mA 45 μV rms
GROUND CURRENT
In Regulation I
GND
I
L
= 300 mA 2.0 5.5 mA
I
L
= 300 mA, T
J
= 25°C 2.0 4.3 mA
I
L
= 300 mA, T
J
= 85°C 1.5 3.3 mA
I
L
= 200 mA 1.4 mA
I
L
= 10 mA 200 275 μA
I
L
= 0.1 mA 70 100 μA
In Dropout I
GND
V
IN
= V
OUTNOM
− 100 mV, I
L
= 0.1 mA 70 190 μA
V
IN
= V
OUTNOM
− 100 mV, I
L
= 0.1 mA, T
J
= 0°C to 125°C 70 160 μA
In Shutdown I
GNDSD
SD
= 0 V, V
IN
= 12 V 0.01 1 μA
SHUTDOWN
Threshold Voltage
V
THSD
Regulator on
2.0 V
Regulator off 0.4 V
SD
I Input Current
SD
0 ≤
SD
≤ 12 V 0.85 7 μA
0 ≤
SD
≤ 5 V 0.8 4.5 μA
Output Current in Shutdown I
OSD
T
J
= 25°C, V
IN
= 12 V 0.01 1 μA
T
J
= 125°C, V
IN
= 12 V 0.01 1 μA
1
Application stable with no load.
2
V
IN
= 2.6 V for models with V
OUTNOM
≤ 2.3 V.
ADP3333
Rev. B | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Input Supply Voltage −0.3 V to +16 V
Shutdown Input Voltage −0.3 V to +16 V
Power Dissipation Internally Limited
Operating Ambient Temperature Range −40°C to +85°C
Operating Junction Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
8-Lead MSOP (4-Layer) 158 °C/W
8-Lead MSOP (2-Layer) 220 °C/W
ESD CAUTION
ADP3333
Rev. B | Page 5 of 12
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 OUT Output of the Regulator. Bypass to ground with a 1.0 μF or larger capacitor.
2 IN Input Pin. Bypass to ground with a 1.0 μF or larger capacitor.
3 GND Ground Pin.
4 to 6, 8 NC No Connect. Best thermal performance is achieved when the NC pins are connected to the GND plane.
7
SD
Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used,
connect this pin to the IN pin.
P1-P3P4-P6P7-P9P10-P12P13-P13

ADP3333ARMZ-2.77R7

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